Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- Qualcomm incorporated (20240258363). INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL simplified abstract
- Qualcomm incorporated (20240258364). WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS simplified abstract
- Qualcomm incorporated (20240276739). DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES simplified abstract
- Qualcomm incorporated (20240282729). PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract
- Qualcomm incorporated (20240297129). INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract
- Qualcomm incorporated (20240297165). DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract
- Qualcomm incorporated (20240319455). PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract
- Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240321763). PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract
- Qualcomm incorporated (20240321849). PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract
- QUALCOMM Incorporated patent applications on August 15th, 2024
- QUALCOMM Incorporated patent applications on August 1st, 2024
- QUALCOMM Incorporated patent applications on August 22nd, 2024
- QUALCOMM Incorporated patent applications on February 15th, 2024
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on February 29th, 2024
- QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated patent applications on July 25th, 2024
- QUALCOMM Incorporated patent applications on June 13th, 2024
- QUALCOMM Incorporated patent applications on June 20th, 2024
- QUALCOMM Incorporated patent applications on March 14th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024
- QUALCOMM Incorporated patent applications on September 26th, 2024
- QUALCOMM Incorporated patent applications on September 5th, 2024
- Quantum Computing patent applications on February 1st, 2024
- Quantum Computing patent applications on February 29th, 2024
- Quantum Computing patent applications on May 16th, 2024
- Quantum Computing patent applications on September 5th, 2024
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- Robert bosch gmbh (20240194576). POWER MODULE FOR A VEHICLE simplified abstract
- Robert bosch gmbh (20240300807). MICROMECHANICAL COMPONENT simplified abstract
- Robert bosch gmbh (20240349429). ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME simplified abstract
- Robert Bosch GmbH patent applications on June 13th, 2024
- Robert Bosch GmbH patent applications on October 17th, 2024
- Robert Bosch GmbH patent applications on September 12th, 2024
- Rohm co., ltd. (20240282593). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282634). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282656). SEMICONDUCTOR MODULE simplified abstract
- Rohm co., ltd. (20240282657). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282675). POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract
- Rohm co., ltd. (20240282676). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282677). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282678). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282682). SEMICONDUCTOR PACKAGE simplified abstract
- Rohm co., ltd. (20240282690). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282692). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282699). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282738). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282748). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282749). SEMICONDUCTOR DEVICE simplified abstract
- ROHM Co., LTD. (20240304591). SEMICONDUCTOR DEVICE FOR AUDIO simplified abstract
- ROHM CO., LTD. patent applications on August 22nd, 2024
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- Samsung display co., ltd. (20240096903). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240107832). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240111194). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240120311). BONDING APPARATUS simplified abstract
- Samsung display co., ltd. (20240122004). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240128224). ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240128250). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240234357). ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240234443). ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract
- Samsung display co., ltd. (20240250037). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240265854). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240282717). CHIP ON FILM PACKAGE simplified abstract
- Samsung display co., ltd. (20240282760). DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung display co., ltd. (20240284594). ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract
- Samsung display co., ltd. (20240290753). DISPLAY DEVICE, AND TILED DISPLAY DEVICE INCLUDING THE DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240313153). PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEVICE USING THE SAME, AND BONDING SYSTEM INCLUDING THE SAME simplified abstract
- Samsung display co., ltd. (20240313171). DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung display co., ltd. (20240321904). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240324344). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240339489). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240347012). ELECTRONIC DEVICE simplified abstract
- Samsung Display Co., Ltd. patent applications on April 11th, 2024
- Samsung Display Co., LTD. patent applications on April 18th, 2024
- Samsung Display Co., LTD. patent applications on April 4th, 2024
- Samsung Display Co., LTD. patent applications on August 22nd, 2024
- Samsung Display Co., LTD. patent applications on August 29th, 2024
- Samsung Display Co., LTD. patent applications on August 8th, 2024
- Samsung Display Co., LTD. patent applications on February 29th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on February 8th, 2024
- Samsung Display Co., LTD. patent applications on January 18th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on January 25th, 2024
- Samsung Display Co., LTD. patent applications on July 11th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on July 25th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung Display Co., Ltd. patent applications on March 28th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on October 10th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on October 17th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on September 19th, 2024
- Samsung Display Co., Ltd. patent applications on September 26th, 2024
- Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- Samsung electronics co., ltd. (20240096420). NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096717). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096728). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240096748). CHIP PROTECTION DEVICE simplified abstract
- Samsung electronics co., ltd. (20240096773). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096777). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096819). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096820). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract
- Samsung electronics co., ltd. (20240096831). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096840). SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096841). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096851). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240098996). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105267). NON-VOLATILE MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240105536). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105556). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240105567). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105636). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105650). SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS simplified abstract
- Samsung electronics co., ltd. (20240105657). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105662). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105679). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105680). SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105689). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105694). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105703). FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240112974). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240112998). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113001). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113057). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113067). SOLDER REFLOW APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240113074). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113077). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240114700). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240120251). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120263). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120280). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120299). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120310). SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120318). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120319). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240121957). SEMICONDUCTOR DEVICES simplified abstract
- Samsung electronics co., ltd. (20240128135). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128155). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128171). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128173). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128174). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128176). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128190). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128195). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128221). SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES simplified abstract
- Samsung electronics co., ltd. (20240128225). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128229). SOLDER REFLOW APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240128230). SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128234). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128236). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128239). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240130144). SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract
- Samsung electronics co., ltd. (20240136231). APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract
- Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240136255). INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136266). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136273). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136307). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136311). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136321). SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract
- Samsung electronics co., ltd. (20240136327). MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136329). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136331). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136334). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240136340). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136341). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240138157). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162104). SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract
- Samsung electronics co., ltd. (20240162111). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract
- Samsung electronics co., ltd. (20240162115). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162127). SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract
- Samsung electronics co., ltd. (20240162132). FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162133). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162135). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162181). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240162184). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162193). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162195). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178114). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178117). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240178122). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178131). SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240178168). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178176). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178181). SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract
- Samsung electronics co., ltd. (20240178188). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178191). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178202). SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178255). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240179910). SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240179925). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186231). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240186277). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186278). MOUNTING DEVICE AND MOUNTING METHOD simplified abstract
- Samsung electronics co., ltd. (20240186282). DIE BONDING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240186289). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186290). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186293). SEMICONDUCTOR PACKAGE HAVING CHIP STACK simplified abstract