Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- 18149206. MEMORY DEVICES HAVING CELL OVER PERIPHERY STRUCTURE, MEMORY PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149342. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18149806. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150034. Packaged Memory Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18150372. STACKED CMOS IMAGE SENSOR simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18150406. COOLED POWER MODULE simplified abstract (GM Global Technology Operations LLC)
- 18150510. CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS simplified abstract (Texas Instruments Incorporated)
- 18150552. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151008. SEMICONDUCTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151014. Redistribution Lines Having Nano Columns and Method Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151517. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151545. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151556. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151622. PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151629. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151643. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151731. FAN-OUT SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152141. SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152153. CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152176. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152539. Fan-Out Stacked Package and Methods of Making the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152626. Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152665. Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152777. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18153601. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18153912. LOW-STRESS PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18154261. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18154329. SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18154540. SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155131. Semiconductor Device and Methods of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155705. PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155784. HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract (International Business Machines Corporation)
- 18155988. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18156449. INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18156693. METHOD OF FORMING AN IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18156848. 3DIC STRUCTURE AND METHODS OF FORMING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156960. MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18158090. Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract (Apple Inc.)
- 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18158305. SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD FOR SEMICONDUCTOR STRUCTURE simplified abstract (Huawei Technologies Co., Ltd.)
- 18158514. LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY simplified abstract (Huawei Technologies Co., Ltd.)
- 18158982. CAPILLARY FOR STITCH BOND simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18159111. FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS simplified abstract (International Business Machines Corporation)
- 18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18159244. SENSOR HAVING TUBULAR WALLED SENSING CAVITY simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18161066. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18161778. SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18162071. SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18162878. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18163378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18163410. ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18163412. STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18163416. STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18163995. PROFILE CONTROL FOR STRESS RELAXATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18164212. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18165419. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18165772. Thermal Dissipation Structures and Methods for Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18166116. BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18166322. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18166450. INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18166473. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE simplified abstract (Changxin Memory Technologies, Inc.)
- 18166517. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE)
- 18166869. METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18167081. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18167095. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18167369. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18167415. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18168038. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18168899. SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18169177. PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169573. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169998. INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER simplified abstract (International Business Machines Corporation)
- 18170581. SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR simplified abstract (NXP USA, Inc.)
- 18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18173027. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18173033. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18174046. SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18174865. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18174992. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18177005. INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract (QUALCOMM Incorporated)
- 18177078. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18177404. DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract (QUALCOMM Incorporated)
- 18178229. SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18178531. MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
- 18178973. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18179072. SINTERING FILM FRAMES AND RELATED METHODS simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18179669. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18179744. OPTICAL SENSOR PACKAGE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18180024. THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18181731. SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18182369. ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18183699. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18184222. HETEROGENEOUS INTEGRATION FOR MEMRISTOR-BASED HARDWARE ACCELERATORS simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)
- 18184386. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18184480. THICK REDISTRIBUTION LAYER FEATURES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18184527. Upside-Down DRAM Package Structure simplified abstract (Apple Inc.)
- 18184968. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18185248. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18185514. FULL AG SINTER DISCRETE PREMIUM PACKAGE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18186209. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18186274. STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT simplified abstract (SK hynix Inc.)
- 18186754. PROTECTION LAYER FOR SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18187180. PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION TO CABLE INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18187444. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18187660. INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18188368. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18188577. STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY simplified abstract (Intel Corporation)
- 18188597. IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18188627. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18189299. DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18189991. PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract (QUALCOMM Incorporated)
- 18190019. PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18192799. Layer-By-Layer Formation Of Through-Substrate Via simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18195536. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18196276. SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18197258. MEMORY DEVICE INCLUDING PAGE BUFFER CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18197998. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199541. INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199553. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199741. SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION simplified abstract (Micron Technology, Inc.)
- 18201466. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18202128. SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18202249. SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS AND BACK-END INTERFACE CONTACTS, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18202375. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18202807. DISPLAY DEVICE simplified abstract (LG Display Co., Ltd.)
- 18203677. IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GATE ELECTRODES simplified abstract (Samsung Electronics Co., Ltd.)
- 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18204717. APPARATUS FOR BONDING WIRE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18206472. SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18206858. SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND MEMORY SYSTEM simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18207475. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18209286. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18209820. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18212323. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM COMPRISING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18212453. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18212461. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18212939. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18213386. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18213851. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18213852. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18214102. CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18215212. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18215212. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18215292. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18215351. INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A CONDUCTIVE ROUTING REGION simplified abstract (Microchip Technology Incorporated)
- 18216157. SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract (Samsung Electronics Co., Ltd.)
- 18216632. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18216860. CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18217655. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18217701. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18218322. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18218885. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18218886. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18219394. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18220053. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18220734. SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18221465. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18222567. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18223854. DISPLAY APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18226180. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226352. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18226534. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226589. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226990. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18227348. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18227646. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18227697. SOLDER BALL ATTACHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18228209. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18228278. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18229039. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18229446. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
- 18229824. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18230416. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18230768. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18230793. MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18230825. BONDING APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 18231102. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18231838. SEMICONDUCTOR DEVICE HAVING A BONDED STRUCTURE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18232770. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18233296. MEMORY PACKAGE EXPANSION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18234092. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)