Category:H01L21/768
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Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- Subgroup H01L21/768: Processes or apparatus for applying a liquid or other fluent material to semiconductor wafers
This classification involves processes or apparatuses specifically adapted for manufacturing semiconductor devices, focusing on the application of liquids or other fluent materials to semiconductor wafers, crucial in the production of modern electronic components.
Pages in category "H01L21/768"
The following 200 pages are in this category, out of 1,447 total.
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- International business machines corporation (20240213087). ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS simplified abstract
- International business machines corporation (20240213092). OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC simplified abstract
- International business machines corporation (20240222278). GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES simplified abstract
- International business machines corporation (20240222448). MIDDLE OF THE LINE ARCHITECTURE WITH SUBTRACTIVE SOURCE/DRAIN CONTACT simplified abstract
- International business machines corporation (20240234248). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract
- International business machines corporation (20240234297). VIA STRUCTURE WITHOUT LINER INTERFACE simplified abstract
- International business machines corporation (20240234306). SELF-ALIGNED ZERO TRACK SKIP simplified abstract
- International business machines corporation (20240234317). Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device simplified abstract
- International business machines corporation (20240234318). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract
- International business machines corporation (20240243062). HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract
- International business machines corporation (20240282630). SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE simplified abstract
- International business machines corporation (20240282704). SUBTRACTIVE METAL VIA WITH METAL BRIDGE simplified abstract
- International business machines corporation (20240290657). SELF-ALIGNED CONTACT BASED VIA TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240290688). SUPER VIA WITHIN BACKSIDE LEVEL simplified abstract
- International business machines corporation (20240290713). PASS-THROUGH WIRING IN NOTCHED INTERCONNECT simplified abstract
- International business machines corporation (20240297167). SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES simplified abstract
- International business machines corporation (20240304519). FRONTSIDE TO BACKSIDE SIGNAL VIA IN EDGE CELL simplified abstract
- International business machines corporation (20240304546). LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE simplified abstract
- International business machines corporation (20240304547). WIRING STRUCTURE FOR ADVANCED INTERCONNECT simplified abstract
- International business machines corporation (20240312834). AIR GAP IN BEOL INTERCONNECT simplified abstract
- International business machines corporation (20240312839). FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH simplified abstract
- International business machines corporation (20240321587). SELF-ALIGNED LITHO-ETCH-LITHO-ETCH MANDREL CUT PROCESS FOR ADVANCED FINFET INTERCONNECT simplified abstract
- International business machines corporation (20240321630). TOP VIA INTERCONNECT simplified abstract
- International business machines corporation (20240321959). BACKSIDE CONTACT FORMATION simplified abstract
- International business machines corporation (20240332074). METAL WIRES WITH EXPANDED SIDEWALLS simplified abstract
- International business machines corporation (20240332130). HIGH DENSITY VERTICAL INTERCONNECT simplified abstract
- International business machines corporation (20240332165). OFFSET VIA FORMATION FOR FLEXIBLE ROUTING simplified abstract
- International business machines corporation (20240332239). HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY simplified abstract
- International business machines corporation (20240332293). GATE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract
- International Business Machines Corporation patent applications on April 18th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on April 25th, 2024
- International Business Machines Corporation patent applications on April 4th, 2024
- International Business Machines Corporation patent applications on August 22nd, 2024
- International Business Machines Corporation patent applications on August 29th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 1st, 2024
- International Business Machines Corporation patent applications on February 29th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 11th, 2024
- International Business Machines Corporation patent applications on July 18th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 4th, 2024
- International Business Machines Corporation patent applications on June 13th, 2024
- International Business Machines Corporation patent applications on June 20th, 2024
- International Business Machines Corporation patent applications on June 27th, 2024
- International Business Machines Corporation patent applications on June 6th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
- International Business Machines Corporation patent applications on March 21st, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 28th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 16th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024
- International Business Machines Corporation patent applications on October 3rd, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 12th, 2024
- International Business Machines Corporation patent applications on September 19th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 26th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 5th, 2024
K
- Kabushiki kaisha toshiba (20240096702). SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS simplified abstract
- KABUSHIKI KAISHA TOSHIBA patent applications on March 21st, 2024
- Kioxia corporation (20240096644). PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240096690). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240324217). MEMORY DEVICE simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
