Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,684 total.
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- 18570678. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583066. POWER MANAGEMENT simplified abstract (Micron Technology, Inc.)
- 18583467. MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18583743. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583892. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18584044. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18584148. ELECTRONIC DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18584469. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18584488. SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18585211. Interconnect Layout for Semiconductor Device simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18585629. PROCESS FOR THIN FILM CAPACITOR INTEGRATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18586209. MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18586366. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18586425. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18587331. FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract (Intel Corporation)
- 18587407. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587908. VERTICALLY MOUNTED DIE GROUPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18588699. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18589254. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18590242. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)
- 18590302. DISPLAY DEVICE INCLUDING DISPLAY MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18590718. SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18591336. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18591438. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18591580. SEMICONDUCTOR MODULE ARRANGEMENT simplified abstract (Infineon Technologies AG)
- 18592124. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18592442. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18592829. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593467. VERTICAL MEMORY DEVICES simplified abstract (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)
- 18594573. THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME simplified abstract (MEDIATEK Inc.)
- 18594605. SEMICONDUCTOR DEVICE FOR AUDIO simplified abstract (ROHM Co., LTD.)
- 18594742. SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18595321. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18595341. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18595666. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18595729. POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
- 18596343. IMAGING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18596399. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18596404. 3D IC POWER GRID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)
- 18596514. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18596528. SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18596600. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18598077. SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18598167. SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598266. Semiconductor Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598735. TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18599147. Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract (Intel Corporation)
- 18599469. CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18599734. EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18600146. MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
- 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)
- 18602185. METHOD FOR FORMING A PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602392. INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602553. SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18602665. VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602718. Package-On-Package Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18603032. PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVABLE BODY simplified abstract (CANON KABUSHIKI KAISHA)
- 18603047. ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18603099. STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18603174. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603181. OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18603549. Channel Manufacturing Method simplified abstract (SEIKO EPSON CORPORATION)
- 18603779. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18604613. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18605500. SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18605947. Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18606876. CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS simplified abstract (Intel Corporation)
- 18608191. Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same simplified abstract (Lodestar Licensing Group LLC)
- 18608296. METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18608868. SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract (MICRON TECHNOLOGY, INC.)
- 18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18610104. OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract (Intel Corporation)
- 18610263. SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDING SURFACES, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18611413. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18612193. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18612304. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18613954. BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614756. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614965. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18615528. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SK Hynix Inc.)
- 18615654. HYPERCHIP simplified abstract (Intel Corporation)
- 18615907. THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616212. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616773. SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18617040. ELECTRONIC DEVICE simplified abstract (ROHM CO., LTD.)
- 18617517. ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES simplified abstract (Texas Instruments Incorporated)
- 18617530. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18618024. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME simplified abstract (InnoLux Corporation)
- 18618029. STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SK Hynix Inc.)
- 18618133. SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract (Samsung Electronics Co., Ltd.)
- 18618181. ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18620569. METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (Intel Corporation)
- 18621323. DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18622153. POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract (ROHM CO., LTD.)
- 18622486. COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract (Intel Corporation)
- 18622511. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18623992. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624954. WAFER BONDING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18626145. SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18628804. INTERPOSER WITH WARPAGE-RELIEF TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18634014. DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECOND STRUCTURE HAVING GATE LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18635315. CHIPLET INTERPOSER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637061. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18638947. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18642173. BUMP STRUCTURE AND METHOD OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18646951. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648599. PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER simplified abstract (Texas Instruments Incorporated)
- 18648971. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., LTD.)
- 18649331. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18649389. CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract (Intel Corporation)
- 18650144. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18650225. SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18650641. SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract (SK hynix Inc.)
- 18650794. SEMICONDUCTOR PACKAGE simplified abstract (ROHM CO., LTD.)
- 18650970. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651064. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651159. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651321. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18651718. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651815. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
- 18652315. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652365. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652515. APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18652529. METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18652779. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652832. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652836. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652868. PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652969. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18653496. ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18653575. DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18654247. NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION simplified abstract (Texas Instruments Incorporated)
- 18654268. Structure and Method of Forming a Joint Assembly simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18657689. ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE simplified abstract (Texas Instruments Incorporated)
- 18659400. SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18660190. SEMICONDUCTOR DIE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18660967. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18661700. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662075. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662586. PACKAGE STRUCTURE WITH A BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662916. METHODS OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663670. METHODS OF FORMING SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663782. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18665806. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666798. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667009. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18668408. SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18668658. METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS BETWEEN STACKING DIES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668687. CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668922. BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669118. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18669679. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18669914. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18671330. SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18671649. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18671793. Hybrid Displays simplified abstract (Apple Inc.)
- 18672001. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18673328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674610. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18674891. SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674904. METHOD FOR FABRICATING HYBRID BONDED STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675097. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675560. SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675679. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18675785. CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676343. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18677075. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18682829. CIRCUIT BOARD simplified abstract (LG Innotek Co.,LTD.)
2
- 20240014087. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 20240014105. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240014161. CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES simplified abstract (Xilinx, Inc.)
- 20240014167. SUBSTRATE HOLDER AND BONDING SYSTEM simplified abstract (SHINKAWA LTD.)
- 20240014172. VERTICALLY MOUNTED DIE GROUPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240021578. WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD simplified abstract (ZHEJIANG LAB)
- 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- 20240030117. MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME simplified abstract (Qorvo US, Inc.)
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)