18243805. BALL ATTACHMENT APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
BALL ATTACHMENT APPARATUS
Organization Name
Inventor(s)
BALL ATTACHMENT APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18243805 titled 'BALL ATTACHMENT APPARATUS
Simplified Explanation: The patent application describes a ball attachment apparatus used for attaching solder balls to a substrate strip. The tool case contains holding tools with adsorption holes that correspond to the substrate units and ball pads of the substrate units. Insertion blocks are placed between the holding tools, creating different gap distances from the center of the tool case.
Key Features and Innovation:
- Tool case for attaching solder balls to a substrate strip
- Holding tools with adsorption holes corresponding to substrate units and ball pads
- Insertion blocks between holding tools creating varying gap distances from the center of the tool case
Potential Applications: This technology can be used in electronics manufacturing processes where solder balls need to be attached to substrate strips.
Problems Solved: This technology solves the problem of efficiently attaching solder balls to substrate strips in a precise and controlled manner.
Benefits:
- Precise attachment of solder balls
- Controlled placement on substrate strips
- Efficient manufacturing process
Commercial Applications: The technology can be applied in the electronics industry for the production of circuit boards and other electronic components.
Prior Art: Prior art related to this technology may include patents or publications on solder ball attachment apparatus and methods in electronics manufacturing.
Frequently Updated Research: Research on advancements in solder ball attachment techniques and materials could be relevant to this technology.
Questions about Ball Attachment Apparatus: 1. What are the key components of a ball attachment apparatus? 2. How does the varying gap distances in the tool case contribute to the efficiency of solder ball attachment?
Original Abstract Submitted
A ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.