- Kioxia Corporation patent applications on September 26th, 2024
M
- Micron technology, inc. (20240128207). NAND FLASH BLOCK ARCHITECTURE ENHANCEMENT TO PREVENT BLOCK LIFTING simplified abstract
- Micron technology, inc. (20240162154). SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract
- Micron technology, inc. (20240162156). REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY simplified abstract
- Micron technology, inc. (20240178272). SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract
- Micron technology, inc. (20240186239). MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS simplified abstract
- Micron technology, inc. (20240194529). APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS simplified abstract
- Micron technology, inc. (20240203791). Integrated Circuitry, A Memory Array Comprising Strings Of Memory Cells, A Method Used In Forming A Conductive Via, A Method Used In Forming A Memory Array Comprising Strings Of Memory Cells simplified abstract
- Micron technology, inc. (20240222268). SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract
- Micron technology, inc. (20240224825). LOW RESISTANCE CROSSPOINT ARCHITECTURE simplified abstract
- Micron technology, inc. (20240237365). METHOD FOR MANUFACTURING A MEMORY DEVICE AND MEMORY DEVICE MANUFACTURED THROUGH THE SAME METHOD simplified abstract
- Micron technology, inc. (20240250033). METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract
- Micron technology, inc. (20240258167). METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYSTEMS simplified abstract
- Micron technology, inc. (20240258233). STAIRCASE LANDING PADS VIA RIVETS simplified abstract
- Micron technology, inc. (20240258243). STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES simplified abstract
- Micron technology, inc. (20240266213). Semiconductor Device and Method of Forming the Same simplified abstract
- Micron technology, inc. (20240282620). SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT simplified abstract
- Micron technology, inc. (20240292623). METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20240297068). Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material simplified abstract
- Micron technology, inc. (20240315018). Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract
- Micron technology, inc. (20240321745). MEMORY DEVICES INCLUDING SLOT STRUCTURES simplified abstract
- Micron technology, inc. (20240322049). HIGH VOLTAGE DIODES FOR WAFER ON WAFER PACKAGING OF SEMICONDUCTOR DEVICE simplified abstract
- Micron technology, inc. (20240339357). METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING VOIDS NEIGHBORING CONDUCTIVE CONTACTS, AND RELATED ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20240339360). MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES simplified abstract
- Micron technology, inc. (20240347418). MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER simplified abstract
- Micron technology, inc. (20240347464). METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract
- Micron technology, inc. (20240347511). THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron Technology, Inc. patent applications on April 18th, 2024
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on August 22nd, 2024
- Micron Technology, Inc. patent applications on August 29th, 2024
- Micron Technology, Inc. patent applications on August 8th, 2024
- Micron Technology, Inc. patent applications on February 15th, 2024
- Micron Technology, Inc. patent applications on February 1st, 2024
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on July 25th, 2024
- MICRON TECHNOLOGY, INC. patent applications on July 4th, 2024
- Micron Technology, Inc. patent applications on June 13th, 2024
- Micron Technology, Inc. patent applications on June 20th, 2024
- Micron Technology, Inc. patent applications on June 6th, 2024
- Micron Technology, Inc. patent applications on March 14th, 2024
- Micron Technology, Inc. patent applications on May 16th, 2024
- Micron Technology, Inc. patent applications on May 30th, 2024
- Micron Technology, Inc. patent applications on October 10th, 2024
- Micron Technology, Inc. patent applications on October 17th, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
- Micron Technology, Inc. patent applications on September 26th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
- Mitsubishi electric corporation (20240312915). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Mitsubishi electric corporation (20240321750). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on September 19th, 2024
- Mitsubishi Electric Corporation patent applications on September 26th, 2024
N
- Nanya technology corporation (20240347378). METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARIZATION AND SEMICONDUCTOR STRUCTURE THEREOF simplified abstract
- Nanya technology corporation (20240347379). METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARIZATION AND SEMICONDUCTOR STRUCTURE THEREOF simplified abstract
- Nanya technology corporation (20240347444). CONDUCTIVE STRUCTURE AND CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Nanya technology corporation (20240347448). METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT AND SEMICONDUCTOR STRUCTURE THEREOF simplified abstract
- Nanya technology corporation (20240347449). METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT simplified abstract
- Nanya technology corporation (20240347450). SEMICONDUCTOR DEVICE WITH ASSISTING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract
- Nanya technology corporation (20240347451). INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Nanya technology corporation (20240347453). SEMICONDUCTOR DEVICE WITH ASSISTING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract
- Nanya technology corporation (20240347454). INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Nanya technology corporation (20240347461). SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF simplified abstract
- NANYA TECHNOLOGY CORPORATION patent applications on February 8th, 2024
- NANYA TECHNOLOGY CORPORATION patent applications on October 17th, 2024
- Nvidia corporation (20240096802). REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract
- Nvidia corporation (20240222213). EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract
