Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 1,697 total.
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- 17951474. INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17954509. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17955926. LOW CAPACITANCE ESD PROTECTION DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17956134. DISPLAY MODULE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
- 17956794. DOUBLE STITCH WIREBONDS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957446. RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957483. INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 17957552. BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract (Intel Corporation)
- 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation)
- 17957847. GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
- 17958040. SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17958291. PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE simplified abstract (Intel Corporation)
- 17958734. INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS simplified abstract (International Business Machines Corporation)
- 17959892. SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17960871. STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM simplified abstract (Texas Instruments Incorporated)
- 17961025. MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION simplified abstract (Micron Technology, Inc.)
- 17961954. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17964583. REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract (NVIDIA Corporation)
- 17966864. SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17973731. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17975054. METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17977100. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17979233. SEMICONDUCTOR PACKAGES HAVING UPPER CONDUCTIVE PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17983145. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17985332. MICRO CHIP AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17987823. STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17988469. APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17994446. SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18048606. MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18049328. DICING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18049428. SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18049901. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18050724. INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18052689. SEMICONDUCTOR MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18053806. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18054225. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18055357. METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059093. SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18060012. WIRE BONDING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060305. LASER DICING TO CONTROL SPLASH simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18061008. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18062125. BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE WIRE simplified abstract (International Business Machines Corporation)
- 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18064241. SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18064635. NONVOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING IN THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18065799. NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18066448. INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18066487. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)
- 18067565. THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract (QUALCOMM Incorporated)
- 18067703. STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18069044. PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract (QUALCOMM Incorporated)
- 18070523. OPEN CAVITY INTEGRATED CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18070602. ELECTRONIC MODULE AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
- 18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation)
- 18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- 18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18072026. Slot Bow-Tie Antenna On Package simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18072096. SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES simplified abstract (Tokyo Electron Limited)
- 18072426. SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18074134. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18075814. DIE ALIGNMENT METHOD USING MAGNETIC FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18076529. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18078245. ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES simplified abstract (International Business Machines Corporation)
- 18078416. Integrated process sequence for hybrid bonding applications simplified abstract (Applied Materials, Inc.)
- 18078923. HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18080152. INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (Intel Corporation)
- 18080715. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)
- 18080729. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)
- 18081589. INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL simplified abstract (QUALCOMM Incorporated)
- 18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)
- 18083994. STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER simplified abstract (International Business Machines Corporation)
- 18085859. FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)
- 18086575. CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract (International Business Machines Corporation)
- 18087384. HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract (International Business Machines Corporation)
- 18087517. UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract (Intel Corporation)
- 18088046. NONVOLATILE MEMORY DEVICE AND OPERATION METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18089417. INTERCONNECT DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18089459. ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- 18089488. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18089494. DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract (Intel Corporation)
- 18089495. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18092081. CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRONIC DEVICES simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094112. NANOWIRE LED, DISPLAY MODULE INCLUDING THE NANOWIRE LED, AND METHOD FOR MANUFACTURING THE DISPLAY MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094794. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18098158. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18098987. SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099092. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18099097. SEMICONDUCTOR MANUFACTURING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099663. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18099697. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18103676. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18105945. REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18108657. MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
- 18109392. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18111617. CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18112323. METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18113163. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18116414. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18116711. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18116711. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18117736. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18117848. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18119327. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18120026. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18120826. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18121374. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18121429. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18122285. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18124653. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18125348. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125409. SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18126767. SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18126858. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18127513. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18127531. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18130197. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18132171. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18132749. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18134314. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18135541. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18135623. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18135927. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18136416. SOLDER REFLOW APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18136499. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18138363. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18139674. APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18140343. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18140960. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18141675. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18142876. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18144350. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18144637. POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (HYUNDAI MOTOR COMPANY)
- 18144637. POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (KIA CORPORATION)
- 18146591. WIRE BONDS FOR GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18149206. MEMORY DEVICES HAVING CELL OVER PERIPHERY STRUCTURE, MEMORY PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149342. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18149806. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150034. Packaged Memory Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18150372. STACKED CMOS IMAGE SENSOR simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18150552. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151008. SEMICONDUCTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151014. Redistribution Lines Having Nano Columns and Method Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151517. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151556. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151622. PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151629. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151731. FAN-OUT SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152141. SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152153. CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152176. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152539. Fan-Out Stacked Package and Methods of Making the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152777. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18153601. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18153912. LOW-STRESS PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18154261. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18154329. SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18154540. SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155705. PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155988. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18156693. METHOD OF FORMING AN IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18156848. 3DIC STRUCTURE AND METHODS OF FORMING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156960. MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18158305. SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD FOR SEMICONDUCTOR STRUCTURE simplified abstract (Huawei Technologies Co., Ltd.)
- 18158514. LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY simplified abstract (Huawei Technologies Co., Ltd.)