Samsung electronics co., ltd. (20240222244). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222244 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of several key components:
- First redistribution layer
- First semiconductor chip
- Mold layer
- Metal layer
- Second redistribution layer
Key Features and Innovation: - The mold layer covers the side surface of the first semiconductor chip and the top surface of the first redistribution layer, with an upper surface coplanar with the upper surface of the chip. - The metal layer is in contact with the upper surfaces of the mold layer and the first semiconductor chip. - The second redistribution layer is on top of the metal layer.
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing - Integrated circuit design
Problems Solved: - Improved protection and insulation of semiconductor chips - Enhanced connectivity and signal transmission within the package
Benefits: - Increased reliability and durability of semiconductor devices - Enhanced performance and functionality of electronic products
Commercial Applications: - This technology can be utilized in the production of various electronic devices such as smartphones, computers, and automotive systems. It can also be applied in the aerospace and medical industries.
Questions about Semiconductor Package Technology: 1. How does the mold layer contribute to the overall protection of the semiconductor chip? 2. What are the advantages of having a metal layer in contact with the semiconductor chip and mold layer?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package includes a first redistribution layer, a first semiconductor chip on the first redistribution layer, a mold layer covering a side surface of the first semiconductor chip and a top surface of the first redistribution layer and having an upper surface coplanar with an upper surface of the first semiconductor chip, a metal layer on the first semiconductor chip and the mold layer to be in contact with upper surfaces of the mold layer and the first semiconductor chip, and a second redistribution layer on the metal layer.
