Samsung electronics co., ltd. (20240203942). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Daeyoung Jung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203942 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip. Each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip, with a width smaller than that of the first semiconductor chip.
- The semiconductor package features multiple second semiconductor chips positioned on the sides of the first semiconductor chip, optimizing space utilization.
- The elongated shape of the second semiconductor chips allows for efficient placement and connection within the package.
- By reducing the width of the second semiconductor chips compared to the first semiconductor chip, the package can accommodate more components in a compact design.
- This innovation enables higher integration levels and improved performance in semiconductor devices.
- The design of the semiconductor package enhances overall functionality and reliability of electronic systems.
Potential Applications: - Consumer electronics - Automotive technology - Industrial automation - Telecommunications
Problems Solved: - Space constraints in semiconductor packaging - Enhanced integration of multiple semiconductor chips - Improved performance and reliability of electronic devices
Benefits: - Increased component density - Enhanced system performance - Compact and efficient design - Improved reliability and durability
Commercial Applications: The semiconductor package innovation can be utilized in various industries such as consumer electronics, automotive technology, industrial automation, and telecommunications. Its compact design and improved integration capabilities make it ideal for applications requiring high performance and reliability.
Questions about the technology: 1. How does the design of the semiconductor package optimize space utilization? 2. What are the potential benefits of using multiple second semiconductor chips in the package?
Frequently Updated Research: Ongoing research in semiconductor packaging focuses on further enhancing integration levels and performance efficiency. Stay updated on the latest advancements in the field to leverage cutting-edge technology for your applications.
Original Abstract Submitted
a semiconductor package includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip, each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip which is adjacent thereto, and a width of each of the second semiconductor chips is smaller than a width of the first semiconductor chip.
