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Category:H01L21/67
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Pages in category "H01L21/67"
The following 200 pages are in this category, out of 655 total.
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- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511070. DISPLACEMENT CONTROL DEVICE FOR SEISMIC EVENTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513560. SUBSTRATE TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract (SEMES CO., LTD.)
- 18514859. SPACE FILLING DEVICE FOR WET BENCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515842. Semiconductor Device, Method and Machine of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18515867. SUBSTRATE HEATER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (SEMES CO., LTD.)
- 18516703. SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516821. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
- 18516895. CARRIAGE SYSTEM CONTROL METHOD AND CARRIAGE SYSTEM CONTROL APPARATUS simplified abstract (SEMES CO., LTD.)
- 18517194. SEMICONDUCTOR WAFER CLEANING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517457. SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518393. SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18519519. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (TOKYO ELECTRON LIMITED)
- 18519913. REFLECTOR PLATE FOR SUBSTRATE PROCESSING simplified abstract (Applied Materials, Inc.)
- 18520047. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18522132. EQUIPMENT FRONT-END MODULES FOR SEMICONDUCTOR PROCESSING SYSTEMS AND METHODS OF MAKING SEMICONDUCTOR PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18522152. LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING LOAD LOCK ARRANGEMENTS, AND METHODS OF MAKING LOAD LOCKS FOR SEMICONDUCTOR PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18522675. HUMIDITY CONTROL DEVICE IN PROCESS SPACE, HUMIDITY CONTROL SYSTEM INCLUDING THE SAME, AND HUMIDITY CONTROL METHOD IN PROCESS SPACE simplified abstract (SEMES CO., LTD.)
- 18523021. HIGH-THROUGHPUT SILICON CARBIDE REACTOR simplified abstract (ASM IP Holding B.V.)
- 18523172. METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING simplified abstract (ASM IP Holding B.V.)
- 18523394. SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION simplified abstract (Applied Materials, Inc.)
- 18523474. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SCREEN Holdings Co., Ltd.)
- 18524082. TRANSFER SYSTEM, PROCESSING SYSTEM, AND TRANSFER METHOD simplified abstract (Tokyo Electron Limited)
- 18524164. PHOTORESIST COATING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18524726. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SEMES CO., LTD.)
- 18525207. VAPORIZER, PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kokusai Electric Corporation)
- 18525309. METHOD FOR CALCULATING THROUGHPUT IN SEMICONDUCTOR MANUFACTURING APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND COMPUTER PROGRAM PRODUCT simplified abstract (EBARA CORPORATION)
- 18526472. SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18527552. BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18527663. ADDITIVE PROCESS FOR CIRCULAR PRINTING simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18529057. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18531929. SILICON CARBIDE WAFER MANUFACTURING APPARATUS simplified abstract (DENSO CORPORATION)
- 18531929. SILICON CARBIDE WAFER MANUFACTURING APPARATUS simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18533256. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18534223. LED-CHIP SORTING DEVICE AND LED CHIP MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18537574. METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18537661. SUBSTRATE PROCESSING APPARATUS simplified abstract (SEMES CO., LTD.)
- 18538419. INTERNAL PRESSURE CONTROL APPARATUS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18539634. SUBSTRATE TREATING APPARATUS simplified abstract (SEMES CO., LTD.)
- 18541635. LIQUID CHEMICAL RECYCLE SYSTEM, LIQUID CHEMICAL SUPPLY SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE LIQUID CHEMICAL RECYCLE SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18542665. SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD simplified abstract (SEMES CO., LTD.)
- 18543499. SUBSTRATE PROCESSING DEVICE simplified abstract (SEMES CO., LTD.)
- 18544315. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Samsung Display Co., LTD.)
- 18545919. SUBSTRATE PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18547470. SUBSTRATE RESTRAINING SYSTEM simplified abstract (ASML NETHERLANDS B.V.)
- 18547888. FILM FORMING METHOD, PROCESSING APPARATUS, AND PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18551287. PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD simplified abstract (Tokyo Electron Limited)
- 18552108. SUBSTRATE LIQUID-TREATMENT DEVICE simplified abstract (Tokyo Electron Limited)
- 18557675. PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE TUNGSTEN FEATURES simplified abstract (Applied Materials, Inc.)
- 18559313. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE simplified abstract (Lam Research Corporation)
- 18562211. Single-Pick-Multiple-Print Micro LED Mass Transfer with Elastomer Stamp simplified abstract (Apple Inc.)
- 18563666. APPARATUSES FOR THERMAL MANAGEMENT OF A PEDESTAL AND CHAMBER simplified abstract (Lam Research Corporation)
- 18566183. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18571803. ELECTRICAL ARRANGEMENT WITH A POSITIONING AID, AND PRODUCTION METHOD simplified abstract (Robert Bosch GmbH)
- 18572075. IMAGE ANALYSIS OF PLASMA CONDITIONS simplified abstract (Lam Research Corporation)
- 18581154. SYSTEM AND METHOD FOR BACKSIDE DEPOSITION OF A SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18584828. APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18585352. APPARATUS FOR MANUFACTURING DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18585466. SUBSTRATE PROCESSING APPARATUS, MODEL DATA GENERATION APPARATUS, SUBSTRATE PROCESSING METHOD, AND MODEL DATA GENERATION METHOD simplified abstract (Tokyo Electron Limited)
- 18586209. MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18586310. AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER simplified abstract (Applied Materials, Inc.)
