Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- 18510864. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18512092. 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18512375. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
- 18513167. Asymmetric Stackup Structure for SoC Package Substrates simplified abstract (Apple Inc.)
- 18513296. BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513649. INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513863. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18514054. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514436. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514466. ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515412. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18515649. Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract (Apple Inc.)
- 18515797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18516367. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18516753. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516974. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517232. PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517260. CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18517489. Stacking Via Structures for Stress Reduction simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517980. SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
- 18518096. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18518187. Integrated Circuit Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518448. SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518456. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518790. CHIP PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519256. METHOD FOR OBTAINING AN INTEGRATED DEVICE COMPRISING USING AN ETCHING MASK TO DEFINE DICING LINES simplified abstract (Murata Manufacturing Co., Ltd.)
- 18519872. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18520453. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18520467. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520743. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (DENSO CORPORATION)
- 18520743. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18520958. Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520971. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521264. APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18521284. HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521711. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522013. PHOTOELECTRIC CONVERSION APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18522042. SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18522110. SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18522225. CHIP ON FILM PACKAGE simplified abstract (Samsung Display Co., LTD.)
- 18522271. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522622. SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522829. NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18522909. SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD simplified abstract (STMicroelectronics International N.V.)
- 18523007. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE simplified abstract (STMicroelectronics International N.V.)
- 18523157. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18523255. LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL simplified abstract (HONEYWELL INTERNATIONAL INC.)
- 18523314. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18523457. METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18523494. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18524135. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18524454. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18524552. THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18524900. INTERPOSER CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18525273. Semiconductor Device with Discrete Blocks simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18525467. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18526057. SEMICONDUCTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526445. SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526697. SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18527457. SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18527552. BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18530067. COMPLIANT CHUCK EDGE RING simplified abstract (Tokyo Electron Limited)
- 18530542. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18530896. BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
- 18531070. POWER MODULE FOR A VEHICLE simplified abstract (Robert Bosch GmbH)
- 18531720. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18531883. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18532064. STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18532726. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18533800. STACKED SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18534143. UNIVERSAL CHIP WITH VARIABLE PACKAGING simplified abstract (Meta Platforms Technologies, LLC)
- 18535231. SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN simplified abstract (Samsung Electronics Co., Ltd.)
- 18535339. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18535360. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18535893. PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract (Google LLC)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
- 18537548. DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18537672. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18538483. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538631. SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18538641. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538889. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18539036. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18541147. SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract (Samsung Electronics Co., Ltd.)
- 18543110. CHIP STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543124. CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543749. Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract (Intel Corporation)
- 18546631. SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18550857. Light-Receiving Element and Light Receiving Circuit simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18552398. GRAPHITE SHEET AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18554244. SEMICONDUCTOR DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18556265. POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18557573. PHOTODETECTOR AND DISTANCE MEASUREMENT APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18558079. Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18559516. HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract (Mitsubishi Electric Corporation)
- 18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 18561297. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18562502. SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18566303. Semiconductor Device and Manufacturing Method for Semiconductor Device simplified abstract (HITACHI ASTEMO, LTD.)
- 18570074. FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18570678. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18577842. WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18577884. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583066. POWER MANAGEMENT simplified abstract (Micron Technology, Inc.)
- 18583467. MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18583743. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583892. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18584007. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18584044. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18584148. ELECTRONIC DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18584469. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18584488. SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18585211. Interconnect Layout for Semiconductor Device simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18585468. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18585629. PROCESS FOR THIN FILM CAPACITOR INTEGRATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18586209. MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18586366. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18586425. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18587331. FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract (Intel Corporation)
- 18587407. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587908. VERTICALLY MOUNTED DIE GROUPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18588091. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
- 18588352. HIGH VOLTAGE DIODES FOR WAFER ON WAFER PACKAGING OF SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18588547. SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18588573. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PROVIDING CHIPSET simplified abstract (Renesas Electronics Corporation)
- 18588699. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18589254. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18589300. SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18590242. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)
- 18590302. DISPLAY DEVICE INCLUDING DISPLAY MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18590491. Method of Backgrind Tape Planarization Using Heated Press simplified abstract (Texas Instruments Incorporated)
- 18590718. SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18591336. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18591438. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18591580. SEMICONDUCTOR MODULE ARRANGEMENT simplified abstract (Infineon Technologies AG)
- 18592124. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18592442. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18592829. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18592860. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593467. VERTICAL MEMORY DEVICES simplified abstract (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)
- 18594334. SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18594446. ELECTRONIC DEVICE simplified abstract (MEDIATEK INC.)
- 18594573. THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME simplified abstract (MEDIATEK Inc.)
- 18594605. SEMICONDUCTOR DEVICE FOR AUDIO simplified abstract (ROHM Co., LTD.)
- 18594742. SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18595303. STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595321. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18595329. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595341. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18595666. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18595729. POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
- 18596240. THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18596343. IMAGING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18596399. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18596404. 3D IC POWER GRID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18596484. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)
- 18596514. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18596528. SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18596600. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18596794. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18596794. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18598077. SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18598167. SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598266. Semiconductor Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598735. TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18599147. Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract (Intel Corporation)
- 18599469. CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18599624. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18599734. EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18599802. MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18600146. MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
- 18601216. ELECTRONIC DEVICE simplified abstract (STMicroelectronics International N.V.)
- 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)
- 18602185. METHOD FOR FORMING A PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602392. INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602553. SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18602665. VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602718. Package-On-Package Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18603032. PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVABLE BODY simplified abstract (CANON KABUSHIKI KAISHA)
- 18603047. ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18603099. STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18603113. METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS simplified abstract (STMicroelectronics International N.V.)
- 18603174. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603181. OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18603549. Channel Manufacturing Method simplified abstract (SEIKO EPSON CORPORATION)