Category:H01L23/00
Jump to navigation
Jump to search
(previous page) (next page)
- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
(previous page) (next page)1
- 18612282. PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18612304. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612492. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18612648. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18613414. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18613954. BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614285. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18614450. INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBERANCE, AND CORRESPONDING METHOD simplified abstract (Murata Manufacturing Co., Ltd.)
- 18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614756. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614965. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18615528. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SK Hynix Inc.)
- 18615654. HYPERCHIP simplified abstract (Intel Corporation)
- 18615907. THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616212. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616773. SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18617040. ELECTRONIC DEVICE simplified abstract (ROHM CO., LTD.)
- 18617517. ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES simplified abstract (Texas Instruments Incorporated)
- 18617530. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18618024. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME simplified abstract (InnoLux Corporation)
- 18618029. STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SK Hynix Inc.)
- 18618133. SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract (Samsung Electronics Co., Ltd.)
- 18618181. ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18620569. METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (Intel Corporation)
- 18621323. DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18621323. DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 18622153. POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract (ROHM CO., LTD.)
- 18622486. COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract (Intel Corporation)
- 18622511. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18623992. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624811. SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES simplified abstract (Micron Technology, Inc.)
- 18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624954. WAFER BONDING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18625419. BONDING METHOD AND BONDING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18625541. ELECTRONIC COMPONENT AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18626145. SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18628804. INTERPOSER WITH WARPAGE-RELIEF TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18630122. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18634014. DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECOND STRUCTURE HAVING GATE LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18634198. Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract (GOOGLE LLC)
- 18635315. CHIPLET INTERPOSER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637061. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18638947. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18642173. BUMP STRUCTURE AND METHOD OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18646951. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648599. PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER simplified abstract (Texas Instruments Incorporated)
- 18648971. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., LTD.)
- 18649331. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18649389. CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract (Intel Corporation)
- 18650144. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18650225. SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18650641. SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract (SK hynix Inc.)
- 18650794. SEMICONDUCTOR PACKAGE simplified abstract (ROHM CO., LTD.)
- 18650970. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651064. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651159. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651321. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18651718. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651815. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
- 18652315. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652365. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652515. APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18652529. METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18652779. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652832. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652836. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652868. PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652969. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18653496. ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18653575. DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18653619. POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18654247. NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION simplified abstract (Texas Instruments Incorporated)
- 18654268. Structure and Method of Forming a Joint Assembly simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18657689. ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE simplified abstract (Texas Instruments Incorporated)
- 18659400. SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18660190. SEMICONDUCTOR DIE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18660967. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18661700. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662075. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662586. PACKAGE STRUCTURE WITH A BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662916. METHODS OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663670. METHODS OF FORMING SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663782. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18665806. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666798. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667009. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18668408. SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18668658. METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS BETWEEN STACKING DIES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668687. CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668777. SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STACK SIGNAL ROUTING simplified abstract (Micron Technology, Inc.)
- 18668922. BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669118. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18669679. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18669914. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18670165. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18671330. SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18671649. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18671652. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
- 18671793. Hybrid Displays simplified abstract (Apple Inc.)
- 18672001. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18673328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674230. ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18674610. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18674681. ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME simplified abstract (LG Display Co., Ltd.)
- 18674891. SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674904. METHOD FOR FABRICATING HYBRID BONDED STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674950. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18675097. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675560. SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675646. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18675658. INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE simplified abstract (ROHM CO., LTD.)
- 18675679. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18675785. CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675881. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18676343. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676537. SEMICONDUCTOR DEVICE INCLUDING STANDARD CELL HAVING SPLIT PORTIONS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18677075. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18677332. SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18677913. SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18678306. SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18679091. PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18679806. SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
- 18680445. IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE simplified abstract (Sony Group Corporation)
- 18681997. SILICON CARBIDE SEMICONDUCTOR DEVICE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18682829. CIRCUIT BOARD simplified abstract (LG Innotek Co.,LTD.)
- 18685137. ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME simplified abstract (Robert Bosch GmbH)
- 18732377. MEMORY DEVICE WITH IMPROVED PROGRAM PERFORMANCE AND METHOD OF OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18732591. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18732662. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18733146. Optical Lithography System and Method of Using the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18733450. PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18733705. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18733870. SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18734122. CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18734175. SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18734477. BIPOLAR TRANSISTOR AND SEMICONDUCTOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18734627. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18735126. PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18735151. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18735185. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18735187. PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18735408. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18736766. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18743013. MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18744752. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME simplified abstract (ROHM CO., LTD.)
- 18745613. Semiconductor Package and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18745773. SELF-ALIGNED VIA STRUCTURES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18745970. DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18747585. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE simplified abstract (SK hynix Inc.)
- 18747798. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18748127. ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18748765. SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18748862. CONTAMINANT COLLECTION ON SOI simplified abstract (Texas Instruments Incorporated)
- 18749274. HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE simplified abstract (Intel Corporation)
- 18749516. PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18749542. JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18749794. LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18750258. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18750260. METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT simplified abstract (Infineon Technologies AG)
- 18750571. PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED INTERCONNECT BRIDGE simplified abstract (Intel Corporation)
- 18751061. THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18751336. MEMORY DEVICES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751359. PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751362. METHOD OF FORMING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751563. NONVOLATILE MEMORY DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18751724. CHIP PACKAGE STRUCTURE WITH LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18752388. THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGULATOR POWER DELIVERY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18752525. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18753091. CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18753139. METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18754434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18754605. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18754706. BACKSIDE CAPACITOR TECHNIQUES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18755306. METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract (Intel Corporation)
- 18756034. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18757531. PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
2
- 20240014087. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 20240014105. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240014161. CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES simplified abstract (Xilinx, Inc.)
- 20240014167. SUBSTRATE HOLDER AND BONDING SYSTEM simplified abstract (SHINKAWA LTD.)
- 20240014172. VERTICALLY MOUNTED DIE GROUPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240021578. WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD simplified abstract (ZHEJIANG LAB)
- 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- 20240030117. MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME simplified abstract (Qorvo US, Inc.)
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)