Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
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Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,965 total.
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- Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract
- Micron technology, inc. (20240222145). SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS simplified abstract
- Micron technology, inc. (20240222300). SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDING SURFACES, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron technology, inc. (20240222325). SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Micron technology, inc. (20240233836). POWER MANAGEMENT simplified abstract
- Micron technology, inc. (20240237363). TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract
- Micron technology, inc. (20240243077). APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE simplified abstract
- Micron technology, inc. (20240258243). STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES simplified abstract
- Micron technology, inc. (20240258256). ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES AND HAVING IRREGULAR SURFACE TOPOGRAPHY, AND RELATED METHODS AND ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20240258273). SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES simplified abstract
- Micron technology, inc. (20240260281). MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract
- Micron technology, inc. (20240282691). APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS simplified abstract
- Micron technology, inc. (20240282730). INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES simplified abstract
- Micron technology, inc. (20240282731). HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract
- Micron technology, inc. (20240282733). SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME simplified abstract
- Micron technology, inc. (20240282751). SUBSTRATES WITH DOWNSET simplified abstract
- Micron technology, inc. (20240290787). STRING DRIVER WITH THROUGH SILICON ISOLATION simplified abstract
- Micron technology, inc. (20240292623). METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20240297149). STACKED SEMICONDUCTOR DEVICE simplified abstract
- Micron technology, inc. (20240312890). SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS simplified abstract
- Micron technology, inc. (20240313098). TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS simplified abstract
- Micron technology, inc. (20240321822). SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STACK SIGNAL ROUTING simplified abstract
- Micron technology, inc. (20240322049). HIGH VOLTAGE DIODES FOR WAFER ON WAFER PACKAGING OF SEMICONDUCTOR DEVICE simplified abstract
- Micron Technology, Inc. patent applications on April 18th, 2024
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on August 22nd, 2024
- Micron Technology, Inc. patent applications on August 29th, 2024
- Micron Technology, Inc. patent applications on February 15th, 2024
- Micron Technology, Inc. patent applications on February 1st, 2024
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on February 8th, 2024
- MICRON TECHNOLOGY, INC. patent applications on January 25th, 2024
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on July 18th, 2024
- MICRON TECHNOLOGY, INC. patent applications on July 4th, 2024
- Micron Technology, Inc. patent applications on June 13th, 2024
- Micron Technology, Inc. patent applications on June 6th, 2024
- Micron Technology, Inc. patent applications on March 14th, 2024
- Micron Technology, Inc. patent applications on May 16th, 2024
- Micron Technology, Inc. patent applications on May 30th, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
- Micron Technology, Inc. patent applications on September 26th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
- Microsoft Technology Licensing, LLC patent applications on February 29th, 2024
- MICROSOFT TECHNOLOGY LICENSING, LLC patent applications on March 14th, 2024
- Mitsubishi electric corporation (20240136257). POWER SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240136309). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240234260). POWER SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240234271). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240234338). HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract
- Mitsubishi electric corporation (20240234348). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240243030). ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE simplified abstract
- Mitsubishi electric corporation (20240243041). Power Semiconductor Apparatus and Power Conversion Apparatus simplified abstract
- Mitsubishi electric corporation (20240258134). SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract
- Mitsubishi electric corporation (20240258188). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240258254). BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE simplified abstract
- Mitsubishi electric corporation (20240258267). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240266310). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240266315). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240266715). ANTENNA simplified abstract
- Mitsubishi electric corporation (20240282650). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240282664). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240297104). POWER SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240304567). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240304574). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Mitsubishi electric corporation (20240321720). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on April 25th, 2024
- Mitsubishi Electric Corporation patent applications on August 1st, 2024
- Mitsubishi Electric Corporation patent applications on August 22nd, 2024
- Mitsubishi Electric Corporation patent applications on August 8th, 2024
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
- Mitsubishi Electric Corporation patent applications on July 18th, 2024
- Mitsubishi Electric Corporation patent applications on September 12th, 2024
- Mitsubishi Electric Corporation patent applications on September 19th, 2024
- Mitsubishi Electric Corporation patent applications on September 26th, 2024
- Mitsubishi Electric Corporation patent applications on September 5th, 2024
- Murata manufacturing co., ltd. (20240266240). MODULE simplified abstract
- Murata manufacturing co., ltd. (20240297152). MODULE simplified abstract
- Murata manufacturing co., ltd. (20240312856). ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE simplified abstract
- Murata manufacturing co., ltd. (20240321946). INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBERANCE, AND CORRESPONDING METHOD simplified abstract
- Murata manufacturing co., ltd. (20240321975). BIPOLAR TRANSISTOR AND SEMICONDUCTOR simplified abstract
- Murata Manufacturing Co., Ltd. patent applications on August 8th, 2024
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 19th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 26th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 5th, 2024
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- NANYA TECHNOLOGY CORPORATION patent applications on February 8th, 2024
- Nec corporation (20240243082). QUANTUM CHIP, QUANTUM DEVICE, AND QUANTUM COMPUTER simplified abstract
- NEC Corporation patent applications on July 18th, 2024
- Nokia Technologies Oy patent applications on February 15th, 2024
- Nvidia corporation (20240096802). REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract
- Nvidia corporation (20240222213). EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract
- Nvidia corporation (20240250054). BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE simplified abstract
