Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
Subcategories
This category has only the following subcategory.
A
Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,965 total.
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- 18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)
- 18309070. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309113. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309149. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309250. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18311289. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18312191. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18312331. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18314287. SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18315432. SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract (SK hynix Inc.)
- 18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18317274. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18317327. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18317521. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18318827. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18319135. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18320013. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DEVIATION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18320046. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18320138. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18320455. MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE simplified abstract (SK hynix Inc.)
- 18320456. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18320513. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18320791. BONDING LAYER AND PROCESS simplified abstract (Tokyo Electron Limited)
- 18322040. HIGHLY VERTICALLY INTEGRATED NONVOLATILE MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18322570. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18322774. SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323528. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18323646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18326316. Bonding Semiconductor Dies Through Wafer Bonding Processes simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18326554. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18328848. METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING simplified abstract (Samsung Electronics Co., Ltd.)
- 18328982. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18329356. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18329530. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18330462. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18331821. SEMICONDUCTOR MEMORY DEVICE simplified abstract (SK hynix Inc.)
- 18331973. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18331975. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18331977. SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18332508. PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18334304. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18334695. Integrated Circuit Package and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18337113. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18337180. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18337860. SOLDER REFLOW APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18338933. IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18339132. DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES simplified abstract (APPLE INC.)
- 18339840. METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM simplified abstract (SK hynix Inc.)
- 18340101. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18340733. PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18341345. SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18341381. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18341490. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18344900. PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18344927. SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18344981. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18345955. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18346674. SEMICONDUCTOR DIE STACK STRUCTURE simplified abstract (SK hynix Inc.)
- 18346921. CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18346950. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18347313. Liquid Immersion-Cooled Power Module simplified abstract (Hyundai Motor Company)
- 18347313. Liquid Immersion-Cooled Power Module simplified abstract (Kia Corporation)
- 18348011. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18348233. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18348591. SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNAL SHARED BY LOWER AND UPPER BYTES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18349017. NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18349024. SEMICONDUCTOR PACKAGE simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
- 18350405. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18351591. INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION simplified abstract (Microchip Technology Incorporated)
- 18351748. METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18351975. FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18352177. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18353167. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18353279. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18353621. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18354928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18355004. SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18355718. SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18355824. Architecture for Computing System Package simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18356289. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18356682. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18356721. SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18357211. HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE simplified abstract (WESTERN DIGITAL TECHNOLOGIES, INC.)
- 18358478. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18358644. MULTI-WAFER BONDING FOR NAND SCALING simplified abstract (SanDisk Technologies LLC)
- 18358727. THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION simplified abstract (SanDisk Technologies LLC)
- 18359031. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18359096. SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18359976. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18360056. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18360711. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18361168. Semiconductor Device Package with Die Stackup and Interposer simplified abstract (Western Digital Technologies, Inc.)
- 18361482. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18363140. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18363995. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18364434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364802. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364893. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18364893. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18366098. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18366814. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18367039. METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation)
- 18367642. SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES simplified abstract (Samsung Electronics Co., Ltd.)
- 18367704. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18367881. SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH simplified abstract (Kabushiki Kaisha Toshiba)
- 18367881. SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18367896. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368128. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18368309. SEMICONDUCTOR PACKAGE INCLUDING ALIGNMENT MARKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18369311. SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18369684. INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18370283. SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18370914. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18370940. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18371714. SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 18372846. SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18373098. SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING simplified abstract (Tokyo Electron Limited)
- 18373353. IMAGE SENSOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18374123. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374310. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374392. MEMORY DEVICE INCLUDING STACKED PASS TRANSISTORS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374396. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374437. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18374718. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18374792. FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374792. FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18375173. SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18376028. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18377530. SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18377569. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18378166. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18379034. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18379286. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18380222. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380325. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18380345. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18380404. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18380424. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380854. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18380928. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380937. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18381061. INTERPOSERS FOR MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18382546. SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18384152. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18389251. SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT simplified abstract (Samsung Electronics Co., Ltd.)
- 18389614. DEBONDING REPAIR DEVICES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18389625. INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING simplified abstract (Intel Corporation)
- 18390171. SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE simplified abstract (SK hynix Inc.)
- 18390205. METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18390395. STANDALONE ISOLATION CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18390439. ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18391651. CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE simplified abstract (NICHIA CORPORATION)
- 18391891. CHIP PACKAGE WITH LID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18392757. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (Mitsubishi Electric Corporation)
- 18393226. SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18394575. HEAT DISSIPATION STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.)
- 18395265. SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING FUNCTIONAL AND NON-FUNCTIONAL CONDUCTIVE PADS simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18395437. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18397105. ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18397756. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18397891. MULTI-CHIP PACKAGING simplified abstract (Intel Corporation)
- 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation)
- 18397915. HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (Intel Corporation)
- 18398680. SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES simplified abstract (ROHM CO., LTD.)
- 18398820. ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18398926. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18399105. SEMICONDUCTOR POWER MODULE simplified abstract (ROHM CO., LTD.)
- 18399127. EMBEDDED LIQUID COOLING simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18399173. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18399189. NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract (Intel Corporation)
- 18399220. ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 18399324. COMPOSITE COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18399519. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18399871. ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR simplified abstract (Robert Bosch GmbH)
- 18399885. SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES simplified abstract (Intel Corporation)
- 18400497. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18400497. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18400697. HYBRID BONDING WITH SONIC ENERGY simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)
- 18400994. TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract (Micron Technology, Inc.)
- 18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18401811. PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)