Samsung electronics co., ltd. (20240222330). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngjun Yoon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222330 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of two semiconductor chips with various connection pads, through-electrodes, protective layers, bump structures, and an adhesive film.
- The first semiconductor chip has front and rear connection pads, dummy pads, and through-electrodes.
- The second semiconductor chip has front connection pads, test pads, and a protective layer with openings.
- Bump structures electrically connect the rear connection pads of the first chip to the front connection pads of the second chip.
- Dummy pads are taller than the rear connection pads and overlap the test pads on the second chip.
- An adhesive film surrounds the rear connection pads, dummy pads, and bump structures.
Potential Applications: - This technology could be used in advanced semiconductor packaging for improved connectivity and reliability. - It may find applications in high-performance electronic devices where precise electrical connections are crucial.
Problems Solved: - Enhances the electrical connection between two semiconductor chips. - Provides protection and insulation for delicate connection pads. - Ensures reliable performance in demanding electronic applications.
Benefits: - Improved electrical connectivity and signal transmission. - Enhanced durability and protection for semiconductor chips. - Potential for increased performance and efficiency in electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology could be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers. It may also have applications in the automotive industry for advanced driver assistance systems and in the aerospace sector for communication and navigation systems.
Questions about the technology: 1. How does the height difference between the dummy pads and rear connection pads impact the performance of the semiconductor package? 2. What are the specific advantages of using bump structures to connect the rear and front connection pads in semiconductor packaging?
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip including first front connection pads on a first front surface, first rear connection pads and dummy pads on a first rear surface, and through-electrodes. the package includes a second semiconductor chip including second front connection pads and test pads on a second front surface, and a protective layer including openings exposing at least a portion of the second front connection pads and the test pads. the package includes bump structures electrically connecting the first rear connection pads and the second front connection pads, and an adhesive film surrounding at least a portion of each of the first rear connection pads, the dummy pads, and the bump structures. the dummy pads overlap the test pads in a direction perpendicular to the first rear surface, and a height of the dummy pads is greater than a height of the first rear connection pads.
