Samsung electro-mechanics co., ltd. (20240215157). PRINTED CIRCUIT BOARD simplified abstract

PRINTED CIRCUIT BOARD

Organization Name

samsung electro-mechanics co., ltd.

Inventor(s)

Ki Ran Park of Suwon-si (KR)

Hyun Woo Kwon of Suwon-si (KR)

Tae Hong Min of Suwon-si (KR)

Sang Hyun Han of Suwon-si (KR)

Guh Hwan Lim of Suwon-si (KR)

Yo Han Song of Suwon-si (KR)

Dong Keun Lee of Suwon-si (KR)

Kyeong Yub Jung of Suwon-si (KR)

Eun Gyu Jeong of Suwon-si (KR)

Yu Mi Kim of Suwon-si (KR)

PRINTED CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240215157 titled 'PRINTED CIRCUIT BOARD

The abstract describes a printed circuit board with multiple layers and a via structure for electrical connections.

• The circuit board includes a first insulating layer with a via pad on its upper surface.
• A second insulating layer is placed on top of the first layer, with a via hole exposing part of the via pad.
• A conductor pattern is located on the exposed surface of the via pad.
• A via is formed with a first metal layer covering the walls of the via hole, the exposed via pad surface, and the conductor pattern.
• A second metal layer is then added on top of the first metal layer within the via hole.

Potential Applications: - This technology can be used in various electronic devices and systems that require complex circuitry. - It can be applied in industries such as telecommunications, automotive, and consumer electronics.

Problems Solved: - Provides a reliable and efficient method for creating intricate circuit connections within a printed circuit board. - Ensures proper electrical conductivity and signal transmission between different layers of the board.

Benefits: - Enhances the overall performance and functionality of electronic devices. - Improves the durability and longevity of printed circuit boards.

Commercial Applications: - This technology can be utilized in the production of smartphones, computers, medical devices, and other electronic products. - It can also benefit manufacturers of industrial equipment and aerospace systems.

Questions about the Technology: 1. How does the via structure in this printed circuit board improve signal transmission compared to traditional methods? 2. What are the specific advantages of using multiple insulating layers in the construction of the circuit board?

Original Abstract Submitted

a printed circuit board includes: a first insulating layer; a via pad disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a via hole exposing at least a portion of an upper surface of the via pad; a conductor pattern disposed on the exposed upper surface of the via pad; and a via including a first metal layer covering at least a portion of each of a wall surface of the via hole, the exposed upper surface of the via pad, and the conductor pattern, and a second metal layer disposed on the first metal layer and disposed in at least a portion of the via hole.