Intel corporation (20240213216). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
Contents
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ (US)
Amr Elshazly of Hillsboro OR (US)
Arun Chandrasekhar of Chandler AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213216 titled 'MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
The abstract of this patent application describes a microelectronic assembly that includes a package substrate, a first die, a second die, and a communication network between the two dies.
- The microelectronic assembly consists of a package substrate, a first die, and a second die.
- The first die is connected to the package substrate with first interconnects.
- The second die is connected to the first die with second interconnects.
- The second die is also connected to the package substrate with third interconnects.
- A communication network is partially included in both the first and second dies.
- The communication network facilitates communication between the first die and the second die.
Potential Applications: - This technology can be used in the development of advanced microelectronic devices. - It can be applied in the manufacturing of high-performance electronic systems. - The communication network can enhance data transfer speeds in electronic devices.
Problems Solved: - Improved communication pathways between microelectronic components. - Enhanced performance and efficiency of microelectronic assemblies. - Facilitates the integration of multiple dies in a single package substrate.
Benefits: - Faster data transfer speeds between components. - Higher efficiency and performance of microelectronic devices. - Enables the creation of more compact and powerful electronic systems.
Commercial Applications: Title: Advanced Microelectronic Assembly Technology for High-Performance Devices This technology can be utilized in the development of smartphones, tablets, computers, and other electronic devices requiring high-speed data transfer and efficient communication between components.
Questions about Microelectronic Assembly Technology: 1. How does the communication network between the first and second dies improve the performance of microelectronic assemblies? 2. What are the potential implications of using this technology in the development of next-generation electronic devices?
Original Abstract Submitted
microelectronic assemblies, and related devices and methods, are disclosed herein. for example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
