Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- 18469609. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18469946. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18471875. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18472453. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (MEDIATEK INC.)
- 18473126. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18474111. DIE PAIR DEVICE PARTITIONING simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474138. TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474158. THERMALLY AWARE STACKING TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474166. BACKSIDE POWER simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18475546. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18477364. SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT simplified abstract (SK hynix Inc.)
- 18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (Samsung Electronics Co., Ltd.)
- 18478056. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED PASSIVE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18479820. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18480660. SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481568. PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEVICE USING THE SAME, AND BONDING SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18481648. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18481823. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481961. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
- 18482680. INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18482743. PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482944. MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18483211. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18483211. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18483281. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 18483298. STACK PACKAGES simplified abstract (SK hynix Inc.)
- 18483543. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18484571. PACKAGE STRUCTURE WITH UNDERFILL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18485953. SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED METHODS FOR THEIR PRODUCTION simplified abstract (Infineon Technologies AG)
- 18486546. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18486831. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18487247. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18489493. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18489886. SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18491551. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491637. FILTERING STRUCTURE AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18491711. MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18492170. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18492402. PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)
- 18494611. COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Murata Manufacturing Co., Ltd.)
- 18494784. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18495519. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18496372. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18496383. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18497637. PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract (Micron Technology, Inc.)
- 18497672. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18499242. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18499964. SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FILLERS AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18500311. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18502086. METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502105. CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (MEDIATEK Inc.)
- 18502307. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502389. SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNECTION simplified abstract (Micron Technology, Inc.)
- 18502702. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18503453. System, Device and Methods of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18503543. SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18503560. LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
- 18503690. SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
- 18504418. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18505851. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18506111. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18507571. SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18507721. FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18507801. SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
- 18507901. BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE simplified abstract (SK hynix Inc.)
- 18508663. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18508766. INTEGRATED CIRCUIT WITH GUARD RING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18508807. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18509053. INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)
- 18509801. Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract (Apple Inc.)
- 18510056. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18510091. METHOD OF FORMING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510599. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510864. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18512092. 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18512375. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
- 18513167. Asymmetric Stackup Structure for SoC Package Substrates simplified abstract (Apple Inc.)
- 18513296. BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513649. INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513863. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18514054. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514436. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514466. ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515412. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18515649. Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract (Apple Inc.)
- 18515797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18516367. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18516753. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516974. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517232. PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517260. CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18517489. Stacking Via Structures for Stress Reduction simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517980. SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
- 18518096. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18518187. Integrated Circuit Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518448. SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518456. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518790. CHIP PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519256. METHOD FOR OBTAINING AN INTEGRATED DEVICE COMPRISING USING AN ETCHING MASK TO DEFINE DICING LINES simplified abstract (Murata Manufacturing Co., Ltd.)
- 18519872. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18520453. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18520467. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520743. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (DENSO CORPORATION)
- 18520743. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18520958. Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520971. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521264. APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18521284. HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521711. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522013. PHOTOELECTRIC CONVERSION APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18522042. SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18522110. SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18522225. CHIP ON FILM PACKAGE simplified abstract (Samsung Display Co., LTD.)
- 18522271. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522622. SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522829. NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18522909. SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD simplified abstract (STMicroelectronics International N.V.)
- 18523007. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE simplified abstract (STMicroelectronics International N.V.)
- 18523157. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18523255. LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL simplified abstract (HONEYWELL INTERNATIONAL INC.)
- 18523314. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18523457. METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18523494. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18524135. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18524454. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18524552. THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18524900. INTERPOSER CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18525273. Semiconductor Device with Discrete Blocks simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18525467. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18526057. SEMICONDUCTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526445. SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526697. SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18527457. SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18527552. BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18530067. COMPLIANT CHUCK EDGE RING simplified abstract (Tokyo Electron Limited)
- 18530542. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18530896. BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
- 18531070. POWER MODULE FOR A VEHICLE simplified abstract (Robert Bosch GmbH)
- 18531720. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18531883. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18532064. STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18532726. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18533800. STACKED SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18534143. UNIVERSAL CHIP WITH VARIABLE PACKAGING simplified abstract (Meta Platforms Technologies, LLC)
- 18535231. SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN simplified abstract (Samsung Electronics Co., Ltd.)
- 18535339. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18535360. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18535893. PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract (Google LLC)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
- 18537548. DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18537672. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18538483. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538631. SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18538641. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538889. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18539036. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18541147. SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract (Samsung Electronics Co., Ltd.)
- 18543110. CHIP STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543124. CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18543749. Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract (Intel Corporation)
- 18546631. SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18550857. Light-Receiving Element and Light Receiving Circuit simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18552398. GRAPHITE SHEET AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18554244. SEMICONDUCTOR DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18556265. POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18557573. PHOTODETECTOR AND DISTANCE MEASUREMENT APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18558079. Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18559516. HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract (Mitsubishi Electric Corporation)
- 18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 18561297. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18562502. SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18566303. Semiconductor Device and Manufacturing Method for Semiconductor Device simplified abstract (HITACHI ASTEMO, LTD.)
- 18570074. FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18570678. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18577842. WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18577884. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583066. POWER MANAGEMENT simplified abstract (Micron Technology, Inc.)