Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
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This category has only the following subcategory.
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Pages in category "H01L23/00"
The following 64 pages are in this category, out of 2,965 total.
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- 17383449. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17383690. SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17412625. Semiconductor Package And Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17431866. DISPLAY APPARATUS INCLUDING A LOW BRIGHTNESS AREA simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17443186. ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR DEVICES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17458573. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17460340. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17460908. CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461952. SEMICONDUCTOR DIE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461957. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17529646. INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE simplified abstract (International Business Machines Corporation)
- 17532754. PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17535664. MULTIPLE DIE ASSEMBLY simplified abstract (International Business Machines Corporation)
- 17543072. UNDERFILL VACUUM PROCESS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17564889. INTEGRATED SENSING AND DISPLAY SYSTEM simplified abstract (Meta Platforms Technologies, LLC)
- 17568361. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17570710. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17575124. SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17581194. SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17581251. SEAL RING STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17587605. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17622229. DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17650758. Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated Circuits simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17656011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17663683. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17669914. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17676866. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17677702. SEMICONDUCTOR DIE DIPPING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17680410. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17680877. SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17682465. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17690270. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17692831. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17699525. CHIP-ON-FILM PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17699931. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17700818. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17702259. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17703057. METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE simplified abstract (HYUNDAI MOTOR COMPANY)
- 17703057. METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE simplified abstract (KIA CORPORATION)
- 17704177. SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17707481. Semiconductor Devices and Methods of Manufacture simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17711705. Semiconductor Device And Method Of Manufacturing The Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17712358. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17714202. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17714490. SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17714714. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17717619. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17720064. SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17724124. WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MANUFACTURING THE IMAGING SYSTEM, AND ELECTRONIC APPARATUS INCLUDING THE IMAGING SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17725750. IMAGE SENSOR simplified abstract (Samsung Electronics Co., Ltd.)
- 17728275. IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17730550. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17730595. SEMICONDUCTOR LIGHT EMITTING DEVICE, DISPLAY APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17734700. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17735158. SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17739618. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17740422. DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 17740508. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)