18604127. METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Tung-Hung Feng of Hsinchu (TW)
Sheng-Wen Jiang of Hsinchu (TW)
Shih-Che Wang of Hsinchu City (TW)
METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18604127 titled 'METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE
The abstract describes a method of coating a photo resist over a wafer by dispensing the photo resist from a nozzle while rotating the wafer, changing the wafer rotation speed at least 4 times, and moving the arm holding the nozzle horizontally. The dispensing of the photo resist is stopped while rotating the wafer, and the tip end of the nozzle is located at a height of 2.5 mm to 3.5 mm from the wafer.
- Dispensing photo resist from a nozzle over a wafer while rotating the wafer
- Changing the wafer rotation speed at least 4 times during the process
- Moving the arm holding the nozzle horizontally
- Stopping the dispensing of the photo resist while rotating the wafer
- Maintaining the tip end of the nozzle at a specific height from the wafer
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Photolithography processes
Problems Solved: - Uniform coating of photo resist on wafers - Enhanced precision in dispensing photo resist - Improved efficiency in wafer processing
Benefits: - Increased accuracy in photo resist coating - Reduced wastage of photo resist material - Enhanced quality of semiconductor devices
Commercial Applications: Title: Advanced Photo Resist Coating Technology for Semiconductor Manufacturing This technology can be used in the production of various semiconductor devices such as microchips, sensors, and integrated circuits. It can improve the overall efficiency and quality of wafer processing in semiconductor manufacturing facilities.
Questions about Advanced Photo Resist Coating Technology: 1. How does the method of changing the wafer rotation speed multiple times during the dispensing process improve the coating quality? 2. What are the specific advantages of maintaining the tip end of the nozzle at a height of 2.5 mm to 3.5 mm from the wafer during dispensing?
Original Abstract Submitted
In a method of coating a photo resist over a wafer, dispensing the photo resist from a nozzle over the wafer is started while rotating the wafer, and dispensing the photo resist is stopped while rotating the wafer. After starting and before stopping the dispensing the photo resist, a wafer rotation speed is changed at least 4 times. During dispensing, an arm holding the nozzle may move horizontally. A tip end of the nozzle may be located at a height of 2.5 mm to 3.5 mm from the wafer.
