Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- 18748862. CONTAMINANT COLLECTION ON SOI simplified abstract (Texas Instruments Incorporated)
- 18749274. HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE simplified abstract (Intel Corporation)
- 18749516. PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18749542. JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18749794. LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18750258. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18750260. METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT simplified abstract (Infineon Technologies AG)
- 18750571. PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED INTERCONNECT BRIDGE simplified abstract (Intel Corporation)
- 18751061. THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18751336. MEMORY DEVICES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751359. PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751362. METHOD OF FORMING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751563. NONVOLATILE MEMORY DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18751724. CHIP PACKAGE STRUCTURE WITH LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18752388. THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGULATOR POWER DELIVERY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18752525. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18753091. CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18753139. METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18754434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18754605. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18754706. BACKSIDE CAPACITOR TECHNIQUES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18755306. METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract (Intel Corporation)
- 18756034. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18757531. PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
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- 20240014087. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 20240014105. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240014161. CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES simplified abstract (Xilinx, Inc.)
- 20240014167. SUBSTRATE HOLDER AND BONDING SYSTEM simplified abstract (SHINKAWA LTD.)
- 20240014172. VERTICALLY MOUNTED DIE GROUPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240021578. WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD simplified abstract (ZHEJIANG LAB)
- 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- 20240030117. MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME simplified abstract (Qorvo US, Inc.)
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)
- 20240038716. SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL simplified abstract (Western Digital Technologies, Inc.)
- 20240038723. CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 20240047303. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047317. PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES simplified abstract (Littelfuse Semiconductor (Wuxi) Co., Ltd.)
- 20240047336. ELECTRONIC PACKAGE simplified abstract (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 20240047378. DISPLAY PANEL AND MOBILE TERMINAL simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 20240047383. SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF MANUFACTURING THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 20240047407. INTEGRATED CIRCUIT PACKAGE simplified abstract (STMicroelectronics (Grenoble 2) SAS)
- 20240047421. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047491. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- 20240049448. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 20240055310. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 20240055393. PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS simplified abstract (Invensas LLC)
- 20240055416. WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (SJ Semiconductor (Jiangyin) Corporation)
- 20240087976.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240087991.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240087998.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088003.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088006.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088032.Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (apple inc.)
3
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- Advanced micro devices, inc. (20240113004). CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET simplified abstract
- Advanced micro devices, inc. (20240113070). INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES simplified abstract
- ADVANCED MICRO DEVICES, INC. patent applications on April 4th, 2024
- Apple inc. (20240096648). Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract
- Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Apple inc. (20240105639). COMPRESSION STRUCTURES FOR IC PACKAGES simplified abstract
- Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240161804). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract
- Apple inc. (20240162182). Asymmetric Stackup Structure for SoC Package Substrates simplified abstract
- Apple inc. (20240243012). Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module simplified abstract
- Apple inc. (20240243113). THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD simplified abstract
- Apple inc. (20240249989). Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract
- Apple inc. (20240310635). Hybrid Displays simplified abstract
- Apple inc. (20240315054). Upside-Down DRAM Package Structure simplified abstract
- Apple inc. (20240332319). Electronic Devices with Displays and Conductive Traces simplified abstract
- Apple inc. (20240347516). MICRO LED BASED DISPLAY PANEL simplified abstract
- Apple Inc. patent applications on February 1st, 2024
- Apple Inc. patent applications on January 25th, 2024
- Apple Inc. patent applications on July 18th, 2024
- Apple Inc. patent applications on July 25th, 2024
- Apple Inc. patent applications on March 14th, 2024
- Apple Inc. patent applications on March 21st, 2024
- Apple Inc. patent applications on March 28th, 2024
- Apple Inc. patent applications on May 16th, 2024
- Apple Inc. patent applications on October 17th, 2024
- Apple Inc. patent applications on October 3rd, 2024
- Apple Inc. patent applications on September 19th, 2024
- Applied materials, inc. (20240266231). CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract
- Applied Materials, Inc. patent applications on August 8th, 2024
- Audio Technologies patent applications on 13th Sep 2024
- Audio Technologies patent applications on September 12th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
- Blockchain patent applications on May 16th, 2024
