Samsung electronics co., ltd. (20240203903). SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Youngwoo Park of Suwon-Si (KR)
SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203903 titled 'SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME
The abstract describes semiconductor packages and methods of fabricating them, involving the formation of a semiconductor chip, an electromagnetic shield covering the chip, and a molding covering the shield, with the shield electrically connected to a conductor on the chip's side.
- Formation of a semiconductor chip
- Creation of an electromagnetic shield to cover the chip
- Application of a molding to cover the shield
- Electrical connection of the shield to a conductor on the chip's side
- Enhancing electromagnetic shielding capabilities of the semiconductor package
Potential Applications: - Electronic devices requiring enhanced electromagnetic shielding - Aerospace and defense applications - Automotive electronics
Problems Solved: - Improved protection against electromagnetic interference - Enhanced reliability of semiconductor devices
Benefits: - Increased performance and reliability of electronic devices - Enhanced protection against external electromagnetic interference
Commercial Applications: Title: "Advanced Semiconductor Packages for Enhanced Electromagnetic Shielding" This technology can be utilized in various industries such as aerospace, defense, automotive, and consumer electronics for improved electromagnetic shielding capabilities, leading to more reliable and high-performance electronic devices.
Questions about Semiconductor Packages with Enhanced Electromagnetic Shielding: 1. How does the electromagnetic shield improve the reliability of semiconductor devices? 2. What are the potential commercial applications of this technology in the aerospace industry?
Original Abstract Submitted
disclosed are semiconductor packages and methods of fabricating the same. the method inluces forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. the electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.
