Samsung electronics co., ltd. (20240222273). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
HYUN SOO Chung of Suwon-si, Gyeonggi-do (KR)
DAE-WOO Kim of Suwon-si, Gyeonggi-do (KR)
WON-YOUNG Kim of Suwon-si, Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222273 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first semiconductor chip with signal and power wiring structures, a second semiconductor chip with signal and power wiring structures, and a power connection pillar connecting the power wiring structures of the two chips.
- The semiconductor package features two semiconductor chips with different wiring structures.
- The first chip has signal and power wiring structures on its upper and lower surfaces, respectively.
- The second chip is placed on top of the first chip and has its own signal and power wiring structures.
- A power connection pillar connects the power wiring structures of the two chips.
- This design allows for efficient power distribution and signal transmission within the semiconductor package.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial equipment, and communication systems.
Problems Solved: - Efficient power distribution and signal transmission within a semiconductor package. - Integration of multiple semiconductor chips with different wiring structures.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced power efficiency and signal integrity. - Compact design for space-saving in electronic applications.
Commercial Applications: Title: Semiconductor Package for Enhanced Power Distribution and Signal Transmission This technology can be utilized in the consumer electronics industry to improve the performance and reliability of electronic devices. It can also benefit industries such as automotive, industrial, and telecommunications by providing efficient power distribution and signal transmission solutions.
Questions about Semiconductor Package Technology: 1. How does the power connection pillar enhance the performance of the semiconductor package? 2. What are the key advantages of integrating multiple semiconductor chips with different wiring structures in a single package?
Original Abstract Submitted
a semiconductor package is provided. the semiconductor package comprises a first semiconductor chip including the first signal wiring structure disposed in an upper surface thereof, and a first power wiring structure disposed in a lower surface thereof, a second semiconductor chip disposed on the first signal wiring structure and including a second signal wiring structure, a second power wiring structure disposed on the second semiconductor chip and a first power connection pillar connecting the first power wiring structure and the second power wiring structure to each other.
