18593207. DISPLAY DEVICE COMPRISING DISPLAY MODULE, AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
DISPLAY DEVICE COMPRISING DISPLAY MODULE, AND METHOD FOR MANUFACTURING SAME
Organization Name
Inventor(s)
Seonghwan Shin of Suwon-si (KR)
DISPLAY DEVICE COMPRISING DISPLAY MODULE, AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18593207 titled 'DISPLAY DEVICE COMPRISING DISPLAY MODULE, AND METHOD FOR MANUFACTURING SAME
The patent application describes a display module with inorganic light-emitting devices mounted on a substrate, covered by a front cover and a metal plate at the rear.
- Substrate with mounting surface, side surface, and rear surface
- Front cover extending to outer area from mounting surface
- Metal plate on rear surface of substrate
- Side molding covering side surface below outer area from mounting surface
- Grounding member grounded to metal plate and adhered to lower surface of side molding
Potential Applications: - Display screens - Electronic billboards - Signage boards
Problems Solved: - Ensures proper grounding for electronic devices - Protects inorganic light-emitting devices from damage
Benefits: - Improved safety and functionality of display modules - Enhanced durability and longevity of electronic devices
Commercial Applications: - LED displays for advertising - Electronic scoreboards for sports events - Information boards for public transportation systems
Questions about the technology: 1. How does the side molding contribute to the overall functionality of the display module? 2. What are the advantages of having a metal plate positioned on the rear surface of the substrate?
Original Abstract Submitted
A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal plate positioned on the rear surface of the substrate; a side molding covering the side surface and positioned below the outer area from the mounting surface; and a grounding member grounded to the metal plate and adhered to a lower surface of the side molding, where the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.
