Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 3,142 total.
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- 18434347. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18434357. MICROMECHANICAL COMPONENT simplified abstract (Robert Bosch GmbH)
- 18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435197. STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435272. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (SK hynix Inc.)
- 18435425. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
- 18435628. UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY simplified abstract (Lodestar Licensing Group LLC)
- 18435822. APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18437017. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY GROUP CORPORATION)
- 18437444. CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18438338. RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING CAPABILITY simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18438636. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18438658. SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18439249. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
- 18439349. PAD AND PACKAGE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18440172. DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18440297. PHOTONICS INTEGRATED CIRCUIT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18440444. SUBSTRATES WITH DOWNSET simplified abstract (Micron Technology, Inc.)
- 18441462. INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES simplified abstract (Micron Technology, Inc.)
- 18442484. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Japan Display Inc.)
- 18443166. SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 18443338. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18443542. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18443882. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18444419. PHOTOELECTRIC CONVERSION DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18444742. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18444786. DISPLAY DEVICE simplified abstract (E Ink Holdings Inc.)
- 18444874. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18447528. HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18447581. DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18447840. Integrated Circuit Layout, Integrated Circuit, and Method for Fabricating the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18448615. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18449452. SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE simplified abstract (Western Digital Technologies, Inc.)
- 18452695. SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18453026. CHIP PROTECTION DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18453190. METHOD OF FABRICATING DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)
- 18453422. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18453611. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18453682. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18453682. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18453991. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18454278. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18454621. MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE simplified abstract (SK hynix Inc.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18454994. SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18455573. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18455573. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18455854. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18455922. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18455943. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18455946. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18456261. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18456865. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18456865. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)
- 18457535. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18457785. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18458069. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18458109. BONDING-TYPE INTERCONNECTION MEMBER simplified abstract (Kabushiki Kaisha Toshiba)
- 18458109. BONDING-TYPE INTERCONNECTION MEMBER simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18458118. BONDING-TYPE INTERCONNECTION MEMBER simplified abstract (Kabushiki Kaisha Toshiba)
- 18458118. BONDING-TYPE INTERCONNECTION MEMBER simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18458899. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18458899. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18459207. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18459207. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18460471. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract (QUALCOMM Incorporated)
- 18460504. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18461040. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18461569. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18462010. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18462709. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18462724. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18463789. ISOLATOR simplified abstract (Kabushiki Kaisha Toshiba)
- 18463789. ISOLATOR simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18463819. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18464091. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18464511. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18464704. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18464704. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18464738. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18464738. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18465244. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18467071. BONDING APPARATUS AND BONDING METHOD simplified abstract (TOKYO ELECTRON LIMITED)
- 18467199. BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18467330. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18468773. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18468992. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18469493. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Mitsubishi Electric Corporation)
- 18469601. SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18469609. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18469946. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18471875. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18472453. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (MEDIATEK INC.)
- 18473126. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18474111. DIE PAIR DEVICE PARTITIONING simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474138. TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474158. THERMALLY AWARE STACKING TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474166. BACKSIDE POWER simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18475546. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18477364. SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT simplified abstract (SK hynix Inc.)
- 18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (Samsung Electronics Co., Ltd.)
- 18478056. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED PASSIVE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18479820. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18480660. SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481568. PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEVICE USING THE SAME, AND BONDING SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18481648. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18481823. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481961. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
- 18482680. INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18482743. PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482944. MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18483211. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18483211. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18483281. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 18483298. STACK PACKAGES simplified abstract (SK hynix Inc.)
- 18483543. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18484571. PACKAGE STRUCTURE WITH UNDERFILL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18485953. SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED METHODS FOR THEIR PRODUCTION simplified abstract (Infineon Technologies AG)
- 18486546. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18486831. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18487247. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18489493. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18489886. SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18491551. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491637. FILTERING STRUCTURE AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18491711. MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18492170. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18492402. PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)
- 18494611. COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Murata Manufacturing Co., Ltd.)
- 18494784. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18495519. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18496372. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18496383. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18497637. PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract (Micron Technology, Inc.)
- 18497672. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18499242. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18499964. SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FILLERS AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18500311. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18502086. METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502105. CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (MEDIATEK Inc.)
- 18502307. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502389. SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNECTION simplified abstract (Micron Technology, Inc.)
- 18502702. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18503453. System, Device and Methods of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18503543. SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18503560. LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
- 18503690. SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
- 18504418. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18505851. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18506111. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18507571. SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18507721. FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18507801. SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
- 18507901. BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE simplified abstract (SK hynix Inc.)
- 18508663. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18508766. INTEGRATED CIRCUIT WITH GUARD RING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18508807. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18509053. INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18509188. BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract (SK hynix Inc.)
- 18509801. Seal Ring Designs Supporting Efficient Die to Die Routing simplified abstract (Apple Inc.)
- 18510056. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18510091. METHOD OF FORMING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510599. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510864. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18512092. 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18512375. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
- 18513167. Asymmetric Stackup Structure for SoC Package Substrates simplified abstract (Apple Inc.)
- 18513296. BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513649. INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513863. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18514054. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514436. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514466. ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515412. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18515649. Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract (Apple Inc.)
- 18515797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18516367. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18516753. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516974. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)