Category:H01L23/00
Jump to navigation
Jump to search
(previous page) (next page)
- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 1,697 total.
(previous page) (next page)1
- 18348233. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18348591. SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNAL SHARED BY LOWER AND UPPER BYTES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18349017. NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18349024. SEMICONDUCTOR PACKAGE simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
- 18351748. METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18352177. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18353167. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18353279. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18353621. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18354928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18355004. SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18355718. SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18355824. Architecture for Computing System Package simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18356289. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18356682. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18356721. SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18358478. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18359031. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18359096. SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18359976. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18360056. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18360711. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18361482. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18363140. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364802. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18366098. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18366814. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18367039. METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation)
- 18367642. SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES simplified abstract (Samsung Electronics Co., Ltd.)
- 18367704. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18367896. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368128. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18368309. SEMICONDUCTOR PACKAGE INCLUDING ALIGNMENT MARKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18369311. SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18369684. INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18370283. SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18370914. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18371714. SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 18372846. SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18373098. SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING simplified abstract (Tokyo Electron Limited)
- 18373353. IMAGE SENSOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18374123. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374396. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374437. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18374792. FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18376028. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18377530. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18377569. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18378166. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18380222. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380404. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18380424. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18381061. INTERPOSERS FOR MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18382546. SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18384152. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18389625. INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING simplified abstract (Intel Corporation)
- 18390171. SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE simplified abstract (SK hynix Inc.)
- 18390395. STANDALONE ISOLATION CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18390439. ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18391651. CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE simplified abstract (NICHIA CORPORATION)
- 18391891. CHIP PACKAGE WITH LID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18393226. SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18395437. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18397105. ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18397891. MULTI-CHIP PACKAGING simplified abstract (Intel Corporation)
- 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation)
- 18397915. HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (Intel Corporation)
- 18399189. NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract (Intel Corporation)
- 18399220. ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 18399324. COMPOSITE COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18399885. SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES simplified abstract (Intel Corporation)
- 18400497. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)
- 18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18401811. PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18401815. Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18401928. SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18402426. SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS simplified abstract (Micron Technology, Inc.)
- 18402611. SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18402734. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18402755. APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME simplified abstract (Micron Technology, Inc.)
- 18403560. SUBSTRATE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18403686. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18408506. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18409620. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18418318. METHOD FOR FABRICATING DEVICE DIE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18418964. STACKED-CHIP PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18419399. SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18422220. DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18422778. SEMICONDUCTOR PACKAGE HAVING CHIP STACK simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18423166. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18423229. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18428934. Arrangement of Power-Grounds in Package Structures simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18429039. FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18429789. CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18430568. INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18430903. CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18432353. PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18432491. THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract (SK hynix Inc.)
- 18432788. SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract (SK hynix Inc.)
- 18433910. SEMICONDUCTOR MODULE simplified abstract (DENSO CORPORATION)
- 18434347. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)
- 18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435197. STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435272. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (SK hynix Inc.)
- 18435628. UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY simplified abstract (Lodestar Licensing Group LLC)
- 18435822. APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18437017. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY GROUP CORPORATION)
- 18437444. CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18438658. SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18443338. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18444742. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18447528. HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18447581. DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18447840. Integrated Circuit Layout, Integrated Circuit, and Method for Fabricating the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18448615. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18452695. SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18453026. CHIP PROTECTION DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18453190. METHOD OF FABRICATING DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)
- 18453611. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18453991. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18455854. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18455922. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18455943. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18456261. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18456865. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)
- 18457785. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18458069. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18460504. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18461569. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18462010. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18462709. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18464511. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18465244. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18467071. BONDING APPARATUS AND BONDING METHOD simplified abstract (TOKYO ELECTRON LIMITED)
- 18467330. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18468773. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18468992. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18469493. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Mitsubishi Electric Corporation)
- 18469601. SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18469609. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18471875. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18475546. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18478056. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED PASSIVE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18480660. SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481823. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481961. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
- 18482680. INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18482743. PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482944. MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18483211. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18483281. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 18484571. PACKAGE STRUCTURE WITH UNDERFILL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18486546. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18486831. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18487247. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491551. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491637. FILTERING STRUCTURE AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18491711. MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18492402. PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)
- 18494611. COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Murata Manufacturing Co., Ltd.)
- 18494784. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18496372. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18497637. PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract (Micron Technology, Inc.)
- 18499242. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18499964. SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FILLERS AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502086. METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502105. CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (MEDIATEK Inc.)
- 18502307. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502389. SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNECTION simplified abstract (Micron Technology, Inc.)
- 18502702. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)