Google llc (20240213215). Asic Package With Photonics And Vertical Power Delivery simplified abstract
Contents
Asic Package With Photonics And Vertical Power Delivery
Organization Name
Inventor(s)
Woon-Seong Kwon of Santa clara CA (US)
Nam Hoon Kim of San Jose CA (US)
Teckgyu Kang of Saratoga CA (US)
Ryohei Urata of San Carlos CA (US)
Asic Package With Photonics And Vertical Power Delivery - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213215 titled 'Asic Package With Photonics And Vertical Power Delivery
The technology described in the patent application relates to an integrated circuit (IC) package that includes a substrate, an IC die mounted to the substrate, photonic modules attached to the substrate, and serializer/deserializer (SerDes) interfaces connecting the IC die to the photonic modules. The IC die may be an Application Specific Integrated Circuit (ASIC) die, while the photonic modules may include a Photonic Integrated Circuit (PIC) and fiber array. The photonic modules may be mounted to additional substrates, which are attached to the main substrate via sockets.
- IC package with substrate, IC die, photonic modules, and SerDes interfaces
- IC die can be an ASIC die, photonic modules include PIC and fiber array
- Photonic modules mounted on additional substrates connected to main substrate via sockets
Potential Applications: - Data communication systems - Telecommunications networks - High-speed computing devices
Problems Solved: - Efficient data transmission between IC die and photonic modules - Integration of photonic components into IC packages
Benefits: - Improved data transfer speeds - Enhanced performance of integrated circuits - Compact and efficient design
Commercial Applications: Title: "Next-Generation Data Communication Systems" This technology can be used in the development of high-speed data communication systems for various industries, including telecommunications, data centers, and computing.
Questions about the technology: 1. How does the integration of photonic modules improve data transmission in IC packages? 2. What are the advantages of using SerDes interfaces in connecting IC die to photonic modules?
Original Abstract Submitted
the technology relates to an integrated circuit (ic) package. the ic package may include a substrate. an ic die may be mounted to the substrate. one or more photonic modules may be attached to the substrate and one or more serializer/deserializer (serdes) interfaces may connect the ic die to the one or more photonic modules. the ic die may be an application specific integrated circuit (asic) die and the one or more photonic modules may include a photonic integrated circuit (pic) and fiber array. the one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.