- Boe technology group co., ltd. (20240339444). LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE simplified abstract
- BOE Technology Group Co., Ltd. patent applications on October 10th, 2024
C
- Canon kabushiki kaisha (20240105643). CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS simplified abstract
- Canon kabushiki kaisha (20240178258). PHOTOELECTRIC CONVERSION APPARATUS simplified abstract
- Canon kabushiki kaisha (20240178265). SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240194636). BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240213211). STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract
- Canon kabushiki kaisha (20240222351). METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract
- Canon kabushiki kaisha (20240243094). BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM simplified abstract
- Canon kabushiki kaisha (20240250105). SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract
- Canon kabushiki kaisha (20240260167). ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT simplified abstract
- Canon kabushiki kaisha (20240284064). PHOTOELECTRIC CONVERSION DEVICE simplified abstract
- Canon kabushiki kaisha (20240313025). PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVABLE BODY simplified abstract
- Canon kabushiki kaisha (20240347565). ELECTRONIC COMPONENT AND EQUIPMENT simplified abstract
- CANON KABUSHIKI KAISHA patent applications on August 1st, 2024
- CANON KABUSHIKI KAISHA patent applications on August 22nd, 2024
- CANON KABUSHIKI KAISHA patent applications on July 18th, 2024
- CANON KABUSHIKI KAISHA patent applications on July 25th, 2024
- CANON KABUSHIKI KAISHA patent applications on July 4th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 13th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 27th, 2024
- CANON KABUSHIKI KAISHA patent applications on March 28th, 2024
- CANON KABUSHIKI KAISHA patent applications on May 30th, 2024
- CANON KABUSHIKI KAISHA patent applications on October 17th, 2024
- CANON KABUSHIKI KAISHA patent applications on September 19th, 2024
- Capital one services, llc (20240256818). SYSTEMS AND METHODS FOR USE OF CAPACITIVE MEMBER TO PREVENT CHIP FRAUD simplified abstract
- Capital One Services, LLC patent applications on August 1st, 2024
- Chengdu boe optoelectronics technology co., ltd. (20240213181). DISPLAY PANEL AND DISPLAY DEVICE simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240243083). DRIVER IC AND DISPLAY DEVICE simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240304586). CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR simplified abstract
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on July 18th, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on June 27th, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on September 12th, 2024
D
- Delphi technologies ip limited (20240105533). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240105534). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240105553). SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS simplified abstract
- Delphi technologies ip limited (20240105684). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Denso corporation (20240258264). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- DENSO CORPORATION patent applications on August 1st, 2024
G
- Gm global technology operations llc (20240234239). COOLED POWER MODULE simplified abstract
- GM Global Technology Operations LLC patent applications on July 11th, 2024
- Google llc (20240162179). PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract
- Google llc (20240186214). Three Dimensional IC Package with Thermal Enhancement simplified abstract
- Google llc (20240194532). MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract
- Google llc (20240194661). MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract
- Google llc (20240290763). Pluggable CPU Modules with Vertical Power simplified abstract
- Google llc (20240347414). Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract
- Google LLC patent applications on August 29th, 2024
- GOOGLE LLC patent applications on February 15th, 2024
- GOOGLE LLC patent applications on February 1st, 2024
- Google LLC patent applications on June 13th, 2024
- Google LLC patent applications on June 6th, 2024
- Google LLC patent applications on May 16th, 2024
- GOOGLE LLC patent applications on October 17th, 2024
H
- Honor device co., ltd. (20240250016). Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract
- Honor Device Co., Ltd. patent applications on July 25th, 2024
- Huawei technologies co., ltd. (20240178103). Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240178167). CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE simplified abstract
- Huawei technologies co., ltd. (20240178187). CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240213203). CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240218548). ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF simplified abstract
- Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240274688). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLIFICATION CIRCUIT, AND ELECTRONIC DEVICE simplified abstract
- Huawei technologies co., ltd. (20240321771). CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract
- Huawei Technologies Co., Ltd. patent applications on August 15th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 15th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 29th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 8th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on July 4th, 2024
- Huawei Technologies Co., Ltd. patent applications on June 27th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
- Hyundai motor company (20240105573). POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Hyundai motor company (20240120269). POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
- HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
- HYUNDAI MOTOR COMPANY patent applications on June 6th, 2024
- Hyundai Motor Company patent applications on March 28th, 2024
I
- IMEC VZW (20240297136). METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE simplified abstract
- Infineon technologies ag (20240248071). SENSOR FOR MEASURING A GAS PROPERTY simplified abstract
- Infineon technologies ag (20240250056). SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract
- Infineon Technologies AG patent applications on July 25th, 2024
- Innolux corporation (20240297132). SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
- InnoLux Corporation patent applications on September 5th, 2024
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113039). BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract
- Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113073). SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract