Samsung electronics co., ltd. (20240203958). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
HYUNGGIL Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203958 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a lower substrate with contact and non-contact regions, a first upper substrate, a lower device, solder balls, capacitors, and support blocks.
- The package features a lower substrate with distinct contact and non-contact regions.
- A first upper substrate is positioned on top of the lower substrate.
- A lower device is mounted on the first upper substrate.
- First solder balls are used to connect the first upper substrate to the lower substrate's contact region.
- Capacitors are placed between the first upper substrate and the lower substrate's non-contact region.
- Support blocks are positioned between the capacitors and the lower substrate's non-contact region.
Potential Applications: - This semiconductor package design could be used in various electronic devices such as smartphones, laptops, and tablets. - It may find applications in automotive electronics, industrial machinery, and communication systems.
Problems Solved: - The design helps in improving the electrical connectivity and stability of the semiconductor package. - It provides a more efficient way to manage heat dissipation within the package.
Benefits: - Enhanced reliability and performance of electronic devices. - Improved thermal management leading to better overall functionality. - Simplified manufacturing process for semiconductor packages.
Commercial Applications: - The technology could be of interest to semiconductor manufacturers looking to enhance the performance of their products. - Companies in the consumer electronics industry could benefit from incorporating this design into their devices.
Questions about the technology: 1. How does the placement of capacitors in the non-contact region improve the overall performance of the semiconductor package? 2. What are the specific advantages of using support blocks in this semiconductor package design?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package includes a lower substrate that has a contact region and a non-contact region, a first upper substrate on the lower substrate, a lower device on the first upper substrate, a plurality of first solder balls between the first upper substrate and the lower substrate contact region, a plurality of capacitors between the first upper substrate and the lower substrate non-contact region, and a plurality of support blocks between the plurality of capacitors and the lower substrate non-contact region.
