Samsung electronics co., ltd. (20240203940). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seung Hyun Baik of Suwon-si (KR)
Won Hee Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203940 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a substrate with first and second semiconductor chip stacks stacked on it, along with a mold layer covering the stacks.
- The package includes a first semiconductor chip stack with multiple chips stacked on each other, a second semiconductor chip stack with multiple chips stacked on each other, and a first spacer with a coupling layer.
- The mold layer covers both the first and second semiconductor chip stacks and is in contact with the first spacer.
Potential Applications: - This technology could be used in various electronic devices such as smartphones, tablets, and laptops. - It could also find applications in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - This technology allows for compact stacking of multiple semiconductor chips, saving space in electronic devices. - The use of the mold layer provides protection to the chip stacks, increasing their durability.
Benefits: - Improved performance and functionality of electronic devices. - Enhanced reliability and longevity of semiconductor components.
Commercial Applications: - The technology could be valuable for semiconductor manufacturers looking to enhance the performance of their products. - It could also be attractive to electronics companies seeking to improve the efficiency of their devices.
Questions about the technology: 1. How does the coupling layer in the first spacer contribute to the overall functionality of the semiconductor package? 2. What are the specific advantages of having multiple semiconductor chip stacks in a single package?
Original Abstract Submitted
a semiconductor package includes: a substrate extending in first and second directions that intersect each other; a first semiconductor chip stack disposed on the substrate and including a plurality of first semiconductor chips stacked on each other, a second semiconductor chip stack disposed on the substrate, and spaced apart from the first semiconductor chip stack in the first direction, wherein the second semiconductor chip stack includes a plurality of second semiconductor chips stacked on each other, a first spacer disposed on the first semiconductor chip stack and including a coupling layer; and a mold layer covering the first and second semiconductor chip stacks and in contact with the first spacer.
