Samsung electronics co., ltd. (20240234286). SEMICONDUCTOR PACKAGES simplified abstract
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234286 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the abstract includes a front redistribution structure with multiple redistribution layers, connection bumps, and an underfill material within a recess.
- The front redistribution structure consists of an insulating layer with front redistribution layers on different levels, including an inner and outer redistribution layer.
- Connection bumps are present within the recess, with one bump connected to the first redistribution layer and the other to the outer redistribution layer.
- An underfill material extends along the side surfaces of the connection bumps and the dam within the recess.
Potential Applications: - This semiconductor package design can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - The design helps improve the electrical connections within the semiconductor package, enhancing overall performance and reliability. - The underfill material provides mechanical support and protection to the connection bumps, reducing the risk of damage.
Benefits: - Enhanced electrical connectivity and signal transmission. - Improved mechanical stability and durability. - Increased overall performance and reliability of electronic devices.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers, electronic device manufacturers, and other industries requiring advanced packaging solutions. - It has the potential to drive innovation in the electronics market and improve the quality of electronic products.
Questions about the Semiconductor Package Design: 1. How does the underfill material contribute to the reliability of the semiconductor package? 2. What are the specific advantages of having multiple redistribution layers in the front redistribution structure?
Original Abstract Submitted
a semiconductor package including: a front redistribution structure including an insulating layer defining an upper surface, a lower surface opposing the upper surface, and a side surface, front redistribution layers including a first redistribution layer on a first level adjacent to the lower surface and second redistribution layers on a second level higher than the first level relative to the lower surface, the second redistribution layers having an inner redistribution layer and an outer redistribution layer, a recess exposing at least a portion of the outer redistribution layer, and a dam on at least one side of the recess; connection bumps including a first bump electrically connected to the first redistribution layer and a second bump electrically connected to the outer redistribution layer within the recess; and an underfill that extends along a side surface of the second bump and a side surface of the dam within the recess.
