Samsung electronics co., ltd. (20240222348). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seunggeol Ryu of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222348 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a first package with a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip. The first package has a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view. Dummy balls are placed on the center region and the second edge region of the first package, while connection terminals are located on the first edge region. Additionally, a second package includes a third substrate placed on the dummy balls and connection terminals, with a second semiconductor chip mounted on the third substrate. The dummy balls may be in contact with the second substrate and spaced apart from the third substrate, while the connection terminals are connected to both the second and third substrates.
- The semiconductor package includes a unique design with dummy balls and connection terminals strategically placed on different regions of the package.
- The second package adds a layer of complexity by incorporating a third substrate and a second semiconductor chip.
- The arrangement of the dummy balls and connection terminals allows for efficient connectivity within the package.
- This innovation potentially enhances the performance and functionality of semiconductor packages.
- The technology may find applications in various electronic devices requiring advanced semiconductor packaging solutions.
- Potential Applications:**
The technology can be applied in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers.
- Problems Solved:**
The technology addresses the need for improved connectivity and functionality in semiconductor packages.
- Benefits:**
Enhanced performance, increased functionality, and improved connectivity in semiconductor packages.
- Commercial Applications:**
This technology could revolutionize the semiconductor packaging industry by offering more efficient and advanced solutions for electronic devices.
- Questions about Semiconductor Packaging:**
1. How does the placement of dummy balls and connection terminals impact the overall performance of the semiconductor package? 2. What are the potential challenges in implementing this innovative semiconductor packaging technology?
Original Abstract Submitted
a semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view, dummy balls disposed on the center region and the second edge region of the first package, connection terminals disposed on the first edge region of the first package, and a second package including a third substrate disposed on the dummy balls and the connection terminals and a second semiconductor chip mounted on the third substrate. the dummy balls may be in contact with the second substrate and may be spaced apart from the third substrate, and the connection terminals may be coupled to the second and third substrates.
