Category:H01L21/768
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Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- Subgroup H01L21/768: Processes or apparatus for applying a liquid or other fluent material to semiconductor wafers
This classification involves processes or apparatuses specifically adapted for manufacturing semiconductor devices, focusing on the application of liquids or other fluent materials to semiconductor wafers, crucial in the production of modern electronic components.
Pages in category "H01L21/768"
The following 33 pages are in this category, out of 1,264 total.
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- 17383690. SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17412625. Semiconductor Package And Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17446405. RESISTOR WITHIN A VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17453670. ELECTRONIC FUSE STRUCTURE EMBEDDED IN TOP VIA simplified abstract (International Business Machines Corporation)
- 17454378. DAMASCENE INTERCONNECT SPACER TO FACILITATE GAP FILL simplified abstract (International Business Machines Corporation)
- 17455576. RECESS STRUCTURE FOR PADLESS STACK VIA simplified abstract (QUALCOMM Incorporated)
- 17456016. ANTI-FUSE WITH LATERALLY EXTENDED LINER simplified abstract (International Business Machines Corporation)
- 17457444. TOP VIA WITH PROTECTIVE LINER simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17458884. SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17459799. CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17460709. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17460764. Forming Interconnect Structures in Semiconductor Devices simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461231. STRUCTURE AND METHOD FOR MULTIPLE BEOL K-VALUE DIELECTRIC simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17463000. Method of Forming A Semiconductor Device simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17480329. ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17494009. LOW VERTICAL RESISTANCE SINGLE DAMASCENE INTERCONNECT simplified abstract (International Business Machines Corporation)
- 17523086. MASKLESS ALIGNMENT SCHEME FOR BEOL MEMORY ARRAY MANUFACTURING simplified abstract (International Business Machines Corporation)
- 17524107. INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETCH PROCESSING simplified abstract (International Business Machines Corporation)
- 17527229. REPLACEMENT BURIED POWER RAIL simplified abstract (International Business Machines Corporation)
- 17528858. BOTTOM DIELECTRIC ISOLATION INTEGRATION WITH BURIED POWER RAIL simplified abstract (International Business Machines Corporation)
- 17530971. SELECTIVE METAL RESIDUE AND LINER CLEANSE FOR POST-SUBTRACTIVE ETCH simplified abstract (International Business Machines Corporation)
- 17531837. BURIED POWER RAIL AFTER REPLACEMENT METAL GATE simplified abstract (International Business Machines Corporation)
- 17532310. PARTIAL SUBTRACTIVE SUPERVIA ENABLING HYPER-SCALING simplified abstract (International Business Machines Corporation)
- 17534485. MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLYING DIELECTRIC LAYER simplified abstract (International Business Machines Corporation)
- 17534629. Reliability Macros for Contact Over Active Gate Layout Designs simplified abstract (International Business Machines Corporation)
- 17542563. SAM FORMULATIONS AND CLEANING TO PROMOTE QUICK DEPOSITIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17543964. BEOL INTERCONNECT SUBTRACTIVE ETCH SUPER VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17544136. SUBTRACTIVE LINE WITH DAMASCENE TOP VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17544337. Etch Back and Film Profile Shaping of Selective Dielectric Deposition simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17545073. BURIED POWER RAIL AT TIGHT CELL-TO-CELL SPACE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17546682. BARRIER LINER FREE INTERFACE FOR METAL VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17547669. DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17548773. DUAL-METAL ULTRA THICK METAL (UTM) STRUCTURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)