18614290. STACKED FORKSHEET TRANSISTORS simplified abstract (Intel Corporation)

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STACKED FORKSHEET TRANSISTORS

Organization Name

Intel Corporation

Inventor(s)

Cheng-Ying Huang of Portland OR (US)

Gilbert Dewey of Beaverton OR (US)

Anh Phan of Beaverton OR (US)

Nicole K. Thomas of Portland OR (US)

Urusa Alaan of Hillsboro OR (US)

Seung Hoon Sung of Portland OR (US)

Christopher M. Neumann of Portland OR (US)

Willy Rachmady of Beaverton OR (US)

Patrick Morrow of Portland OR (US)

Hui Jae Yoo of Portland OR (US)

Richard E. Schenker of Portland OR (US)

Marko Radosavljevic of Portland OR (US)

Jack T. Kavalieros of Portland OR (US)

Ehren Mannebach of Beaverton OR (US)

STACKED FORKSHEET TRANSISTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18614290 titled 'STACKED FORKSHEET TRANSISTORS

Simplified Explanation

The patent application describes stacked forksheet transistor devices and methods of fabricating them. These devices consist of vertical stacks of semiconductor channels adjacent to a backbone, with one device stacked on top of another.

  • Stacked forksheet transistor devices
  • Fabrication methods for these devices
  • Vertical stacks of semiconductor channels
  • Integration into an integrated circuit structure
  • Stacking of multiple transistor devices

Key Features and Innovation

  • Stacked forksheet transistor devices with vertical semiconductor channels
  • Integration of multiple transistor devices into an integrated circuit structure
  • Efficient use of space with stacked configuration
  • Improved performance and functionality of the devices
  • Novel fabrication methods for creating these devices

Potential Applications

The technology can be applied in:

  • Semiconductor industry
  • Integrated circuit design
  • Electronics manufacturing
  • Advanced computing systems
  • Mobile devices and smartphones

Problems Solved

  • Space optimization in integrated circuits
  • Enhanced performance of transistor devices
  • Efficient use of semiconductor channels
  • Improved functionality in electronic devices
  • Advanced fabrication techniques for complex structures

Benefits

  • Increased efficiency in integrated circuit design
  • Enhanced performance of electronic devices
  • Compact and space-saving transistor configurations
  • Improved functionality and speed in computing systems
  • Potential for advanced technological applications

Commercial Applications

Title: Stacked Forksheet Transistor Devices in Integrated Circuits This technology can be commercially used in:

  • Semiconductor manufacturing companies
  • Electronics industry for advanced devices
  • Research and development in computing technology
  • Consumer electronics market for improved products
  • Potential for licensing and collaboration with tech companies

Questions about Stacked Forksheet Transistor Devices

What are the key advantages of using stacked forksheet transistor devices in integrated circuits?

Stacked forksheet transistor devices offer improved performance, space optimization, and enhanced functionality in electronic devices.

How do the fabrication methods for these devices differ from traditional transistor manufacturing processes?

The fabrication methods for stacked forksheet transistor devices involve creating vertical stacks of semiconductor channels, which is a novel approach compared to traditional transistor fabrication techniques.


Original Abstract Submitted

Embodiments disclosed herein include stacked forksheet transistor devices, and methods of fabricating stacked forksheet transistor devices. In an example, an integrated circuit structure includes a backbone. A first transistor device includes a first vertical stack of semiconductor channels adjacent to an edge of the backbone. A second transistor device includes a second vertical stack of semiconductor channels adjacent to the edge of the backbone. The second transistor device is stacked on the first transistor device.