Category:H01L21/768
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Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- Subgroup H01L21/768: Processes or apparatus for applying a liquid or other fluent material to semiconductor wafers
This classification involves processes or apparatuses specifically adapted for manufacturing semiconductor devices, focusing on the application of liquids or other fluent materials to semiconductor wafers, crucial in the production of modern electronic components.
Pages in category "H01L21/768"
The following 200 pages are in this category, out of 1,264 total.
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- Infineon Technologies AG patent applications on July 25th, 2024
- Intel corporation (20240105508). INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM simplified abstract
- Intel corporation (20240105520). TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240105584). BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WITH OPTIONAL CYLINDRICAL MIM CAPACITOR simplified abstract
- Intel corporation (20240105588). INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE simplified abstract
- Intel corporation (20240105589). INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED METAL LINES simplified abstract
- Intel corporation (20240105598). DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240112951). INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MATERIALS simplified abstract
- Intel corporation (20240112952). INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES simplified abstract
- Intel corporation (20240113017). PLUG IN A METAL LAYER simplified abstract
- Intel corporation (20240113019). SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240136277). TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF FABRICATION simplified abstract
- Intel corporation (20240162332). TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240178071). DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240186403). DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240203868). SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAYER WITH CUT simplified abstract
- Intel corporation (20240203869). INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES simplified abstract
- Intel corporation (20240204083). DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA simplified abstract
- Intel corporation (20240213328). DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract
- Intel corporation (20240219894). METHODS AND APPARATUS TO DETECT DEFECTS DURING SEMICONDUCTOR CHIP FABRICATION AND/OR TO DEBUG SEMICONDUCTOR CHIPS AFTER FABRICATION simplified abstract
- Intel corporation (20240222130). ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract
- Intel corporation (20240222136). ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract
- Intel corporation (20240222137). ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES simplified abstract
- Intel corporation (20240222270). VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL simplified abstract
- Intel corporation (20240243052). VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240282624). CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract
- Intel corporation (20240282633). GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME simplified abstract
- Intel corporation (20240290651). SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING simplified abstract
- Intel corporation (20240290723). PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT simplified abstract
- Intel corporation (20240304543). SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS simplified abstract
- Intel corporation (20240304549). MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on August 22nd, 2024
- Intel Corporation patent applications on August 29th, 2024
- INTEL CORPORATION patent applications on February 8th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on July 18th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 20th, 2024
- INTEL CORPORATION patent applications on June 20th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on September 12th, 2024
- International business machines corporation (20240096692). HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CONNECTIONS simplified abstract
- International business machines corporation (20240096699). SELF-ALIGNED BACKSIDE CONTACT IN NANOSHEET WITHOUT BDI simplified abstract
- International business machines corporation (20240096752). VIA RESISTANCE TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240096786). SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT simplified abstract
- International business machines corporation (20240096794). VTFET CIRCUIT WITH OPTIMIZED OUTPUT simplified abstract
- International business machines corporation (20240096940). BACKSIDE CMOS TRENCH EPI WITH CLOSE N2P SPACE simplified abstract
- International business machines corporation (20240105506). LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA simplified abstract
- International business machines corporation (20240105583). INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE simplified abstract
- International business machines corporation (20240105590). STACKED FET CONTACT FORMATION simplified abstract
- International business machines corporation (20240105609). HIGH DENSITY BACKSIDE CAPACITOR AND INDUCTOR simplified abstract
- International business machines corporation (20240105612). BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRANSISTORS simplified abstract
- International business machines corporation (20240105788). LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL simplified abstract
- International business machines corporation (20240113013). SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract
- International business machines corporation (20240113018). LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE simplified abstract
- International business machines corporation (20240113023). Self-Aligned Wafer Backside Gate Signal with Airgap simplified abstract
- International business machines corporation (20240113024). MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER simplified abstract
- International business machines corporation (20240113125). POWER GATING DUMMY POWER TRANSISTORS FOR BACK SIDE POWER DELIVERY NETWORKS simplified abstract
- International business machines corporation (20240113200). INNER SPACER RELIABILITY MACRO DESIGN AND WELL CONTACT FORMATION simplified abstract
- International business machines corporation (20240128191). POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240128345). REDUCED GATE TOP CD WITH WRAP-AROUND GATE CONTACT simplified abstract
- International business machines corporation (20240136253). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract
- International business machines corporation (20240136281). SELF-ALIGNED ZERO TRACK SKIP simplified abstract
- International business machines corporation (20240136288). Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device simplified abstract
- International business machines corporation (20240136289). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract
- International business machines corporation (20240162087). MANDREL-PULL-FIRST INTERCONNECT PATTERNING simplified abstract
- International business machines corporation (20240162139). METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract
- International business machines corporation (20240162152). AIRGAP SPACER FOR POWER VIA simplified abstract
- International business machines corporation (20240162229). STACKED FET WITH EXTREMELY SMALL CELL HEIGHT simplified abstract
- International business machines corporation (20240178127). ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract
- International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract
- International business machines corporation (20240186177). ASYMMETRIC SKIP-LEVEL VIA STRUCTURE simplified abstract
- International business machines corporation (20240186242). Wire Structure for Low Resistance Interconnects simplified abstract
- International business machines corporation (20240194528). BACKSIDE DIRECT CONTACT FORMATION simplified abstract
- International business machines corporation (20240194585). SUPER VIA WITH SIDEWALL SPACER simplified abstract
- International business machines corporation (20240194586). SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS simplified abstract
- International business machines corporation (20240194587). Interconnects with Sidewall Barrier Layer Divot Fill simplified abstract
- International business machines corporation (20240194670). ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES simplified abstract
- International business machines corporation (20240203792). SELF-ALIGNED BACKSIDE GATE CONTACTS simplified abstract
- International business machines corporation (20240203867). SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP simplified abstract
- International business machines corporation (20240203870). FLEXIBLE MOL AND/OR BEOL STRUCTURE simplified abstract
- International business machines corporation (20240203878). ENLARGED SHALLOW TRENCH ISOLATION FOR BACKSIDE POWER simplified abstract
- International business machines corporation (20240203879). LOW-RESISTANCE VIA TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240204008). STRUCTURE AND METHOD TO FORM VIA TO BACKSIDE POWER RAIL WITHOUT SHORTING TO GATE TIP simplified abstract
- International business machines corporation (20240213087). ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS simplified abstract
- International business machines corporation (20240213092). OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC simplified abstract
- International business machines corporation (20240222278). GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES simplified abstract
- International business machines corporation (20240222448). MIDDLE OF THE LINE ARCHITECTURE WITH SUBTRACTIVE SOURCE/DRAIN CONTACT simplified abstract
- International business machines corporation (20240234248). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract
- International business machines corporation (20240234297). VIA STRUCTURE WITHOUT LINER INTERFACE simplified abstract
- International business machines corporation (20240234306). SELF-ALIGNED ZERO TRACK SKIP simplified abstract
- International business machines corporation (20240234317). Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device simplified abstract
- International business machines corporation (20240234318). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract
- International business machines corporation (20240243062). HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract
- International business machines corporation (20240282630). SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE simplified abstract
- International business machines corporation (20240282704). SUBTRACTIVE METAL VIA WITH METAL BRIDGE simplified abstract
- International business machines corporation (20240290657). SELF-ALIGNED CONTACT BASED VIA TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240290688). SUPER VIA WITHIN BACKSIDE LEVEL simplified abstract
- International business machines corporation (20240290713). PASS-THROUGH WIRING IN NOTCHED INTERCONNECT simplified abstract
- International business machines corporation (20240297167). SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES simplified abstract
- International business machines corporation (20240304519). FRONTSIDE TO BACKSIDE SIGNAL VIA IN EDGE CELL simplified abstract
- International business machines corporation (20240304546). LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE simplified abstract
- International business machines corporation (20240304547). WIRING STRUCTURE FOR ADVANCED INTERCONNECT simplified abstract
- International business machines corporation (20240312834). AIR GAP IN BEOL INTERCONNECT simplified abstract
- International business machines corporation (20240312839). FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH simplified abstract
- International Business Machines Corporation patent applications on April 18th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on April 25th, 2024
- International Business Machines Corporation patent applications on April 4th, 2024
- International Business Machines Corporation patent applications on August 22nd, 2024
- International Business Machines Corporation patent applications on August 29th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 1st, 2024
- International Business Machines Corporation patent applications on February 29th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 11th, 2024
- International Business Machines Corporation patent applications on July 18th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 4th, 2024
- International Business Machines Corporation patent applications on June 13th, 2024
- International Business Machines Corporation patent applications on June 20th, 2024
- International Business Machines Corporation patent applications on June 27th, 2024
- International Business Machines Corporation patent applications on June 6th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
- International Business Machines Corporation patent applications on March 21st, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 28th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 16th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 12th, 2024
- International Business Machines Corporation patent applications on September 19th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 5th, 2024
K
- Kabushiki kaisha toshiba (20240096702). SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS simplified abstract
- KABUSHIKI KAISHA TOSHIBA patent applications on March 21st, 2024
- Kioxia corporation (20240096644). PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240096690). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
M
- Micron technology, inc. (20240128207). NAND FLASH BLOCK ARCHITECTURE ENHANCEMENT TO PREVENT BLOCK LIFTING simplified abstract
- Micron technology, inc. (20240162154). SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract
- Micron technology, inc. (20240162156). REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY simplified abstract
- Micron technology, inc. (20240178272). SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract
- Micron technology, inc. (20240186239). MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS simplified abstract
- Micron technology, inc. (20240194529). APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS simplified abstract
- Micron technology, inc. (20240203791). Integrated Circuitry, A Memory Array Comprising Strings Of Memory Cells, A Method Used In Forming A Conductive Via, A Method Used In Forming A Memory Array Comprising Strings Of Memory Cells simplified abstract
- Micron technology, inc. (20240222268). SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract
- Micron technology, inc. (20240224825). LOW RESISTANCE CROSSPOINT ARCHITECTURE simplified abstract
- Micron technology, inc. (20240237365). METHOD FOR MANUFACTURING A MEMORY DEVICE AND MEMORY DEVICE MANUFACTURED THROUGH THE SAME METHOD simplified abstract
- Micron technology, inc. (20240250033). METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract
- Micron technology, inc. (20240258167). METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYSTEMS simplified abstract
- Micron technology, inc. (20240258233). STAIRCASE LANDING PADS VIA RIVETS simplified abstract
- Micron technology, inc. (20240258243). STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES simplified abstract
- Micron technology, inc. (20240266213). Semiconductor Device and Method of Forming the Same simplified abstract
- Micron technology, inc. (20240282620). SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT simplified abstract
- Micron technology, inc. (20240292623). METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20240297068). Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material simplified abstract
- Micron technology, inc. (20240315018). Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract
- Micron Technology, Inc. patent applications on April 18th, 2024
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on August 22nd, 2024
- Micron Technology, Inc. patent applications on August 29th, 2024
- Micron Technology, Inc. patent applications on August 8th, 2024
- Micron Technology, Inc. patent applications on February 15th, 2024
- Micron Technology, Inc. patent applications on February 1st, 2024
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on July 25th, 2024
- MICRON TECHNOLOGY, INC. patent applications on July 4th, 2024
- Micron Technology, Inc. patent applications on June 13th, 2024
- Micron Technology, Inc. patent applications on June 20th, 2024
- Micron Technology, Inc. patent applications on June 6th, 2024
- Micron Technology, Inc. patent applications on March 14th, 2024
- Micron Technology, Inc. patent applications on May 16th, 2024
- Micron Technology, Inc. patent applications on May 30th, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
- Mitsubishi electric corporation (20240312915). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Mitsubishi Electric Corporation patent applications on September 19th, 2024
N
- NANYA TECHNOLOGY CORPORATION patent applications on February 8th, 2024
- Nvidia corporation (20240096802). REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract
- Nvidia corporation (20240222213). EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract
- NVIDIA Corporation patent applications on July 4th, 2024
- NVIDIA Corporation patent applications on March 21st, 2024
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- Qualcomm incorporated (20240096698). SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS simplified abstract
- Qualcomm incorporated (20240096750). SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION simplified abstract
- Qualcomm incorporated (20240096790). PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL simplified abstract
- Qualcomm incorporated (20240243036). CAVITY-EMBEDDED TUNABLE FILTER simplified abstract
- Qualcomm incorporated (20240249056). ENGINEERING CHANGE ORDER (ECO) SPARE CELL simplified abstract
- Qualcomm incorporated (20240250009). EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240266217). SELF-ALIGNED SMALL CONTACT STRUCTURE simplified abstract
- QUALCOMM Incorporated patent applications on August 8th, 2024
- QUALCOMM Incorporated patent applications on July 18th, 2024
- QUALCOMM Incorporated patent applications on July 25th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024