Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
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This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,965 total.
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- Samsung electronics co., ltd. (20240266271). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240266272). INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER simplified abstract
- Samsung electronics co., ltd. (20240266307). METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240266308). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240266309). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240266317). SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240268129). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240268130). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240268133). MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274499). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240274540). INTEGRATED CIRCUIT CHIP INCLUDING GATE ELECTRODE WITH OBLIQUE CUT SURFACE, AND MANUFACTURING METHOD OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274553). INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274556). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274574). CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM simplified abstract
- Samsung electronics co., ltd. (20240274579). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240274581). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240274582). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240274588). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240274773). DISPLAY PANEL MANUFACTURING METHOD simplified abstract
- Samsung electronics co., ltd. (20240282672). SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT simplified abstract
- Samsung electronics co., ltd. (20240282750). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240282753). DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECOND STRUCTURE HAVING GATE LAYERS simplified abstract
- Samsung electronics co., ltd. (20240284673). MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240284686). INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290669). SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290677). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290702). INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290720). INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240290738). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240290739). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240290750). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240290751). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240290756). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240292634). MEMORY DEVICE WITH INTERPLANE PAD PART simplified abstract
- Samsung electronics co., ltd. (20240292708). SEMICONDUCTOR DEVICE FOR VIDEO TRANSMISSION DISPLAY simplified abstract
- Samsung electronics co., ltd. (20240293884). SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract
- Samsung electronics co., ltd. (20240297122). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240297139). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240297141). SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240297150). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240304504). SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP simplified abstract
- Samsung electronics co., ltd. (20240304557). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240304568). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240304599). SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240306402). SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240306404). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240312858). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312886). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240312920). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240312923). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240312935). BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312937). SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312938). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240312959). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240312974). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240315055). MEMORY PACKAGE EXPANSION simplified abstract
- Samsung electronics co., ltd. (20240319454). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240319761). SEMICONDUCTOR DEVICE PERFORMING CLOCK GATING AND OPERATING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240321361). MEMORY DEVICE WITH IMPROVED PROGRAM PERFORMANCE AND METHOD OF OPERATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321666). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- Samsung electronics co., ltd. (20240321669). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321673). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321682). HEAT DISSIPATION STRUCTURES simplified abstract
- Samsung electronics co., ltd. (20240321683). SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF simplified abstract
- Samsung electronics co., ltd. (20240321700). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract
- Samsung electronics co., ltd. (20240321708). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321712). CHIP-ON-FILM PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321713). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321715). PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321728). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321744). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321753). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321774). SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240321775). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321776). SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240321788). PAD AND PACKAGE INCLUDING SAME simplified abstract
- Samsung electronics co., ltd. (20240321792). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321794). SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP simplified abstract
- Samsung electronics co., ltd. (20240321799). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321804). SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321805). WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321815). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321823). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321826). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321831). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321839). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321840). THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321841). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321842). PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321847). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321857). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240324094). PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240331782). NONVOLATILE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332150). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240332157). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240332221). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240332228). SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332245). DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP simplified abstract
- Samsung electronics co., ltd. (20240332253). SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332255). SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332256). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240332268). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332270). SEMICONDUCTOR PACKAGE WITH DECOUPLING CAPACITOR AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240334699). THREE-DIMENSIONAL MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240334716). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- Seiko epson corporation (20240312943). Channel Manufacturing Method simplified abstract
- SEIKO EPSON CORPORATION patent applications on September 19th, 2024
- Semiconductor energy laboratory co., ltd. (20240266378). IMAGING DEVICE AND ELECTRONIC DEVICE simplified abstract
- Semiconductor Energy Laboratory Co., Ltd. patent applications on August 8th, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. patent applications on January 25th, 2024
- Sk hynix inc. (20240119996). MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract
- Sk hynix inc. (20240120292). STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT simplified abstract
- Sk hynix inc. (20240159823). SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract
- Sk hynix inc. (20240162148). SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Sk hynix inc. (20240162176). SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract
- Sk hynix inc. (20240178169). SEMICONDUCTOR DEVICE INCLUDING BONDING PAD simplified abstract
- Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract
- Sk hynix inc. (20240179918). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract
- Sk hynix inc. (20240243081). SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICATING THE SAME simplified abstract
- Sk hynix inc. (20240243152). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Sk hynix inc. (20240249765). BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract
- Sk hynix inc. (20240266339). SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Sk hynix inc. (20240282756). SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract
- Sk hynix inc. (20240304467). METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM simplified abstract
- Sk hynix inc. (20240312509). BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE simplified abstract
- Sk hynix inc. (20240321710). SEMICONDUCTOR PACKAGE HAVING COMPENSATED ELECTRICAL CHANNEL PATHS simplified abstract
- Sk hynix inc. (20240324202). MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE simplified abstract
- SK hynix Inc. patent applications on April 11th, 2024
- SK hynix Inc. patent applications on August 22nd, 2024
- SK hynix Inc. patent applications on August 8th, 2024
- SK hynix Inc. patent applications on January 18th, 2024
- SK hynix Inc. patent applications on July 18th, 2024
- SK hynix Inc. patent applications on July 25th, 2024
- SK hynix Inc. patent applications on May 16th, 2024
- SK hynix Inc. patent applications on May 30th, 2024
- SK hynix Inc. patent applications on September 12th, 2024
- SK hynix Inc. patent applications on September 19th, 2024
- SK hynix Inc. patent applications on September 26th, 2024
- Sony group corporation (20240321927). IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE simplified abstract
- Sony Group Corporation patent applications on September 26th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240094282). CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096642). METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096647). HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096722). Fan-Out Stacked Package and Methods of Making the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096732). SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096760). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096781). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096787). SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096805). SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096811). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096812). Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096816). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096827). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096837). PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract