Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- 17894070. SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT simplified abstract (Micron Technology, Inc.)
- 17894084. SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17894095. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895047. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895321. Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
- 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896097. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896638. SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17896797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17897156. MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
- 17897648. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17898330. PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17898356. EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17898368. SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17899522. SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
- 17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17899574. SEMICONDUCTOR DEVICE WITH A POLYMER LAYER simplified abstract (Micron Technology, Inc.)
- 17899577. SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 17899586. SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 17899592. STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17901335. IMAGE SENSOR simplified abstract (Samsung Electronics Co., Ltd.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17915707. DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17927050. CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17927050. CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17930942. MEMORY MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17932182. Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (Apple Inc.)
- 17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)
- 17934298. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17936937. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17937429. STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS simplified abstract (International Business Machines Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17937764. TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (International Business Machines Corporation)
- 17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation)
- 17940623. FERROELECTRIC MEMORY DEVICE ERASURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17940822. Image Sensor with Analog Inference Capability simplified abstract (Micron Technology, Inc.)
- 17943104. TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE simplified abstract (Micron Technology, Inc.)
- 17943580. EMBEDDED METAL PADS simplified abstract (Micron Technology, Inc.)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17944430. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17945410. SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17945835. VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17946109. WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17947672. APPARATUS AND METHODS FOR BONDING PAD REDISTRIBUTION LAYERS IN INTEGRATED CIRCUITS simplified abstract (SanDisk Technologies LLC)
- 17948664. FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract (International Business Machines Corporation)
- 17949069. HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES simplified abstract (SanDisk Technologies LLC)
- 17951474. INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17954509. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17955926. LOW CAPACITANCE ESD PROTECTION DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17956134. DISPLAY MODULE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
- 17956794. DOUBLE STITCH WIREBONDS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957446. RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957483. INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 17957552. BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract (Intel Corporation)
- 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation)
- 17957847. GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
- 17958040. SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17958291. PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE simplified abstract (Intel Corporation)
- 17958734. INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS simplified abstract (International Business Machines Corporation)
- 17959892. SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17960871. STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM simplified abstract (Texas Instruments Incorporated)
- 17961025. MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION simplified abstract (Micron Technology, Inc.)
- 17961954. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17964583. REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract (NVIDIA Corporation)
- 17966864. SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17973731. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17975054. METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17977100. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17979233. SEMICONDUCTOR PACKAGES HAVING UPPER CONDUCTIVE PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17983145. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17985332. MICRO CHIP AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17987823. STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17988469. APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17989633. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (UNITED MICROELECTRONICS CORP.)
- 17994446. SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)
- 18016002. DRIVER IC AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18018176. SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE simplified abstract (Fujikura Ltd.)
- 18022418. DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18047670. SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18048606. MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18048972. SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18049328. DICING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18049428. SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18049901. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18050724. INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18052689. SEMICONDUCTOR MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18053806. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18054225. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18055357. METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059093. SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18060012. WIRE BONDING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060305. LASER DICING TO CONTROL SPLASH simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18061008. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18062125. BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE WIRE simplified abstract (International Business Machines Corporation)
- 18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18064241. SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18064635. NONVOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING IN THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18065799. NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18066448. INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18066487. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)
- 18067565. THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract (QUALCOMM Incorporated)
- 18067703. STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18069044. PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract (QUALCOMM Incorporated)
- 18070523. OPEN CAVITY INTEGRATED CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18070602. ELECTRONIC MODULE AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
- 18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation)
- 18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- 18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18072026. Slot Bow-Tie Antenna On Package simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18072096. SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES simplified abstract (Tokyo Electron Limited)
- 18072426. SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18074134. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18075814. DIE ALIGNMENT METHOD USING MAGNETIC FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18076529. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18078245. ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES simplified abstract (International Business Machines Corporation)
- 18078416. Integrated process sequence for hybrid bonding applications simplified abstract (Applied Materials, Inc.)
- 18078923. HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18080152. INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (Intel Corporation)
- 18080715. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)
- 18080729. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)
- 18081589. INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL simplified abstract (QUALCOMM Incorporated)
- 18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)
- 18083994. STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER simplified abstract (International Business Machines Corporation)
- 18085859. FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)
- 18086575. CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract (International Business Machines Corporation)
- 18087384. HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract (International Business Machines Corporation)
- 18087517. UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract (Intel Corporation)
- 18088046. NONVOLATILE MEMORY DEVICE AND OPERATION METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18089417. INTERCONNECT DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18089459. ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- 18089488. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18089494. DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract (Intel Corporation)
- 18089495. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089732. Structures and Processes for Void-Free Hybrid Bonding simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18089931. DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER simplified abstract (Intel Corporation)
- 18090140. SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract (Intel Corporation)
- 18090273. DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18090317. MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18090707. DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (Intel Corporation)
- 18090879. MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES simplified abstract (Intel Corporation)
- 18090883. PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (Intel Corporation)
- 18090922. SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18091014. HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18091034. PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract (Intel Corporation)
- 18091150. ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18091228. ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091265. DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091270. IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract (Intel Corporation)
- 18091543. APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract (Intel Corporation)
- 18091560. TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 18091583. TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract (Intel Corporation)
- 18091943. EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (NVIDIA Corporation)
- 18092081. CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRONIC DEVICES simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18093880. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18093900. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18094112. NANOWIRE LED, DISPLAY MODULE INCLUDING THE NANOWIRE LED, AND METHOD FOR MANUFACTURING THE DISPLAY MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094794. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18098158. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18098803. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18098979. SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract (Infineon Technologies AG)
- 18098987. SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099092. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18099097. SEMICONDUCTOR MANUFACTURING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099663. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18099697. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18103676. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18105945. REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18108657. MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
- 18109392. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18111617. CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)