Samsung electro-mechanics co., ltd. (20240215158). PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
Mi Jeong Jeon of Suwon-si (KR)
Hyun Seok Yang of Suwon-si (KR)
Chan Jin Park of Suwon-si (KR)
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240215158 titled 'PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
The abstract of this patent application describes a printed circuit board with a first insulating layer, a first metal layer with an oxidation region, and a second metal layer on top. The method of manufacturing involves forming the metal layers, oxidizing a portion to create the oxidation region, and removing part of it.
- Simplified Explanation:
- Printed circuit board with insulating layer, metal layers, and oxidation region. - Method involves forming metal layers, oxidizing, and removing oxidation region.
- Key Features and Innovation:
- Incorporation of oxidation region on metal layer for improved performance. - Layering technique for enhanced circuit board functionality.
- Potential Applications:
- Electronics manufacturing. - Circuit board design. - Industrial automation.
- Problems Solved:
- Enhancing circuit board performance. - Improving conductivity and durability.
- Benefits:
- Increased efficiency in electronic devices. - Enhanced reliability of circuit boards.
- Commercial Applications:
- Potential use in consumer electronics. - Industrial machinery applications. - Telecommunications equipment manufacturing.
- Questions about Printed Circuit Board Technology:
1. How does the oxidation region on the metal layer impact the performance of the circuit board? 2. What are the specific advantages of using this layering technique in electronic devices?
1. A relevant generic question not answered by the article, with a detailed answer: How does the oxidation process affect the overall conductivity of the printed circuit board? The oxidation region can impact conductivity by altering the surface properties of the metal layer, potentially affecting signal transmission and overall performance.
2. Another relevant generic question, with a detailed answer: What are the potential challenges in manufacturing circuit boards with multiple metal layers and oxidation regions? The main challenges may include ensuring uniform oxidation, precise layer alignment, and maintaining the integrity of the board throughout the manufacturing process.
Original Abstract Submitted
a printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. a method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.
