Category:H01L21/768
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Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- Subgroup H01L21/768: Processes or apparatus for applying a liquid or other fluent material to semiconductor wafers
This classification involves processes or apparatuses specifically adapted for manufacturing semiconductor devices, focusing on the application of liquids or other fluent materials to semiconductor wafers, crucial in the production of modern electronic components.
Pages in category "H01L21/768"
The following 200 pages are in this category, out of 1,264 total.
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- 18517263. SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE simplified abstract (SONY GROUP CORPORATION)
- 18517277. COMPACT ELECTRICAL CONNECTION THAT CAN BE USED TO FORM AN SRAM CELL AND METHOD OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18517298. MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18517706. DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18518081. Metal Contact Structure and Method of Forming the Same in a Semiconductor Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518170. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518706. SHARED WELL STRUCTURE MANUFACTURING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518790. CHIP PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519256. METHOD FOR OBTAINING AN INTEGRATED DEVICE COMPRISING USING AN ETCHING MASK TO DEFINE DICING LINES simplified abstract (Murata Manufacturing Co., Ltd.)
- 18519516. SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519862. CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18519872. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18520427. MRAM DEVICE STRUCTURES AND METHODS OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520872. DEVICE LAYER INTERCONNECTS simplified abstract (Intel Corporation)
- 18520996. Source/Drain Metal Contact and Formation Thereof simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521701. SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18523401. WORDLINE CONTACT FORMATION FOR NAND DEVICE simplified abstract (Applied Materials, Inc.)
- 18523457. METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18524621. MODIFIED FUSE STRUCTURE AND METHOD OF USE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18524668. INTEGRATED CIRCUIT DIE WITH MEMORY MACRO INCLUDING THROUGH-SILICON VIA AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18524767. FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING simplified abstract (TOKYO ELECTRON LIMITED)
- 18525473. Semiconductor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18525597. METHODS OF FORMING ELECTRONIC DEVICES INCLUDING RECESSED CONDUCTIVE STRUCTURES AND RELATED SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18526395. SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN CONTACT HAVING HEIGHT BELOW GATE STACK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526828. CONTACT AIR GAP FORMATION AND STRUCTURES THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18529024. SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTRODE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18532619. Trench FET Device and Method of Manufacturing Trench FET Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18533635. METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18534333. POST-TREATMENT FOR REMOVING RESIDUES FROM DIELECTRIC SURFACE simplified abstract (Applied Materials, Inc.)
- 18535623. INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES simplified abstract (Intel Corporation)
- 18537896. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18541091. METHOD OF SELECTIVELY FORMING LAYER USING ATOMIC LAYER DEPOSITION AND METHOD OF FORMING INTERCONNECT OF SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18543124. CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543432. METHOD AND STRUCTURE OF CUT END WITH SELF-ALIGNED DOUBLE PATTERNING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543934. Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18544812. CONTACT RESISTANCE REDUCTION BY INTEGRATION OF MOLYBDENUM WITH TITANIUM simplified abstract (Applied Materials, Inc.)
- 18547344. SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE simplified abstract (Sony Group Corporation)
- 18555902. SEMICONDUCTOR DEVICE AND ETCHING METHOD simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18557144. SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM simplified abstract (Tokyo Electron Limited)
- 18557675. PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE TUNGSTEN FEATURES simplified abstract (Applied Materials, Inc.)
- 18558388. METHODS TO IMPROVE PRODUCTIVITY OF ADVANCED CVD W GAPFILL PROCESS simplified abstract (Applied Materials, Inc.)
- 18581162. CONTACT FORMATION METHOD AND RELATED STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18581598. METAL BASED HYDROGEN BARRIER simplified abstract (Applied Materials, Inc.)
- 18581604. Methods, Structures and Devices for Intra-Connection Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18582746. SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583194. METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583743. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18586918. POWER CELL FOR SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18586925. SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587407. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587477. Methods for Forming Stacked Layers and Devices Formed Thereof simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18587825. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18594816. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18594864. METAL-INSULATOR-METAL STRUCTURE AND METHODS OF FABRICATION THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18595281. MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS OF TIERED STACKS, AND RELATED METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18595951. SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES simplified abstract (Applied Materials, Inc.)
- 18596731. INTEGRATED CIRCUITS HAVING CROSS-COUPLE CONSTRUCTS AND SEMICONDUCTOR DEVICES INCLUDING INTEGRATED CIRCUITS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18597065. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598173. SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598322. Method of Forming Conductive Feature Including Cleaning Step simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18599522. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18599597. ON-CHIP CAPACITORS IN SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18600031. SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18600197. GRAPHENE BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18601027. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18601433. VIA CONNECTION TO A PARTIALLY FILLED TRENCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602392. INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602665. VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603174. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603483. SEMICONDUCTOR DEVICE STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604071. SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604310. STRUCTURE AND METHOD FOR INTERLEVEL DIELECTRIC LAYER WITH REGIONS OF DIFFERING DIELECTRIC CONSTANT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18604557. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18606335. INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18608005. SELECTIVE COBALT DEPOSITION ON COPPER SURFACES simplified abstract (Applied Materials, Inc.)
- 18608296. METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18608349. Semiconductor Structure Having High Breakdown Voltage Etch-Stop Layer simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18608560. CONTROLLING THRESHOLD VOLTAGES THROUGH BLOCKING LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18609234. INTEGRATED CIRCUIT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18611843. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612228. INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18613592. THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18615151. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS simplified abstract (SONY GROUP CORPORATION)
- 18615177. INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18615303. METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18615718. METHOD FOR MANUFACTURING A MEMORY DEVICE AND MEMORY DEVICE MANUFACTURED THROUGH THE SAME METHOD simplified abstract (Micron Technology, Inc.)