- 18586372. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18588356. PROCESSING SYSTEM AND TRANSFER METHOD simplified abstract (Tokyo Electron Limited)
- 18589750. SUBSTRATE PROCESSING DEVICE simplified abstract (Kioxia Corporation)
- 18589845. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18590235. SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Kioxia Corporation)
- 18592988. SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18595341. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18595913. METHODS FOR COATING A SUBSTRATE WITH MAGNESIUM FLUORIDE VIA ATOMIC LAYER DEPOSITION simplified abstract (CORNING INCORPORATED)
- 18598273. BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD simplified abstract (Tokyo Electron Limited)
- 18599767. Processing Chamber With Multiple Plasma Units simplified abstract (Applied Materials, Inc.)
- 18600219. ELECTROSTATIC CHUCK WITH MULTIPLE RADIO FREQUENCY MESHES TO CONTROL PLASMA UNIFORMITY simplified abstract (Applied Materials, Inc.)
- 18600829. TRANSFER APPARATUS simplified abstract (Tokyo Electron Limited)
- 18601017. VALVE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18601670. ZONE-BASED CMP TARGET CONTROL simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602099. CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18604127. METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604257. CAPACITIVE SENSOR FOR MONITORING GAS CONCENTRATION simplified abstract (Applied Materials, Inc.)
- 18604923. ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18605526. NORMAL-INCIDENCE IN-SITU PROCESS MONITOR SENSOR simplified abstract (Tokyo Electron Limited)
- 18605574. TREATMENT SOLUTION AND TREATMENT METHOD simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18605574. TREATMENT SOLUTION AND TREATMENT METHOD simplified abstract (TOHOKU UNIVERSITY)
- 18605837. POWER SUPPLY SYSTEM FOR SEMICONDUCTOR MANUFACTURING SYSTEM GROUP simplified abstract (Tokyo Electron Limited)
- 18605892. SUBSTRATE TRANSFER SYSTEM simplified abstract (Tokyo Electron Limited)
- 18607400. TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING APPARATUS, AND LIQUID AMOUNT CONTROL METHOD simplified abstract (Tokyo Electron Limited)
- 18608043. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18608198. CEILING HEATER, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Kokusai Electric Corporation)
- 18609164. APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF TRANSFERRING SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18610612. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18612221. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18615249. WAFER LIFT PIN SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18616255. CHEMICAL-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING HYDROXYARYL-TERMINATED POLYMER simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18617960. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18624608. LIGHT-EMITTING DEVICE simplified abstract (Innolux Corporation)
- 18625330. EFEM ROBOT AUTO TEACHING METHODOLOGY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18626565. SUBSTRATE TRANSFER MECHANISM AND SUBSTRATE TRANSFERRING METHOD simplified abstract (Tokyo Electron Limited)
- 18627313. APPARATUS AND METHODS FOR EXHAUST CLEANING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18640118. METHOD FOR MAPPING WAFERS IN A WAFER CARRIER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18640481. WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18645658. Liquid Crystal Display Device simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18653097. FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN simplified abstract (Applied Materials, Inc.)
- 18653955. METHODS OF SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH ACTIVE STEAM GENERATION simplified abstract (Applied Materials, Inc.)
- 18656987. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18661609. PROGRESSIVE THERMAL DRYING CHAMBER FOR QUANTUM CIRCUITS simplified abstract (Microsoft Technology Licensing, LLC)
- 18663364. Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material simplified abstract (Micron Technology, Inc.)
- 18663776. POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18665683. HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18666299. METHOD AND DEVICE FOR PROCESSING PRODUCT MANUFACTURING MESSAGES, ELECTRONIC DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18666335. Contamination Control In Semiconductor Manufacturing Systems simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666686. METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE simplified abstract (Applied Materials, Inc.)
- 18666710. HEATER LIFT ASSEMBLY SPRING DAMPER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669102. CHEMICAL MECHANICAL POLISHING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18673488. METHOD OF OPERATING A PROCESSING APPARATUS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676056. Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract (Micron Technology, Inc.)
- 18701058. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
2
- 20240014055. SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 20240021444. BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCTURES FOR EPITAXIAL DEPOSITION OPERATIONS simplified abstract (APPLIED MATERIALS, INC.)
- 20240038504. REPLACEABLE AND/OR COLLAPSIBLE EDGE RING ASSEMBLIES FOR PLASMA SHEATH TUNING INCORPORATING EDGE RING POSITIONING AND CENTERING FEATURES simplified abstract (Lam Research Corporation)
- 20240047232. HIGH CONDUCTANCE DIVERT LINE ARCHITECTURE simplified abstract (Applied Materials, Inc.)
- 20240047247. SEMICONDUCTOR PROCESS DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047253. SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240050990. APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE simplified abstract (SEMES CO., LTD.)
