18596076. Asic Package With Photonics And Vertical Power Delivery simplified abstract (Google LLC)
Contents
Asic Package With Photonics And Vertical Power Delivery
Organization Name
Inventor(s)
Woon-Seong Kwon of Santa clara CA (US)
Nam Hoon Kim of San Jose CA (US)
Teckgyu Kang of Saratoga CA (US)
Ryohei Urata of San Carlos CA (US)
Asic Package With Photonics And Vertical Power Delivery - A simplified explanation of the abstract
This abstract first appeared for US patent application 18596076 titled 'Asic Package With Photonics And Vertical Power Delivery
The technology described in the patent application is related to an integrated circuit (IC) package. The IC package includes a substrate, an IC die mounted to the substrate, photonic modules attached to the substrate, and serializer/deserializer (SerDes) interfaces connecting the IC die to the photonic modules. The IC die may be an application-specific integrated circuit (ASIC) die, while the photonic modules may include a photonic integrated circuit (PIC) and fiber array. The photonic modules may be mounted to additional substrates attached to the main substrate via sockets.
- IC package with substrate, IC die, photonic modules, and SerDes interfaces
- IC die can be ASIC die, photonic modules include PIC and fiber array
- Photonic modules mounted on additional substrates attached to main substrate via sockets
Potential Applications: - High-speed data communication systems - Optical networking equipment - Data centers and cloud computing infrastructure
Problems Solved: - Efficient data transfer between IC die and photonic modules - Integration of photonic components into IC packages
Benefits: - Faster data transfer speeds - Reduced signal loss and latency - Improved overall system performance
Commercial Applications: Title: "Advanced IC Package with Integrated Photonic Modules" This technology can be used in high-performance computing systems, telecommunications equipment, and networking hardware. It has implications for industries requiring high-speed data processing and transmission.
Prior Art: Researchers can explore existing patents related to IC packaging with integrated photonic components, advancements in ASIC design, and developments in photonic integration technologies.
Frequently Updated Research: Researchers are continually exploring ways to enhance the integration of photonic components into IC packages, improve data transfer speeds, and reduce power consumption in high-speed communication systems.
Questions about the Technology: 1. How does the integration of photonic modules into IC packages improve data transfer efficiency? 2. What are the key challenges in implementing SerDes interfaces in IC packages with photonic components?
Original Abstract Submitted
The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.