- NVIDIA Corporation patent applications on July 4th, 2024
- NVIDIA Corporation patent applications on March 21st, 2024
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- Qualcomm incorporated (20240096698). SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS simplified abstract
- Qualcomm incorporated (20240096750). SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION simplified abstract
- Qualcomm incorporated (20240096790). PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL simplified abstract
- Qualcomm incorporated (20240243036). CAVITY-EMBEDDED TUNABLE FILTER simplified abstract
- Qualcomm incorporated (20240249056). ENGINEERING CHANGE ORDER (ECO) SPARE CELL simplified abstract
- Qualcomm incorporated (20240250009). EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240266217). SELF-ALIGNED SMALL CONTACT STRUCTURE simplified abstract
- Qualcomm incorporated (20240321631). BACK-END-OF-LINE (BEOL) INTERCONNECTS WITH DIFFERENT AIRGAP HEIGHTS AND METAL TRACE CORNER PROTECTION STRUCTURES simplified abstract
- Qualcomm incorporated (20240321965). SELECTIVE CONTACT ON SOURCE AND DRAIN simplified abstract
- QUALCOMM Incorporated patent applications on August 8th, 2024
- QUALCOMM Incorporated patent applications on July 18th, 2024
- QUALCOMM Incorporated patent applications on July 25th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024
- QUALCOMM Incorporated patent applications on September 26th, 2024
- Quantum Computing patent applications on February 29th, 2024
R
- Robert bosch gmbh (20240136407). VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE WITH A STRUCTURED INTERMEDIATE LAYER simplified abstract
- Robert Bosch GmbH patent applications on April 25th, 2024
- Rohm co., ltd. (20240282762). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- ROHM CO., LTD. patent applications on August 22nd, 2024
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- Samsung electronics co., ltd. (20240096796). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240096797). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105604). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240105679). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120196). SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTRODE STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240120279). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240136254). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240178061). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240178131). SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240178138). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240178213). SEMICONDUCTOR DEVICE INCLUDING COMMON BODY BIAS REGION simplified abstract
- Samsung electronics co., ltd. (20240186367). INTEGRATION SCHEME FOR FABRICATING HIGH PRECISION, LOW CAPACITOR WITH UNLANDED VIA simplified abstract
- Samsung electronics co., ltd. (20240194521). METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240194604). MATERIAL FOR METAL LINE IN SEMICONDUCTOR DEVICE, METAL LINE IN SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING METAL LINE IN SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240203788). METHOD OF SELECTIVELY FORMING LAYER USING ATOMIC LAYER DEPOSITION AND METHOD OF FORMING INTERCONNECT OF SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203793). BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING simplified abstract
- Samsung electronics co., ltd. (20240203831). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203855). SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203883). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240203974). INTEGRATED CIRCUITS HAVING CROSS-COUPLE CONSTRUCTS AND SEMICONDUCTOR DEVICES INCLUDING INTEGRATED CIRCUITS simplified abstract
- Samsung electronics co., ltd. (20240213155). SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240213342). SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240215253). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240218511). SUBSTRATE DEGASSING METHOD AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240219824). REFLECTIVE MASK FOR EXTREME ULTRAVIOLET LITHOGRAPHY AND A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240234250). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240234312). INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240234490). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240243010). INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELECTIVELY DEPOSITING THIN FILM simplified abstract
- Samsung electronics co., ltd. (20240244843). SEMICONDUCTOR DEVICE INCLUDING STACK STRUCTURE AND TRENCHES simplified abstract
- Samsung electronics co., ltd. (20240250031). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240258157). WIRING STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258230). SEMICONDUCTOR DEVICES simplified abstract
- Samsung electronics co., ltd. (20240258239). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240266291). MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND METHOD FOR FORMING METAL LINE IN SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240266394). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274509). SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES simplified abstract
- Samsung electronics co., ltd. (20240282800). IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290677). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240297072). SEMI-DAMASCENE STRUCTURE WITH DIELECTRIC HARDMASK LAYER simplified abstract
- Samsung electronics co., ltd. (20240315030). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240321690). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240321732). INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321857). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240324181). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240332059). METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240332185). INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332378). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240339377). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240339378). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240339379). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240339395). SEMICONDUCTOR DEVICE simplified abstract