Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract
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WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME
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WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240204027 titled 'WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME
The inventive concept provides an image sensor with a unique wafer-to-wafer bonding structure and a step with a slope shape.
- Image sensor includes a first substrate with a pixel array, multilayer wiring, and insulation layer.
- Second substrate on the first substrate includes a logic circuit, multilayer wiring, insulation layer, and metal pad.
- Direct bonding between the first and second substrates is achieved through symmetrical slope-shaped steps.
Potential Applications: - High-resolution cameras - Medical imaging devices - Surveillance systems
Problems Solved: - Improved image sensor performance - Enhanced durability and reliability - Simplified manufacturing process
Benefits: - Higher quality images - Increased sensor longevity - Cost-effective production
Commercial Applications: Title: Advanced Image Sensors for Various Industries This technology can be utilized in the development of advanced imaging devices for a wide range of industries, including healthcare, security, and consumer electronics. The improved performance and durability of the image sensor make it a valuable component in various commercial applications.
Questions about Image Sensor Technology: 1. How does the unique wafer-to-wafer bonding structure improve the performance of the image sensor? The wafer-to-wafer bonding structure enhances the durability and reliability of the image sensor by providing a direct bond between the substrates, ensuring efficient signal transmission and reducing the risk of signal loss.
2. What are the potential challenges in implementing this innovative image sensor technology in commercial products? The main challenges in implementing this technology in commercial products may include scaling up production to meet market demand, ensuring compatibility with existing devices, and optimizing the manufacturing process for cost-effectiveness.
Original Abstract Submitted
the inventive concept provides an image sensor including a step having a slope shape and an image sensor including the wafer-to-wafer bonding structure. the image sensor includes a first substrate including a pixel array, a first multilayer wiring, a first insulation layer formed on a first junction surface to pass through the first insulation layer and a second substrate on the first substrate, wherein the second substrate includes a logic circuit, a second multilayer wiring, a second insulation layer on a second junction surface opposite to the first junction surface and a second metal pad passing through the second insulation layer, and a second step formed in the second junction surface engages with a first step formed in the first junction surface in a symmetrical slope shape to form direct bonding between the first substrate and the second substrate.
