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Category:H01L21/67
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Pages in category "H01L21/67"
The following 200 pages are in this category, out of 655 total.
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- 17739783. Semiconductor Device and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17748270. METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE simplified abstract (Applied Materials, Inc.)
- 17819307. DE-TAPE TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17835711. AUTO FINE-TUNER FOR DESIRED TEMPERATURE PROFILE simplified abstract (Applied Materials, Inc.)
- 17847090. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17885809. APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887729. ADJUSTABLE WAFER CHUCK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17889035. WAFER BAKING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17896374. TURNTABLE FOR WAFER TRANSPORT SYSTEM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17908798. SEMICONDUCTOR MANUFACTURING APPARATUS AND CLEANING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Hitachi High-Tech Corporation)
- 17932050. PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17937487. SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17945897. SURFACE MODIFICATION TO ACHIEVE SELECTIVE ISOTROPIC ETCH simplified abstract (TOKYO ELECTRON LIMITED)
- 17945910. ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL simplified abstract (Applied Materials, Inc.)
- 17951910. PLASMA PROCESSING APPARATUS INCLUDING GAS DISTRIBUTION PLATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17955785. DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 17959189. CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPITAXIAL DEPOSITION OPERATIONS simplified abstract (Applied Materials, Inc.)
- 17959606. BRUSHES, SYSTEMS, AND METHODS FOR DISPENSING MULTIPLE FLUIDS DURING CLEANING OF A SURFACE simplified abstract (ILLINOIS TOOL WORKS INC.)
- 17960979. DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVATION simplified abstract (Applied Materials, Inc.)
- 17961214. LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING simplified abstract (Applied Materials, Inc.)
- 17961601. SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD FOR A SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 17967228. ELLIPSOMETER AND APPARATUS FOR INSPECTING SEMICONDUCTOR DEVICE INCLUDING THE ELLIPSOMETER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17971338. HEAT SOURCE ARRANGEMENTS, PROCESSING CHAMBERS, AND RELATED METHODS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract (Applied Materials, Inc.)
- 18040669. THERMAL TREATMENT APPARATUS, THERMAL TREATMENT METHOD, AND STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18057397. APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18061229. APPARATUS FOR MOUNTING SOLDER BALLS simplified abstract (Samsung Electronics Co., Ltd.)
- 18062830. CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18073980. STEALTH DICING LASER DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18078249. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18078302. APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS simplified abstract (Tokyo Electron Limited)
- 18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18081948. SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18086992. CHIP WET TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18087255. SUBSTRATE SUPPORTS AND TRANSFER APPARATUS FOR SUBSTRATE DEFORMATION simplified abstract (Applied Materials, Inc.)
- 18088269. AUTOMATED OCAP INTERFACING SYSTEM AND METHOD simplified abstract (Texas Instruments Incorporated)
- 18089691. SUBSTRATE PROCESSING APPARATUS, SIGNAL SOURCE DEVICE, METHOD OF PROCESSING MATERIAL LAYER, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18090394. ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS simplified abstract (Intel Corporation)
- 18090436. METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK LAYER simplified abstract (Tokyo Electron Limited)
- 18095262. MODULAR PRECURSOR DELIVERY AND SPLITTING FOR FAST SWITCHING simplified abstract (Applied Materials, Inc.)
- 18099357. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099867. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18101555. INTEGRATED CLEAN AND DRY MODULE FOR CLEANING A SUBSTRATE simplified abstract (Applied Materials, Inc.)
- 18112120. METHODS FOR RETAINING A PROCESSING LIQUID ON A SURFACE OF A SEMICONDUCTOR SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18117259. WAFER TRANSFER APPARATUS CAPABLE OF AUTOMATIC TEACHING AND SEMICONDUCTOR PROCESSING SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18124255. RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18124954. SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS, AND SEMICONDUCTOR EQUIPMENT INCLUDING THE SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125853. APPARATUS AND METHOD MONITORING SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (Samsung Electronics Co., Ltd.)
- 18126933. WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME simplified abstract (SEMES CO., LTD.)
- 18137287. SUBSTRATE TREATING APPARATUS simplified abstract (SEMES CO., LTD.)
- 18139840. ATOMIC LAYER ETCHING (ALE) APPARATUS AND ALE METHOD BASED ON THE APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18141013. LIGHT IRRADIATION APPARATUS, SUBSTRATE DEBONDING SYSTEM INCLUDING THE SAME, AND SUBTRATED DEBONDING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18147589. SYSTEMS, APPARATUS, ARTICLES OF MANUFACTURE, AND METHODS TO INSPECT SEMICONDUCTOR WAFERS simplified abstract (Intel Corporation)
- 18147858. METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18152715. TRIMMING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18158276. CLEANING LIQUID NOZZLE, CLEANING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18159208. APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18159214. APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18159222. APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18165896. MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171315. PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18172149. LOUVER DESIGN FOR ELIMINATING LINE OF SIGHT simplified abstract (Applied Materials, Inc.)
- 18177300. SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18179092. METHODS AND APPARATUS TO PLACE BALLS FOR SECOND LEVEL INTERCONNECTS OF INTEGRATED CIRCUIT PACKAGES simplified abstract (Intel Corporation)
- 18180131. PICKUP APPARATUS AND METHOD OF USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18184418. SEMICONDUCTOR PROCESS DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18185427. DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTOR DIE PLACEMENT simplified abstract (Intel Corporation)
- 18199578. LASER CRYSTALLIZATION APPARATUS AND LASER CRYSTALLIZATION METHOD simplified abstract (Samsung Display Co., LTD.)
- 18200068. CHIP EJECTOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18200201. POSITION DETERMINATION APPARATUS FOR ROBOT DETECTION LASER SENSOR SYSTEM IN FOUP MOVABLE BY OHT simplified abstract (Samsung Electronics Co., Ltd.)
- 18200619. APPARATUS FOR CLEANING WAFER simplified abstract (Samsung Electronics Co., Ltd.)
- 18202663. APPARATUS FOR MEASURING RADICAL DENSITY DISTRIBUTION BASED ON LIGHT ABSORPTION AND OPERATING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18203024. JITTER MEASURING CIRCUIT, JITTER ANALYZING APPARATUS INCLUDING THE SAME, AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216675. EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18217020. SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18224973. LIGHT-EMITTING ELEMENT TRANSFER SYSTEM simplified abstract (Samsung Display Co., LTD.)
- 18226854. SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Kokusai Electric Corporation)
- 18230528. CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROLLING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18230880. GAS TREATMENT SYSTEM, SEMICONDUCTOR PROCESS SYSTEM INCLUDING THE SAME, AND GAS TREATMENT METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18236537. SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18237669. SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 18237712. SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18240008. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18242003. LIQUID SUPPLY APPARATUS AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME simplified abstract (SEMES CO., LTD.)
- 18242388. WAFER PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18242388. WAFER PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18243664. THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (MICRON TECHNOLOGY, INC.)
- 18244974. SUBSTRATE PROCESSING BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18272859. DEFECT INSPECTION DEVICE simplified abstract (Hitachi High-Tech Corporation)
- 18273116. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18273446. APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18275548. ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME simplified abstract (LG ELECTRONICS INC.)
- 18296336. WAFER CLEANING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18314983. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18318239. CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18321164. APPARATUS FOR HEATING WAFER simplified abstract (Samsung Electronics Co., Ltd.)
- 18323780. WAFER YIELD ANALYSIS METHOD AND APPARATUS BASED ON WAFER MAP simplified abstract (SK Hynix Inc.)
- 18325200. SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18328955. RECIPE PROPOSAL DEVICE AND RECIPE PROPOSAL METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18333572. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE simplified abstract (Kioxia Corporation)
- 18337515. BOWL AND APPARATUS FOR PROCESSING SUBSTRATE simplified abstract (SEMES CO., LTD.)
- 18343242. LIQUID SUPPLY UNIT AND SUBSTRATE TREATING APPARATUS simplified abstract (SEMES CO., LTD.)
- 18349668. TEACHING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18351754. APPARATUS OF CLEANING SUBSTRATE, APPARATUS OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18352494. BONDING APPARATUS, BONDING METHOD, ESTIMATION METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18353293. SUBSTRATE PROCESSING DEVICE AND METHOD FOR OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18354191. LOAD PORT MODULE AND DRIVING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18357293. METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18357725. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18361129. System and Method for Measuring Thermal Performance of Substrates used in Semiconductor Device Assembly simplified abstract (Western Digital Technologies, Inc.)
- 18367742. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED)
- 18368116. SEMICONDUCTOR POST-PROCESS IMPACT DETECTION DEVICE, SEMICONDUCTOR POST-PROCESS TRANSPORTATION SYSTEM INCLUDING SAME, AND IMPACT LOCATION TRACKING METHOD USING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18368422. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18370139. DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAILURE RISK simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18371774. METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18372811. LARGE DIAMETER POROUS PLUG FOR ARGON DELIVERY simplified abstract (Applied Materials, Inc.)
- 18373364. SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18375202. BRUSHES, SYSTEMS, AND METHODS FOR POST-CMP CLEANING OF A SURFACE simplified abstract (ILLINOIS TOOL WORKS INC.)
- 18380986. PROCESSING LIQUID SUPPLY SYSTEM AND OPERATION METHOD THEREOF simplified abstract (Tokyo Electron Limited)
- 18381032. METHOD AND COMPUTING SYSTEM FOR MANUFACTURING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18382239. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
- 18389664. RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATE HAVING REPLACEABLE CHAMBER PORTS simplified abstract (Applied Materials, Inc.)
- 18389669. SEMICONDUCTOR WAFER DETECTION DEVICE AND DROPLET GUIDE MEMBER simplified abstract (EBARA CORPORATION)
- 18390323. SUBSTRATE ETCHING APPARATUS AND SUBSTRATE ETCHING METHOD simplified abstract (Samsung Display Co., LTD.)
- 18390547. SUBSTRATE PROCESSING SYSTEM, CONTROL DEVICE, AND SUBSTRATE TRANSFER PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18391661. SUBSTRATE PROCESSING APPARATUS simplified abstract (SEMES CO., LTD.)
- 18393884. SUBSTRATE PROCESSING APPARATUS simplified abstract (SEMES CO., LTD.)
- 18394068. SUBSTRATE PROCESSING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract (SEMES CO., LTD.)
- 18394735. SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract (EBARA CORPORATION)
- 18395173. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
- 18395487. AIRFLOW CONTROL SYSTEM AND AIRFLOW CONTROL METHOD simplified abstract (SEMES CO., LTD.)
- 18395570. SUBSTRATE TRANSFERRING APPARATUS, AND LIQUID PROCESSING APPARATUS AND SUBSTRATE PROCESSING EQUIPMENT INCLUDING SAME simplified abstract (SEMES CO., LTD.)
- 18397549. SEMICONDUCTOR PROCESSING APPARATUS WITH ENHANCED CHAMBER USABILITY AND THE METHOD THEREOF simplified abstract (ASM IP Holding B.V.)
- 18399894. VALVE CONTROL DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (SEMES CO., LTD.)
- 18402094. CONVEYANCE APPARATUS, CONVEYANCE METHOD, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18402814. SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18403613. MODULAR PRESSURIZED WORKSTATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18404333. SEMICONDUCTOR TRANSPORT SYSTEM AND METHOD OF TRANSPORTING SEMICONDUCTOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18405030. SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18407631. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18409400. WIPER FOR TRANSFERRING MICRO SEMICONDUCTOR CHIP AND APPARATUS FOR COLLECTING MICRO SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
- 18413497. SUBSTRATE PROCESSING APPARATUS AND METHOD OF ESTIMATING FLOW RATE OF PROCESSING LIQUID FOR SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18415798. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18417564. SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18418827. CHEMICAL SUPPLY APPARATUS, SEMICONDUCTOR FABRICATION SYSTEM INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18419696. Semiconductor Devices and Methods of Manufacturing simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18419867. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18420068. MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18420184. APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18423577. TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING simplified abstract (Intel Corporation)
- 18429479. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18432450. DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18433810. JIG, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF OPERATING SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Kioxia Corporation)
- 18433853. REFLECTOR AND/OR METHOD FOR ULTRAVIOLET CURING OF SEMICONDUCTOR simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18433862. GAS SUPPLY SYSTEM, GAS CONTROL SYSTEM, PLASMA PROCESSING APPARATUS, AND GAS CONTROL METHOD simplified abstract (Tokyo Electron Limited)
- 18433899. SYSTEM AND METHOD FOR DIAGNOSING PLASMA CHAMBER simplified abstract (ASM IP Holding B.V.)
- 18436248. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18436499. DEFORMABLE SUBSTRATE CHUCK simplified abstract (Applied Materials, Inc.)
- 18437058. METHODS, SYSTEMS, AND APPARATUS FOR CONDUCTING A RADICAL TREATMENT OPERATION PRIOR TO CONDUCTING AN ANNEALING OPERATION simplified abstract (Applied Materials, Inc.)
- 18437139. SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18439492. SUBSTRATE SUPPORTER simplified abstract (Samsung Electronics Co., Ltd.)
- 18439813. SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SEMICONDUCTOR PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18442234. METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES simplified abstract (Applied Materials, Inc.)
- 18442522. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD simplified abstract (Tokyo Electron Limited)
- 18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18447702. SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18453190. METHOD OF FABRICATING DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)
- 18456652. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18457785. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18463529. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18465533. SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18467683. SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract (SCREEN Holdings Co., Ltd.)
- 18468780. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18468928. ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD simplified abstract (TOKYO ELECTRON LIMITED)
- 18468966. ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD simplified abstract (TOKYO ELECTRON LIMITED)
- 18469208. METHODS OF PROCESSING SUBSTRATES AND APPARATUSES THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18469234. APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF simplified abstract (Samsung Display Co., Ltd.)
- 18469619. SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE simplified abstract (Kioxia Corporation)
- 18469673. ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM simplified abstract (TOKYO ELECTRON LIMITED)
- 18469687. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18470160. SUBSTRATE TREATING APPARATUS simplified abstract (SCREEN Holdings Co., Ltd.)
- 18473459. SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18476341. MANUFACTURING DEVICE OF DISPLAY DEVICE simplified abstract (Japan Display Inc.)
- 18480249. SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE AND SEMICONDUCTOR PATTERN TRANSFER SYSTEM simplified abstract (Mitsubishi Electric Corporation)
- 18482401. SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18484562. APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18489188. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18489229. SUBSTRATE PROCESSING APPARATUS AND FLUID HEATING DEVICE simplified abstract (Tokyo Electron Limited)
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