18615399. FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE simplified abstract (Micron Technology, Inc.)
Contents
FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE
Organization Name
Inventor(s)
Christopher G. Wieduwilt of Boise ID (US)
Lawrence D. Smith of Boise ID (US)
James S. Rehmeyer of Boise ID (US)
FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18615399 titled 'FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE
The patent application describes a technology where fuses in a memory package can store different delay states to stagger the execution of a command for different memory dies.
- Fuse arrays are included in the memory package.
- The fuse arrays can be programmed to cause different delays for different dies.
- Fabrication of the fuse arrays allows for customization of delay amounts.
- The technology enables staggered execution of commands for improved efficiency.
- Different memory dies can be synchronized effectively using this innovation.
Potential Applications: - Memory packages in computer systems - Data centers - Embedded systems - Mobile devices - Internet of Things (IoT) devices
Problems Solved: - Synchronization issues in memory packages - Efficiency and performance optimization - Customization of command execution
Benefits: - Enhanced performance - Improved efficiency - Customizable delay states - Better synchronization of memory dies - Increased reliability
Commercial Applications: Title: "Customizable Delay Technology for Memory Packages" This technology can be used in various commercial applications such as: - Computer hardware manufacturing - Semiconductor industry - Consumer electronics - Telecommunications - Automotive industry
Prior Art: Readers can explore prior patents related to memory package synchronization and delay technologies to gain a deeper understanding of the field.
Frequently Updated Research: Stay updated on the latest advancements in memory package technologies, synchronization methods, and delay customization options to enhance your knowledge in this area.
Questions about the Technology: 1. How does the customizable delay technology improve the efficiency of memory packages? 2. What are the potential challenges in implementing this technology in different types of memory dies?
Original Abstract Submitted
Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.
