Samsung electronics co., ltd. (20240203888). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Hyunsu Hwang of Siheung-si (KR)
Junyun Kweon of Cheonan-si (KR)
Jumyong Park of Cheonan-si (KR)
Ju-il Choi of Seongnam-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203888 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
The semiconductor package described in the patent application includes a redistribution substrate with redistribution line patterns in a dielectric layer, along with a semiconductor chip mounted on the substrate. The redistribution line patterns are electrically connected to chip pads on the semiconductor chip, with a planar top surface and a nonplanar bottom surface. These line patterns vary in thickness, with a minimum thickness at the central portion and a maximum thickness at the edge portions.
- Redistribution substrate with redistribution line patterns in a dielectric layer
- Semiconductor chip mounted on the redistribution substrate
- Chip pads electrically connected to the redistribution line patterns
- Redistribution line patterns with planar top surface and nonplanar bottom surface
- Variation in thickness of the redistribution line patterns from central portion to edge portions
Potential Applications: - Advanced semiconductor packaging technology - High-performance electronic devices - Miniaturized and efficient electronic components
Problems Solved: - Improved electrical connectivity in semiconductor packages - Enhanced performance and reliability of electronic devices
Benefits: - Higher efficiency in electronic components - Increased reliability and durability of semiconductor packages - Potential for miniaturization and cost-effectiveness in electronic manufacturing
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronic Devices This technology can be utilized in various industries such as telecommunications, consumer electronics, automotive, and aerospace for the development of high-performance electronic devices with improved reliability and efficiency.
Prior Art: Readers can explore prior research on semiconductor packaging technologies, redistribution substrates, and chip mounting methods to gain a deeper understanding of the advancements made in this field.
Frequently Updated Research: Researchers are continuously exploring new materials and processes to further enhance the performance and reliability of semiconductor packages. Stay updated on the latest developments in semiconductor packaging technology for potential future applications.
Questions about Semiconductor Packaging Technology: 1. How does the variation in thickness of redistribution line patterns impact the performance of semiconductor packages? 2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production?
Original Abstract Submitted
disclosed are semiconductor packages and methods of fabricating the same. the semiconductor package includes a redistribution substrate including redistribution line patterns in a dielectric layer, and a semiconductor chip on the redistribution substrate. the semiconductor chip includes chip pads electrically connected to the redistribution line patterns. each of the redistribution line patterns has a substantially planar top surface and a nonplanar bottom surface. each of the redistribution line patterns includes a central portion and edge portions on opposite sides of the central portion. each of the redistribution line patterns has a first thickness as a minimum thickness at the central portion and a second thickness as a maximum thickness at the edge portions.
