18522852. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Masaharu Yamaji of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522852 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes drive chips, a control chip with multiple terminals including a voltage terminal and power supply terminals, a die pad for supplying control voltage, wires connected to the power supply terminals for supplying power supply voltages, and a semiconductor chip for bootstrap operation.
- Drive chips controlled by the control chip using power supply voltages.
- Control chip with voltage terminal and power supply terminals for controlling drive chips.
- Die pad for supplying control voltage to the control chip.
- Wires connected to power supply terminals for supplying power supply voltages.
- Semiconductor chip used for bootstrap operation to generate power supply voltages.
Potential Applications: - Semiconductor industry for controlling and powering devices. - Electronics manufacturing for efficient power supply management.
Problems Solved: - Efficient control and power supply management for semiconductor devices. - Simplified circuit design for power supply generation.
Benefits: - Improved efficiency in controlling multiple drive chips. - Enhanced power supply management for semiconductor devices.
Commercial Applications: - Semiconductor manufacturing companies for producing advanced devices. - Electronics companies for incorporating efficient power supply systems.
Questions about Semiconductor Device A: 1. How does the control chip manage power supply voltages for multiple drive chips? 2. What are the advantages of using a semiconductor chip for bootstrap operation in this device?
Frequently Updated Research: - Stay updated on advancements in semiconductor technology for potential improvements in power supply management.
Original Abstract Submitted
A semiconductor device A includes drive chips [k], a control chip A including a plurality of terminals H including a voltage terminal Hc and power supply terminals Hb[k] and configured to control each of the drive chips [k], using a corresponding one of power supply voltages Vb[k] supplied to a corresponding one of the power supply terminals Hb[k], a die pad for supplying control voltage Vcc to the voltage terminal Hc, wires Qb[k] each connected to a corresponding one of the power supply terminals Hb[k] and for supplying a corresponding one of the power supply voltages Vb[k] to a corresponding one of the power supply terminals Hb[k], and a semiconductor chip A used for bootstrap operation to generate the power supply voltages Vb[k] and including diodes the number of which is the same as the number of the power supply voltages Vb[k].
