Category:H01L23/00
Jump to navigation
Jump to search
(previous page) (next page)
- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,684 total.
(previous page) (next page)1
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18613954. BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614756. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614965. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18615528. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SK Hynix Inc.)
- 18615654. HYPERCHIP simplified abstract (Intel Corporation)
- 18615907. THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616212. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616773. SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18617040. ELECTRONIC DEVICE simplified abstract (ROHM CO., LTD.)
- 18617517. ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES simplified abstract (Texas Instruments Incorporated)
- 18617530. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18618024. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME simplified abstract (InnoLux Corporation)
- 18618029. STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SK Hynix Inc.)
- 18618133. SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract (Samsung Electronics Co., Ltd.)
- 18618181. ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18620569. METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (Intel Corporation)
- 18621323. DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18622153. POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract (ROHM CO., LTD.)
- 18622486. COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract (Intel Corporation)
- 18622511. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18623992. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624954. WAFER BONDING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18626145. SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18628804. INTERPOSER WITH WARPAGE-RELIEF TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18634014. DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECOND STRUCTURE HAVING GATE LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18635315. CHIPLET INTERPOSER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637061. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18638947. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18642173. BUMP STRUCTURE AND METHOD OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18646951. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648599. PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER simplified abstract (Texas Instruments Incorporated)
- 18648971. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., LTD.)
- 18649331. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18649389. CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract (Intel Corporation)
- 18650144. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18650225. SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18650641. SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract (SK hynix Inc.)
- 18650794. SEMICONDUCTOR PACKAGE simplified abstract (ROHM CO., LTD.)
- 18650970. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651064. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651159. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651321. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18651718. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651815. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
- 18652315. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652365. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652515. APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18652529. METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18652779. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652832. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652836. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652868. PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652969. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18653496. ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18653575. DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18654247. NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION simplified abstract (Texas Instruments Incorporated)
- 18654268. Structure and Method of Forming a Joint Assembly simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18657689. ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE simplified abstract (Texas Instruments Incorporated)
- 18659400. SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18660190. SEMICONDUCTOR DIE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18660967. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18661700. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662075. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662586. PACKAGE STRUCTURE WITH A BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662916. METHODS OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663670. METHODS OF FORMING SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663782. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18665806. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666798. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667009. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18668408. SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18668658. METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS BETWEEN STACKING DIES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668687. CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668922. BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669118. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18669679. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18669914. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18671330. SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18671649. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18671793. Hybrid Displays simplified abstract (Apple Inc.)
- 18672001. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18673328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674610. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18674891. SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674904. METHOD FOR FABRICATING HYBRID BONDED STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675097. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675560. SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675679. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18675785. CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676343. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18677075. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18682829. CIRCUIT BOARD simplified abstract (LG Innotek Co.,LTD.)
2
- 20240014087. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 20240014105. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240014161. CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES simplified abstract (Xilinx, Inc.)
- 20240014167. SUBSTRATE HOLDER AND BONDING SYSTEM simplified abstract (SHINKAWA LTD.)
- 20240014172. VERTICALLY MOUNTED DIE GROUPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240021578. WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD simplified abstract (ZHEJIANG LAB)
- 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- 20240030117. MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME simplified abstract (Qorvo US, Inc.)
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)
- 20240038716. SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL simplified abstract (Western Digital Technologies, Inc.)
- 20240038723. CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 20240047303. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047317. PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES simplified abstract (Littelfuse Semiconductor (Wuxi) Co., Ltd.)
- 20240047336. ELECTRONIC PACKAGE simplified abstract (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 20240047378. DISPLAY PANEL AND MOBILE TERMINAL simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 20240047383. SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF MANUFACTURING THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 20240047407. INTEGRATED CIRCUIT PACKAGE simplified abstract (STMicroelectronics (Grenoble 2) SAS)
- 20240047421. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047491. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- 20240049448. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 20240055310. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 20240055393. PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS simplified abstract (Invensas LLC)
- 20240055416. WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (SJ Semiconductor (Jiangyin) Corporation)
- 20240087976.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240087991.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240087998.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088003.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088006.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088032.Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (apple inc.)
3
A
- Advanced micro devices, inc. (20240113004). CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET simplified abstract
- Advanced micro devices, inc. (20240113070). INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES simplified abstract
- ADVANCED MICRO DEVICES, INC. patent applications on April 4th, 2024
- Apple inc. (20240096648). Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract
- Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Apple inc. (20240105639). COMPRESSION STRUCTURES FOR IC PACKAGES simplified abstract
- Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240161804). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract
- Apple inc. (20240162182). Asymmetric Stackup Structure for SoC Package Substrates simplified abstract
- Apple inc. (20240243012). Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module simplified abstract
- Apple inc. (20240243113). THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD simplified abstract
- Apple inc. (20240249989). Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract
- Apple inc. (20240310635). Hybrid Displays simplified abstract
- Apple inc. (20240315054). Upside-Down DRAM Package Structure simplified abstract
- Apple Inc. patent applications on February 1st, 2024
- Apple Inc. patent applications on January 25th, 2024
- Apple Inc. patent applications on July 18th, 2024
- Apple Inc. patent applications on July 25th, 2024
- Apple Inc. patent applications on March 14th, 2024
- Apple Inc. patent applications on March 21st, 2024
- Apple Inc. patent applications on March 28th, 2024
- Apple Inc. patent applications on May 16th, 2024
- Apple Inc. patent applications on September 19th, 2024
- Applied materials, inc. (20240266231). CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract
- Applied Materials, Inc. patent applications on August 8th, 2024
- Audio Technologies patent applications on 13th Sep 2024
- Audio Technologies patent applications on September 12th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
- Blockchain patent applications on May 16th, 2024
C
- Canon kabushiki kaisha (20240105643). CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS simplified abstract
- Canon kabushiki kaisha (20240178258). PHOTOELECTRIC CONVERSION APPARATUS simplified abstract
- Canon kabushiki kaisha (20240178265). SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240194636). BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240213211). STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract
- Canon kabushiki kaisha (20240222351). METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract
- Canon kabushiki kaisha (20240243094). BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM simplified abstract
- Canon kabushiki kaisha (20240250105). SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract
- Canon kabushiki kaisha (20240260167). ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT simplified abstract
- Canon kabushiki kaisha (20240284064). PHOTOELECTRIC CONVERSION DEVICE simplified abstract
- Canon kabushiki kaisha (20240313025). PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVABLE BODY simplified abstract
- CANON KABUSHIKI KAISHA patent applications on August 1st, 2024
- CANON KABUSHIKI KAISHA patent applications on August 22nd, 2024