Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,965 total.
(previous page) (next page)B
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
- Blockchain patent applications on May 16th, 2024
C
- Canon kabushiki kaisha (20240105643). CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS simplified abstract
- Canon kabushiki kaisha (20240178258). PHOTOELECTRIC CONVERSION APPARATUS simplified abstract
- Canon kabushiki kaisha (20240178265). SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240194636). BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240213211). STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract
- Canon kabushiki kaisha (20240222351). METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract
- Canon kabushiki kaisha (20240243094). BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM simplified abstract
- Canon kabushiki kaisha (20240250105). SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract
- Canon kabushiki kaisha (20240260167). ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT simplified abstract
- Canon kabushiki kaisha (20240284064). PHOTOELECTRIC CONVERSION DEVICE simplified abstract
- Canon kabushiki kaisha (20240313025). PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVABLE BODY simplified abstract
- CANON KABUSHIKI KAISHA patent applications on August 1st, 2024
- CANON KABUSHIKI KAISHA patent applications on August 22nd, 2024
- CANON KABUSHIKI KAISHA patent applications on July 18th, 2024
- CANON KABUSHIKI KAISHA patent applications on July 25th, 2024
- CANON KABUSHIKI KAISHA patent applications on July 4th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 13th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 27th, 2024
- CANON KABUSHIKI KAISHA patent applications on March 28th, 2024
- CANON KABUSHIKI KAISHA patent applications on May 30th, 2024
- CANON KABUSHIKI KAISHA patent applications on September 19th, 2024
- Capital one services, llc (20240256818). SYSTEMS AND METHODS FOR USE OF CAPACITIVE MEMBER TO PREVENT CHIP FRAUD simplified abstract
- Capital One Services, LLC patent applications on August 1st, 2024
- Chengdu boe optoelectronics technology co., ltd. (20240213181). DISPLAY PANEL AND DISPLAY DEVICE simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240243083). DRIVER IC AND DISPLAY DEVICE simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240304586). CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR simplified abstract
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on July 18th, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on June 27th, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on September 12th, 2024
D
- Delphi technologies ip limited (20240105533). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240105534). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240105553). SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS simplified abstract
- Delphi technologies ip limited (20240105684). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Denso corporation (20240258264). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- DENSO CORPORATION patent applications on August 1st, 2024
G
- Gm global technology operations llc (20240234239). COOLED POWER MODULE simplified abstract
- GM Global Technology Operations LLC patent applications on July 11th, 2024
- Google llc (20240162179). PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract
- Google llc (20240186214). Three Dimensional IC Package with Thermal Enhancement simplified abstract
- Google llc (20240194532). MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract
- Google llc (20240194661). MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract
- Google llc (20240290763). Pluggable CPU Modules with Vertical Power simplified abstract
- Google LLC patent applications on August 29th, 2024
- GOOGLE LLC patent applications on February 15th, 2024
- GOOGLE LLC patent applications on February 1st, 2024
- Google LLC patent applications on June 13th, 2024
- Google LLC patent applications on June 6th, 2024
- Google LLC patent applications on May 16th, 2024
H
- Honor device co., ltd. (20240250016). Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract
- Honor Device Co., Ltd. patent applications on July 25th, 2024
- Huawei technologies co., ltd. (20240178103). Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240178167). CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE simplified abstract
- Huawei technologies co., ltd. (20240178187). CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240213203). CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240218548). ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF simplified abstract
- Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240274688). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLIFICATION CIRCUIT, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240321771). CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract
- Huawei Technologies Co., Ltd. patent applications on August 15th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 15th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 29th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 8th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on July 4th, 2024
- Huawei Technologies Co., Ltd. patent applications on June 27th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
- Hyundai motor company (20240105573). POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Hyundai motor company (20240120269). POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
- HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
- HYUNDAI MOTOR COMPANY patent applications on June 6th, 2024
- Hyundai Motor Company patent applications on March 28th, 2024
I
- IMEC VZW (20240297136). METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE simplified abstract
- Infineon technologies ag (20240248071). SENSOR FOR MEASURING A GAS PROPERTY simplified abstract
- Infineon technologies ag (20240250056). SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract
- Infineon Technologies AG patent applications on July 25th, 2024
- Innolux corporation (20240297132). SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
- InnoLux Corporation patent applications on September 5th, 2024
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113039). BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract
- Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113073). SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240113088). INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Intel corporation (20240113109). PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE simplified abstract
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240120302). Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract
- Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240128205). HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract
- Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240128256). MULTI-CHIP PACKAGING simplified abstract
- Intel corporation (20240136278). STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240136292). MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract
- Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240136326). NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract
- Intel corporation (20240162289). SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES simplified abstract
- Intel corporation (20240178084). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240178097). PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract
- Intel corporation (20240178119). RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract
- Intel corporation (20240178145). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract
- Intel corporation (20240178146). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240178157). SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract
- Intel corporation (20240178207). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240186202). PACKAGE WITH UNDERFILL CONTAINMENT BARRIER simplified abstract
- Intel corporation (20240186206). INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186251). SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT simplified abstract
- Intel corporation (20240186263). STRUCTURE AND PROCESS FOR WARPAGE REDUCTION simplified abstract
- Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240186279). IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT simplified abstract
- Intel corporation (20240186280). THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
- Intel corporation (20240186281). METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
- Intel corporation (20240186403). DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
- Intel corporation (20240194533). INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING simplified abstract
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract
- Intel corporation (20240194552). FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract
- Intel corporation (20240194657). INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract
- Intel corporation (20240203805). EMBEDDED MEMORY FOR GLASS CORE PACKAGES simplified abstract
- Intel corporation (20240203926). HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES simplified abstract
- Intel corporation (20240204048). EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT simplified abstract
- Intel corporation (20240204083). DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA simplified abstract
- Intel corporation (20240213156). LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240213163). INTERCONNECT DEVICE AND METHOD simplified abstract
- Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract
- Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract
- Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract
- Intel corporation (20240213201). Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract
- Intel corporation (20240213225). PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract
- Intel corporation (20240213235). ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240213328). DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract
- Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract
- Intel corporation (20240222139). MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract
- Intel corporation (20240222211). IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract
- Intel corporation (20240222216). PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract
- Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract
- Intel corporation (20240222228). DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER simplified abstract
- Intel corporation (20240222238). APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract
- Intel corporation (20240222274). HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES simplified abstract
- Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240222282). ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222283). METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract
- Intel corporation (20240222286). HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract
- Intel corporation (20240222295). STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222298). TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract
- Intel corporation (20240222301). METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract
- Intel corporation (20240222304). METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract
- Intel corporation (20240222320). DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract
- Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract
- Intel corporation (20240222346). ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
- Intel corporation (20240222347). MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract
- Intel corporation (20240234245). SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract
- Intel corporation (20240243066). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract
- Intel corporation (20240243087). METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract
- Intel corporation (20240243088). COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract
- Intel corporation (20240243099). HYPERCHIP simplified abstract
- Intel corporation (20240250043). CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS simplified abstract
- Intel corporation (20240258183). PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL simplified abstract
- Intel corporation (20240258240). DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240266323). STACKED SEMICONDUCTOR DIE ARCHITECTURE WITH MULTIPLE LAYERS OF DISAGGREGATION simplified abstract
- Intel corporation (20240274521). METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240274542). COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME simplified abstract
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240282624). CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract
- Intel corporation (20240312869). MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE simplified abstract
- Intel corporation (20240312942). REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) simplified abstract
- Intel corporation (20240321660). STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20240321807). BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS simplified abstract
- Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract
- Intel corporation (20240332116). SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD simplified abstract
- Intel corporation (20240332134). METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240332155). SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS simplified abstract
- Intel corporation (20240332203). MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER simplified abstract
- Intel corporation (20240332237). MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER simplified abstract
- Intel corporation (20240332251). DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION simplified abstract
- Intel corporation (20240332399). GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240334600). PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240334715). FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS simplified abstract