- 20240055284. PREDICTIVE WAFER SCHEDULING FOR MULTI-CHAMBER SEMICONDUCTOR EQUIPMENT simplified abstract (Applied Materials, Inc.)
- 20240087921.LIGHT IRRADIATION APPARATUS, SUBSTRATE DEBONDING SYSTEM INCLUDING THE SAME, AND SUBTRATED DEBONDING METHOD USING THE SAME simplified abstract (samsung electronics co., ltd.)
- 20240087923.CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (samsung electronics co., ltd.)
3
A
- Apple inc. (20240234181). Single-Pick-Multiple-Print Micro LED Mass Transfer with Elastomer Stamp simplified abstract
- Apple Inc. patent applications on July 11th, 2024
- Applied materials, inc. (20240248282). APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240248297). APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240248298). APPARATUS AND METHODS FOR HEATING TUNABILITY IN PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240249918). Processing Chamber With Multiple Plasma Units simplified abstract
- Applied materials, inc. (20240258097). PURGE SYSTEM TO CLEAN WAFER BACKSIDE FOR RING SUSCEPTOR simplified abstract
- Applied materials, inc. (20240258136). SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECE simplified abstract
- Applied materials, inc. (20240258137). SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT simplified abstract
- Applied materials, inc. (20240258140). METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE simplified abstract
- Applied materials, inc. (20240258141). METHODS AND APPARATUS FOR CALIBRATION OF SUBSTRATE PROCESSING CHAMBER PLACEMENT VIA IMAGING simplified abstract
- Applied materials, inc. (20240266163). TREATMENTS TO ENHANCE MATERIAL STRUCTURES simplified abstract
- Applied materials, inc. (20240266174). MITIGATION OF SADDLE DEFORMATION OF SUBSTRATES USING FILM DEPOSITION AND EDGE ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266186). STRESS MANAGEMENT FOR PRECISE SUBSTRATE -TO- SUBSTRATE BONDING simplified abstract
- Applied materials, inc. (20240266200). Electrostatic Chuck simplified abstract
- Applied materials, inc. (20240266206). LIFT PIN ASSEMBLY simplified abstract
- Applied materials, inc. (20240266220). INTEGRATED LASER AND PLASMA ETCH DICING simplified abstract
- Applied materials, inc. (20240266230). OPTIMIZED FILM DEPOSITION AND ION IMPLANTATION FOR MITIGATION OF STRESS AND DEFORMATION IN SUBSTRATES simplified abstract
- Applied materials, inc. (20240282556). FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN simplified abstract
- Applied materials, inc. (20240282601). METHODS OF SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH ACTIVE STEAM GENERATION simplified abstract
- Applied materials, inc. (20240282605). LOUVER DESIGN FOR ELIMINATING LINE OF SIGHT simplified abstract
- Applied materials, inc. (20240304470). HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240304478). METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE simplified abstract
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on September 12th, 2024
- AR/VR/XR patent applications on June 13th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Boe technology group co., ltd. (20240304034). METHOD AND DEVICE FOR PROCESSING PRODUCT MANUFACTURING MESSAGES, ELECTRONIC DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM simplified abstract
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on September 12th, 2024
C
- Canon kabushiki kaisha (20240186157). APPARATUS INCLUDING A NON-CONTACT DIE HEAD AND A SUBSTRATE CHUCK AND A METHOD OF USING THE SAME simplified abstract
- Canon kabushiki kaisha (20240194636). BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240222351). METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract
- Canon kabushiki kaisha (20240242994). CONVEYANCE APPARATUS, CONVEYANCE METHOD, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240321586). PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract
- CANON KABUSHIKI KAISHA patent applications on February 15th, 2024
- CANON KABUSHIKI KAISHA patent applications on February 1st, 2024
- CANON KABUSHIKI KAISHA patent applications on July 18th, 2024
- CANON KABUSHIKI KAISHA patent applications on July 4th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 13th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 6th, 2024
- CANON KABUSHIKI KAISHA patent applications on September 26th, 2024
I
- Intel corporation (20240162058). TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING simplified abstract
- Intel corporation (20240219326). SYSTEMS, APPARATUS, ARTICLES OF MANUFACTURE, AND METHODS TO INSPECT SEMICONDUCTOR WAFERS simplified abstract
- Intel corporation (20240222178). ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS simplified abstract
- Intel corporation (20240304473). METHODS AND APPARATUS TO PLACE BALLS FOR SECOND LEVEL INTERCONNECTS OF INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240312819). DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTOR DIE PLACEMENT simplified abstract
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on September 12th, 2024
- Intel Corporation patent applications on September 19th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 8th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
K
- Kabushiki kaisha toshiba (20240247369). TREATMENT SOLUTION AND TREATMENT METHOD simplified abstract
- Kabushiki kaisha toshiba (20240321606). HEAT STAMP AND METHOD FOR RELEASING PROTECTIVE TAPE USING HEAT STAMP simplified abstract
- KABUSHIKI KAISHA TOSHIBA patent applications on July 25th, 2024
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024