18614583. SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS simplified abstract (Micron Technology, Inc.)
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SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS
Organization Name
Inventor(s)
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18614583 titled 'SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS
Simplified Explanation: The patent application describes semiconductor device assemblies with features for aligning semiconductor dies.
- The semiconductor device assembly includes a substrate with an alignment structure at the top surface.
- A first die is placed over the substrate, with a channel that aligns with the alignment structure.
- This alignment structure helps in accurately positioning the semiconductor dies during assembly.
Key Features and Innovation:
- Alignment structure on the substrate for precise alignment of semiconductor dies.
- Channels on the semiconductor dies that align with the substrate's alignment structure.
- Vertical alignment of the channels with the alignment structure for accurate positioning.
Potential Applications:
- Semiconductor manufacturing industry for precise alignment of dies.
- Electronics industry for improved performance and reliability of semiconductor devices.
Problems Solved:
- Inaccurate alignment of semiconductor dies during assembly.
- Reduced performance and reliability of semiconductor devices due to misalignment.
Benefits:
- Enhanced accuracy in aligning semiconductor dies.
- Improved performance and reliability of semiconductor devices.
- Streamlined manufacturing processes.
Commercial Applications: Title: Semiconductor Device Assemblies for Precise Die Alignment Potential commercial uses include semiconductor manufacturing companies looking to improve the accuracy and efficiency of their assembly processes. This technology can have significant market implications by enhancing the quality of semiconductor devices.
Prior Art: Readers can explore prior art related to semiconductor die alignment techniques in the semiconductor manufacturing industry to understand the evolution of this technology.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor die alignment techniques and technologies to ensure the implementation of the most cutting-edge solutions in semiconductor manufacturing processes.
Questions about Semiconductor Device Assemblies: 1. What are the key benefits of using alignment structures in semiconductor device assemblies? 2. How does accurate die alignment impact the overall performance of semiconductor devices?
Original Abstract Submitted
Semiconductor device assemblies having features that are used to align semiconductor dies, and associated systems and methods, are disclose herein. In some embodiments, a semiconductor device assembly includes substrate that has a top surface and an alignment structure at the top surface. A first die is disposed over the top surface of the substrate, and the first die has a first channel that extends between a top side and a bottom side of the first die. The first channel is vertically aligned with and exposes the alignment structure at the top surface of the substrate.