- Nvidia corporation (20240332223). Chip Die Substrate with Edge-Mounted Capacitors simplified abstract
- NVIDIA Corporation patent applications on July 25th, 2024
- NVIDIA Corporation patent applications on July 4th, 2024
- NVIDIA Corporation patent applications on March 21st, 2024
- NVIDIA Corporation patent applications on October 3rd, 2024
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- Qualcomm incorporated (20240096817). ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract
- Qualcomm incorporated (20240096845). CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract
- Qualcomm incorporated (20240105568). PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS simplified abstract
- Qualcomm incorporated (20240105688). PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION simplified abstract
- Qualcomm incorporated (20240194545). METAL POCKET FANOUT PACKAGE simplified abstract
- Qualcomm incorporated (20240203860). PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240203866). INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract
- Qualcomm incorporated (20240203871). INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL simplified abstract
- Qualcomm incorporated (20240203895). THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract
- Qualcomm incorporated (20240203938). INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240250009). EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240258363). INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL simplified abstract
- Qualcomm incorporated (20240258364). WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS simplified abstract
- Qualcomm incorporated (20240276739). DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES simplified abstract
- Qualcomm incorporated (20240282729). PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract
- Qualcomm incorporated (20240297129). INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract
- Qualcomm incorporated (20240297165). DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract
- Qualcomm incorporated (20240319455). PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract
- Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240321763). PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract
- Qualcomm incorporated (20240321849). PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract
- QUALCOMM Incorporated patent applications on August 15th, 2024
- QUALCOMM Incorporated patent applications on August 1st, 2024
- QUALCOMM Incorporated patent applications on August 22nd, 2024
- QUALCOMM Incorporated patent applications on February 15th, 2024
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on February 29th, 2024
- QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated patent applications on July 25th, 2024
- QUALCOMM Incorporated patent applications on June 13th, 2024
- QUALCOMM Incorporated patent applications on June 20th, 2024
- QUALCOMM Incorporated patent applications on March 14th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024
- QUALCOMM Incorporated patent applications on September 26th, 2024
- QUALCOMM Incorporated patent applications on September 5th, 2024
- Quantum Computing patent applications on February 1st, 2024
- Quantum Computing patent applications on February 29th, 2024
- Quantum Computing patent applications on May 16th, 2024
- Quantum Computing patent applications on September 5th, 2024
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- Robert bosch gmbh (20240194576). POWER MODULE FOR A VEHICLE simplified abstract
- Robert bosch gmbh (20240300807). MICROMECHANICAL COMPONENT simplified abstract
- Robert Bosch GmbH patent applications on June 13th, 2024
- Robert Bosch GmbH patent applications on September 12th, 2024
- Rohm co., ltd. (20240282593). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282634). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282656). SEMICONDUCTOR MODULE simplified abstract
- Rohm co., ltd. (20240282657). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282675). POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract
- Rohm co., ltd. (20240282676). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282677). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282678). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282682). SEMICONDUCTOR PACKAGE simplified abstract
- Rohm co., ltd. (20240282690). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282692). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282699). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282738). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282748). SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282749). SEMICONDUCTOR DEVICE simplified abstract
- ROHM Co., LTD. (20240304591). SEMICONDUCTOR DEVICE FOR AUDIO simplified abstract
- ROHM CO., LTD. patent applications on August 22nd, 2024
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- Samsung display co., ltd. (20240096903). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240107832). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240111194). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240120311). BONDING APPARATUS simplified abstract
- Samsung display co., ltd. (20240122004). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240128224). ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240128250). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240234357). ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240234443). ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract
- Samsung display co., ltd. (20240250037). DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240265854). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240282717). CHIP ON FILM PACKAGE simplified abstract
- Samsung display co., ltd. (20240282760). DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung display co., ltd. (20240284594). ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract
- Samsung display co., ltd. (20240290753). DISPLAY DEVICE, AND TILED DISPLAY DEVICE INCLUDING THE DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240313153). PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEVICE USING THE SAME, AND BONDING SYSTEM INCLUDING THE SAME simplified abstract
- Samsung display co., ltd. (20240313171). DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung display co., ltd. (20240321904). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE simplified abstract
- Samsung display co., ltd. (20240324344). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung Display Co., Ltd. patent applications on April 11th, 2024
- Samsung Display Co., LTD. patent applications on April 18th, 2024
- Samsung Display Co., LTD. patent applications on April 4th, 2024
- Samsung Display Co., LTD. patent applications on August 22nd, 2024
- Samsung Display Co., LTD. patent applications on August 29th, 2024
- Samsung Display Co., LTD. patent applications on August 8th, 2024
- Samsung Display Co., LTD. patent applications on February 29th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on February 8th, 2024
- Samsung Display Co., LTD. patent applications on January 18th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on January 25th, 2024
- Samsung Display Co., LTD. patent applications on July 11th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on July 25th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung Display Co., Ltd. patent applications on March 28th, 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on September 19th, 2024
- Samsung Display Co., Ltd. patent applications on September 26th, 2024
- Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- Samsung electronics co., ltd. (20240096420). NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract