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Category:H01L21/67
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Pages in category "H01L21/67"
The following 79 pages are in this category, out of 314 total.
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- 17461688. APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17543072. UNDERFILL VACUUM PROCESS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17551266. IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17678233. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 17719722. SEMICONDUCTOR FABRICATION PROCESS AND METHOD OF OPTIMIZING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)
- 17730993. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17736352. CHIP TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17739783. Semiconductor Device and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17748270. METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE simplified abstract (Applied Materials, Inc.)
- 17819307. DE-TAPE TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17819639. INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17835711. AUTO FINE-TUNER FOR DESIRED TEMPERATURE PROFILE simplified abstract (Applied Materials, Inc.)
- 17847090. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17885809. APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887729. ADJUSTABLE WAFER CHUCK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17889035. WAFER BAKING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17896374. TURNTABLE FOR WAFER TRANSPORT SYSTEM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17908798. SEMICONDUCTOR MANUFACTURING APPARATUS AND CLEANING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Hitachi High-Tech Corporation)
- 17932050. PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17937487. SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17945897. SURFACE MODIFICATION TO ACHIEVE SELECTIVE ISOTROPIC ETCH simplified abstract (TOKYO ELECTRON LIMITED)
- 17945910. ON-BOARD CLEANING OF TOOLING PARTS IN HYBRID BONDING TOOL simplified abstract (Applied Materials, Inc.)
- 17951910. PLASMA PROCESSING APPARATUS INCLUDING GAS DISTRIBUTION PLATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17955785. DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 17959189. CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPITAXIAL DEPOSITION OPERATIONS simplified abstract (Applied Materials, Inc.)
- 17959606. BRUSHES, SYSTEMS, AND METHODS FOR DISPENSING MULTIPLE FLUIDS DURING CLEANING OF A SURFACE simplified abstract (ILLINOIS TOOL WORKS INC.)
- 17960979. DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVATION simplified abstract (Applied Materials, Inc.)
- 17961214. LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING simplified abstract (Applied Materials, Inc.)
- 17961601. SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD FOR A SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 17967228. ELLIPSOMETER AND APPARATUS FOR INSPECTING SEMICONDUCTOR DEVICE INCLUDING THE ELLIPSOMETER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18057397. APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18061229. APPARATUS FOR MOUNTING SOLDER BALLS simplified abstract (Samsung Electronics Co., Ltd.)
- 18062830. CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18073980. STEALTH DICING LASER DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18078249. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18078302. APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS simplified abstract (Tokyo Electron Limited)
- 18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18081948. SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18086992. CHIP WET TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18089691. SUBSTRATE PROCESSING APPARATUS, SIGNAL SOURCE DEVICE, METHOD OF PROCESSING MATERIAL LAYER, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18099357. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18117259. WAFER TRANSFER APPARATUS CAPABLE OF AUTOMATIC TEACHING AND SEMICONDUCTOR PROCESSING SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18124255. RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18124954. SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS, AND SEMICONDUCTOR EQUIPMENT INCLUDING THE SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125853. APPARATUS AND METHOD MONITORING SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (Samsung Electronics Co., Ltd.)
- 18126933. WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME simplified abstract (SEMES CO., LTD.)
- 18139840. ATOMIC LAYER ETCHING (ALE) APPARATUS AND ALE METHOD BASED ON THE APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18141013. LIGHT IRRADIATION APPARATUS, SUBSTRATE DEBONDING SYSTEM INCLUDING THE SAME, AND SUBTRATED DEBONDING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18152715. TRIMMING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18158276. CLEANING LIQUID NOZZLE, CLEANING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18165896. MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE DEVICE, AND WORKPIECE HANDLING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171315. PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18177300. SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18184418. SEMICONDUCTOR PROCESS DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199578. LASER CRYSTALLIZATION APPARATUS AND LASER CRYSTALLIZATION METHOD simplified abstract (Samsung Display Co., LTD.)
- 18200068. CHIP EJECTOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18200619. APPARATUS FOR CLEANING WAFER simplified abstract (Samsung Electronics Co., Ltd.)
- 18202663. APPARATUS FOR MEASURING RADICAL DENSITY DISTRIBUTION BASED ON LIGHT ABSORPTION AND OPERATING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18203024. JITTER MEASURING CIRCUIT, JITTER ANALYZING APPARATUS INCLUDING THE SAME, AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216675. EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18217020. SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18224973. LIGHT-EMITTING ELEMENT TRANSFER SYSTEM simplified abstract (Samsung Display Co., LTD.)
- 18226854. SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Kokusai Electric Corporation)
- 18230880. GAS TREATMENT SYSTEM, SEMICONDUCTOR PROCESS SYSTEM INCLUDING THE SAME, AND GAS TREATMENT METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18236537. SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18237669. SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 18237712. SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18240008. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18242003. LIQUID SUPPLY APPARATUS AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME simplified abstract (SEMES CO., LTD.)
- 18242388. WAFER PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18243664. THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (MICRON TECHNOLOGY, INC.)
- 18272859. DEFECT INSPECTION DEVICE simplified abstract (Hitachi High-Tech Corporation)
- 18273446. APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18275548. ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME simplified abstract (LG ELECTRONICS INC.)
- 18296336. WAFER CLEANING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18314983. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18318239. CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)