- 18616195. SEMICONDUCTOR STRUCTURE WITH VIA EXTENDING ACROSS ADJACENT CONDUCTIVE LINES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616449. SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616741. VOID FREE LOW STRESS FILL simplified abstract (Lam Research Corporation)
- 18617499. SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC) STRUCTURES simplified abstract (Texas Instruments Incorporated)
- 18617530. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18618044. Selective Deposition of Barrier Layer simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18618451. SEMICONDUCTOR DEVICE INCLUDING STACK STRUCTURE AND TRENCHES simplified abstract (Samsung Electronics Co., Ltd.)
- 18618815. SELF-ALIGNED BARRIER FOR METAL VIAS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18622500. VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18623507. METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18623697. SELF-ALIGNED BACKSIDE SOURCE CONTACT STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18623992. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624721. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SK hynix Inc.)
- 18626864. INTEGRATED METHOD AND TOOL FOR HIGH QUALITY SELECTIVE SILICON NITRIDE DEPOSITION simplified abstract (Applied Materials, Inc.)
- 18628112. AIR SPACERS FOR SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18629122. Contact Structures In Semiconductor Devices simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18630164. INTERCONNECTION STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637874. SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639575. METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639948. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18640636. SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18645434. INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18645455. 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648884. BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648979. PHASE CONTROL IN CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18649389. CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS simplified abstract (Intel Corporation)
- 18649541. SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18649986. SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT simplified abstract (Micron Technology, Inc.)
- 18650157. METALLIZATION LAYER AND FABRICATION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18650166. MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18653815. GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME simplified abstract (Intel Corporation)
- 18657243. SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18661874. Conductive Feature Formation and Structure simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662083. SEMI-DAMASCENE STRUCTURE WITH DIELECTRIC HARDMASK LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18662437. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663038. DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663364. Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material simplified abstract (Micron Technology, Inc.)
- 18663670. METHODS OF FORMING SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663878. DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664402. RING STRUCTURE FOR FILM RESISTOR simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666798. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666835. SEMICONDUCTOR DEVICE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18668038. SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS simplified abstract (Intel Corporation)
- 18668042. MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES simplified abstract (Intel Corporation)
- 18668687. CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668816. INTEGRATED CIRCUIT STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18670557. SEMICONDUCTOR DEVICE WITH METAL CAP ON GATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18671580. Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18671732. Contact Structures With Deposited Silicide Layers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18672076. SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATION THAN A LOCAL INTERCONNECT LINE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18672083. METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18673578. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674066. COBALT FILL FOR GATE STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675030. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18675406. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676056. Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract (Micron Technology, Inc.)
- 18679002. SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
2
- 20240014105. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240030042. DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK simplified abstract (Unknown Organization)
- 20240038583. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 20240047579. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240049388. SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS simplified abstract (DexCom, Inc.)
- 20240055350. ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 20240087884.SEMICONDUCTOR DEVICE INCLUDING EPITAXIAL REGION simplified abstract (samsung electronics co., ltd.)
- 20240087956.SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (samsung electronics co., ltd.)
A
- Advanced micro devices, inc. (20240113022). POWER VIA WITH REDUCED RESISTANCE simplified abstract
- ADVANCED MICRO DEVICES, INC. patent applications on April 4th, 2024
- Applied materials, inc. (20240249934). INTEGRATED METHOD AND TOOL FOR HIGH QUALITY SELECTIVE SILICON NITRIDE DEPOSITION simplified abstract
- Applied materials, inc. (20240249936). METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DEVICES simplified abstract
- Applied materials, inc. (20240254645). LOW TEMPERATURE HYBRID BONDING METALLIZATION simplified abstract
- Applied materials, inc. (20240258103). PLASMA TREATMENT OF BARRIER AND LINER LAYERS simplified abstract
- Applied materials, inc. (20240258161). METHODS OF FORMING INTERCONNECT STRUCTURES simplified abstract
- Applied materials, inc. (20240258164). METHODS OF FORMING INTERCONNECT STRUCTURES simplified abstract
- Applied materials, inc. (20240266175). CARBON AND BORON IMPLANTATION FOR BACKSIDE CHEMICAL MECHANICAL PLANARIZATION CONTROL simplified abstract
- Applied materials, inc. (20240266215). LOW STRESS TUNGSTEN LAYER DEPOSITION simplified abstract
- Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract
- Applied materials, inc. (20240282631). INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL simplified abstract
- Applied materials, inc. (20240282632). ELECTRONIC DEVICE FABRICATION USING AREA-SELECTIVE DEPOSITION simplified abstract
- Applied materials, inc. (20240282709). Layered Substrate with Ruthenium Layer and Method for Producing simplified abstract
- Applied materials, inc. (20240304495). HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES simplified abstract
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on September 12th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on May 16th, 2024
- Boe technology group co., ltd. (20240162138). METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE simplified abstract
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on May 16th, 2024
G
H
- Huawei technologies co., ltd. (20240113186). Trench FET Device and Method of Manufacturing Trench FET Device simplified abstract
- Huawei technologies co., ltd. (20240178103). Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract
- Huawei technologies co., ltd. (20240274688). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLIFICATION CIRCUIT, AND ELECTRONIC DEVICE simplified abstract
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on April 4th, 2024
- Huawei Technologies Co., Ltd. patent applications on August 15th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024