Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- Huawei technologies co., ltd. (20240213203). CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240218548). ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF simplified abstract
- Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240274688). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLIFICATION CIRCUIT, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240321771). CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract
- Huawei Technologies Co., Ltd. patent applications on August 15th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 15th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 29th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 8th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on July 4th, 2024
- Huawei Technologies Co., Ltd. patent applications on June 27th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
- Hyundai motor company (20240105573). POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Hyundai motor company (20240120269). POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
- HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
- HYUNDAI MOTOR COMPANY patent applications on June 6th, 2024
- Hyundai Motor Company patent applications on March 28th, 2024
I
- IMEC VZW (20240297136). METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE simplified abstract
- Infineon technologies ag (20240248071). SENSOR FOR MEASURING A GAS PROPERTY simplified abstract
- Infineon technologies ag (20240250056). SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract
- Infineon Technologies AG patent applications on July 25th, 2024
- Innolux corporation (20240297132). SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
- InnoLux Corporation patent applications on September 5th, 2024
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113039). BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract
- Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113073). SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240113088). INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Intel corporation (20240113109). PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE simplified abstract
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240120302). Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract
- Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240128205). HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract
- Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240128256). MULTI-CHIP PACKAGING simplified abstract
- Intel corporation (20240136278). STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240136292). MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract
- Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240136326). NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract
- Intel corporation (20240162289). SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES simplified abstract
- Intel corporation (20240178084). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240178097). PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract
- Intel corporation (20240178119). RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract
- Intel corporation (20240178145). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract
- Intel corporation (20240178146). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240178157). SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract
- Intel corporation (20240178207). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240186202). PACKAGE WITH UNDERFILL CONTAINMENT BARRIER simplified abstract
- Intel corporation (20240186206). INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186251). SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT simplified abstract
- Intel corporation (20240186263). STRUCTURE AND PROCESS FOR WARPAGE REDUCTION simplified abstract
- Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240186279). IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT simplified abstract
- Intel corporation (20240186280). THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
- Intel corporation (20240186281). METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
- Intel corporation (20240186403). DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
- Intel corporation (20240194533). INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING simplified abstract
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract
- Intel corporation (20240194552). FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract
- Intel corporation (20240194657). INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract
- Intel corporation (20240203805). EMBEDDED MEMORY FOR GLASS CORE PACKAGES simplified abstract
- Intel corporation (20240203926). HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES simplified abstract
- Intel corporation (20240204048). EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT simplified abstract
- Intel corporation (20240204083). DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA simplified abstract
- Intel corporation (20240213156). LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240213163). INTERCONNECT DEVICE AND METHOD simplified abstract
- Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract
- Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract
- Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract
- Intel corporation (20240213201). Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract
- Intel corporation (20240213225). PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract
- Intel corporation (20240213235). ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240213328). DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract
- Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract
- Intel corporation (20240222139). MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract
- Intel corporation (20240222211). IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract
- Intel corporation (20240222216). PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract
- Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract
- Intel corporation (20240222228). DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER simplified abstract
- Intel corporation (20240222238). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract
- Intel corporation (20240222274). HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES simplified abstract
- Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240222282). ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222283). METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract
- Intel corporation (20240222286). HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract
- Intel corporation (20240222295). STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222298). TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract
- Intel corporation (20240222301). METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract
- Intel corporation (20240222304). METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract
- Intel corporation (20240222320). DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract
- Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract
- Intel corporation (20240222346). ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
- Intel corporation (20240222347). MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract
- Intel corporation (20240234245). SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract
- Intel corporation (20240243066). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract
- Intel corporation (20240243087). METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract
- Intel corporation (20240243088). COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract
- Intel corporation (20240243099). HYPERCHIP simplified abstract
- Intel corporation (20240250043). CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS simplified abstract
- Intel corporation (20240258183). PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL simplified abstract
- Intel corporation (20240258240). DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240266323). STACKED SEMICONDUCTOR DIE ARCHITECTURE WITH MULTIPLE LAYERS OF DISAGGREGATION simplified abstract
- Intel corporation (20240274521). METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240274542). COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME simplified abstract
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240282624). CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract
- Intel corporation (20240312869). MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE simplified abstract
- Intel corporation (20240312942). REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) simplified abstract
- Intel corporation (20240321660). STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20240321807). BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS simplified abstract
- Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract
- Intel corporation (20240332116). SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD simplified abstract
- Intel corporation (20240332134). METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240332155). SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS simplified abstract
- Intel corporation (20240332203). MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER simplified abstract
- Intel corporation (20240332237). MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER simplified abstract
- Intel corporation (20240332251). DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION simplified abstract
- Intel corporation (20240332399). GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240334600). PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240334715). FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS simplified abstract
- Intel corporation (20240339428). HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE simplified abstract
- Intel corporation (20240347457). PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240347590). METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240355697). PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER simplified abstract
- Intel corporation (20240355725). POWER DELIVERY STRUCTURES simplified abstract
- Intel corporation (20240355745). POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES simplified abstract
- Intel corporation (20240355749). DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240355750). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
- Intel corporation (20240355759). LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE simplified abstract
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract
- Intel corporation (20240355792). REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE simplified abstract
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on August 15th, 2024
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on August 22nd, 2024
- Intel Corporation patent applications on August 8th, 2024
- Intel Corporation patent applications on February 29th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on July 11th, 2024
- Intel Corporation patent applications on July 18th, 2024
- Intel Corporation patent applications on July 25th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 13th, 2024
- Intel Corporation patent applications on June 20th, 2024
- INTEL CORPORATION patent applications on June 20th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on October 10th, 2024
- Intel Corporation patent applications on October 17th, 2024
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- Intel Corporation patent applications on September 19th, 2024
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240096783). FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract
- International business machines corporation (20240112965). TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract
- International business machines corporation (20240113055). STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS simplified abstract
- International business machines corporation (20240113076). INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS simplified abstract
- International business machines corporation (20240162192). STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract
- International business machines corporation (20240178156). SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract
- International business machines corporation (20240194670). ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES simplified abstract
- International business machines corporation (20240203816). HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract
- International business machines corporation (20240203822). THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract
- International business machines corporation (20240203904). STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER simplified abstract
- International business machines corporation (20240213217). CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract
- International business machines corporation (20240215270). HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract
- International business machines corporation (20240222313). Structures and Processes for Void-Free Hybrid Bonding simplified abstract
- International business machines corporation (20240243062). HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract
- International business machines corporation (20240250070). FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS simplified abstract
- International business machines corporation (20240282658). INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER simplified abstract
- International business machines corporation (20240282735). SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract
- International business machines corporation (20240290730). DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING simplified abstract
- International business machines corporation (20240321593). DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION simplified abstract
- International business machines corporation (20240321802). PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT simplified abstract
- International business machines corporation (20240332194). CHIP MODULE ASSEMBLY simplified abstract
- International business machines corporation (20240332239). HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY simplified abstract
- International business machines corporation (20240347497). THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract