Intel corporation (20240210466). ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS simplified abstract
Contents
- 1 ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Testing Integrated Circuits
- 1.11 Original Abstract Submitted
ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS
Organization Name
Inventor(s)
Andres Maldonado of Beaverton OR (US)
Steve Herndon of Chandler AZ (US)
ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240210466 titled 'ENHANCED STATIC-DYNAMIC STRESS TECHNIQUES TO ACCELERATE LATENT DEFECTS FOR INTEGRATED CIRCUITS
Simplified Explanation
The patent application describes a method for testing an integrated circuit for defects by applying different voltages at specific time periods.
- Applying a nominal voltage initially
- Applying a dynamic voltage greater than the nominal voltage
- Applying a static voltage greater than the dynamic voltage
- Applying the dynamic voltage again during a specific time period
Key Features and Innovation
- Method for testing integrated circuits for defects
- Sequential application of different voltages to identify potential issues
- Target static voltage is set below a target voltage for effective testing
Potential Applications
- Semiconductor industry for testing integrated circuits
- Quality control in electronics manufacturing
Problems Solved
- Efficient and effective method for testing integrated circuits
- Identifying defects early in the manufacturing process
Benefits
- Improved quality control in electronics manufacturing
- Early detection of defects leads to cost savings in production
Commercial Applications
- Quality control systems for semiconductor manufacturers
- Testing equipment for electronics production lines
Questions about Testing Integrated Circuits
How does the method of applying different voltages help in identifying defects in integrated circuits?
The method of applying different voltages helps in stressing the integrated circuit to detect any potential defects that may not be visible under normal operating conditions.
What are the advantages of using a target static voltage below a target voltage in the testing process?
Using a target static voltage below a target voltage allows for more precise testing and identification of defects without risking damage to the integrated circuit.
Original Abstract Submitted
this disclosure describes systems, methods, and devices related to testing an integrated circuit for defects. a method may include applying a nominal voltage to the integrated circuit for a first time period; applying a dynamic voltage greater than the nominal voltage to the integrated circuit for a second time period after the first time period; applying a static voltage greater than the dynamic voltage to the integrated circuit for a third time period after the second time period, wherein the static voltage is a target static voltage less than a target voltage; and applying the dynamic voltage to the integrated circuit during a fourth time period after the third time period.
