Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,965 total.
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- 18532064. STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18532726. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18533800. STACKED SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18534143. UNIVERSAL CHIP WITH VARIABLE PACKAGING simplified abstract (Meta Platforms Technologies, LLC)
- 18535231. SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN simplified abstract (Samsung Electronics Co., Ltd.)
- 18535339. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18535360. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18535893. PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract (Google LLC)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
- 18537548. DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18537672. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18538483. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538641. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538889. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18539036. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18541147. SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract (Samsung Electronics Co., Ltd.)
- 18543110. CHIP STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543124. CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543749. Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract (Intel Corporation)
- 18546631. SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18550857. Light-Receiving Element and Light Receiving Circuit simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18552398. GRAPHITE SHEET AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18554244. SEMICONDUCTOR DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18556265. POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18557573. PHOTODETECTOR AND DISTANCE MEASUREMENT APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18558079. Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18559516. HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract (Mitsubishi Electric Corporation)
- 18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 18561297. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18562502. SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18566303. Semiconductor Device and Manufacturing Method for Semiconductor Device simplified abstract (HITACHI ASTEMO, LTD.)
- 18570074. FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18570678. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18577884. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583066. POWER MANAGEMENT simplified abstract (Micron Technology, Inc.)
- 18583467. MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18583743. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583892. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18584044. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18584148. ELECTRONIC DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18584469. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18584488. SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18585211. Interconnect Layout for Semiconductor Device simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18585629. PROCESS FOR THIN FILM CAPACITOR INTEGRATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18586209. MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18586366. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18586425. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18587331. FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract (Intel Corporation)
- 18587407. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587908. VERTICALLY MOUNTED DIE GROUPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18588091. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
- 18588352. HIGH VOLTAGE DIODES FOR WAFER ON WAFER PACKAGING OF SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18588547. SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18588573. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PROVIDING CHIPSET simplified abstract (Renesas Electronics Corporation)
- 18588699. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18589254. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18589300. SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18590242. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)
- 18590302. DISPLAY DEVICE INCLUDING DISPLAY MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18590491. Method of Backgrind Tape Planarization Using Heated Press simplified abstract (Texas Instruments Incorporated)
- 18590718. SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18591336. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18591438. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18591580. SEMICONDUCTOR MODULE ARRANGEMENT simplified abstract (Infineon Technologies AG)
- 18592124. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18592442. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18592829. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18592860. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593467. VERTICAL MEMORY DEVICES simplified abstract (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)
- 18594446. ELECTRONIC DEVICE simplified abstract (MEDIATEK INC.)
- 18594573. THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME simplified abstract (MEDIATEK Inc.)
- 18594605. SEMICONDUCTOR DEVICE FOR AUDIO simplified abstract (ROHM Co., LTD.)
- 18594742. SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18595303. STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595321. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18595329. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595341. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18595666. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18595729. POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
- 18596240. THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18596343. IMAGING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18596399. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18596404. 3D IC POWER GRID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18596484. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)
- 18596514. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18596528. SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18596600. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18596794. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18596794. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18598077. SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP simplified abstract (Samsung Electronics Co., Ltd.)
- 18598167. SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598266. Semiconductor Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598735. TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18599147. Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract (Intel Corporation)
- 18599469. CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18599734. EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18599802. MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18600146. MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
- 18601216. ELECTRONIC DEVICE simplified abstract (STMicroelectronics International N.V.)
- 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)
- 18602185. METHOD FOR FORMING A PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602392. INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602553. SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18602665. VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602718. Package-On-Package Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18603032. PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVABLE BODY simplified abstract (CANON KABUSHIKI KAISHA)
- 18603047. ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18603099. STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18603113. METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS simplified abstract (STMicroelectronics International N.V.)
- 18603174. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603181. OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18603549. Channel Manufacturing Method simplified abstract (SEIKO EPSON CORPORATION)
- 18603628. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18603779. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18604613. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604807. Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height simplified abstract (TE Connectivity Solutions GmbH)
- 18604848. SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18605500. SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18605947. Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18605956. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18606534. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18606843. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18606876. CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS simplified abstract (Intel Corporation)
- 18607170. PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18607849. CHIP-ON-FILM PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18607907. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18607941. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18608191. Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same simplified abstract (Lodestar Licensing Group LLC)
- 18608296. METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18608868. SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract (MICRON TECHNOLOGY, INC.)
- 18609073. SEMICONDUCTOR DEVICE PERFORMING CLOCK GATING AND OPERATING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18609255. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18610104. OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract (Intel Corporation)
- 18610263. SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDING SURFACES, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18610282. SEMICONDUCTOR MEMORY simplified abstract (Kioxia Corporation)
- 18611413. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18611499. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612137. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18612193. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION SUBSTRATE AND A METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18612282. PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18612304. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612492. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18612648. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18613414. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18613954. BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614285. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18614450. INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBERANCE, AND CORRESPONDING METHOD simplified abstract (Murata Manufacturing Co., Ltd.)
- 18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614756. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18614965. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18615528. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SK Hynix Inc.)
- 18615654. HYPERCHIP simplified abstract (Intel Corporation)
- 18615907. THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616212. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18616773. SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18617040. ELECTRONIC DEVICE simplified abstract (ROHM CO., LTD.)
- 18617517. ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES simplified abstract (Texas Instruments Incorporated)
- 18617530. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18618024. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME simplified abstract (InnoLux Corporation)
- 18618029. STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SK Hynix Inc.)
- 18618133. SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract (Samsung Electronics Co., Ltd.)
- 18618181. ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18620569. METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract (Intel Corporation)
- 18621323. DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18621323. DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 18622153. POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract (ROHM CO., LTD.)
- 18622486. COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract (Intel Corporation)
- 18622511. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18623992. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624954. WAFER BONDING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18626145. SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18628804. INTERPOSER WITH WARPAGE-RELIEF TRENCHES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18634014. DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECOND STRUCTURE HAVING GATE LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18635315. CHIPLET INTERPOSER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637061. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18638947. SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18642173. BUMP STRUCTURE AND METHOD OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18646951. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)